The present invention relates to a method for encapsulating a nanostructure, the method comprising the steps of: providing a substrate; forming a plug composed of plug material at said substrate; forming a nanostructure (on or) at said plug; forming a shell composed of at least one shell material on external surfaces of the nanostructure, with the at least one shell material covering said nanostructure and at least some of the plug material, whereby the shell and the plug encapsulate the nanostructure. The invention further relates to a coated nanostructure and to the use of a coated nanostructure.

A manufacturing method of a wire grid polarizer is provided, including: setting pattern data, where the pattern data correspond to a wire grid structure of the wire grid polarizer; preparing a metal ion solution; immersing at least one surface of a carrier substrate in the metal ion solution; and emitting, by an emitter device, an electron beam to the carrier substrate, and controlling a movement of the electron beam according to the pattern data to deposit a metal on the carrier substrate at a position where the electron beam passes, to form the wire grid structure.

Methods for forming a porous coating with a controlled porosity and pore size are described. The methods include mixing a first powder comprising a first material with a second powder comprising a second material to form a mixed powder comprising 30-99 vol. % of the first powder and 1-70 vol. % of the second powder. The methods further include performing cold spray coating to deposit a coating comprising the first material and the second material onto an article, wherein the coating comprises approximately 30-99 vol. % of the first material and 1-70 vol. % of the second material. The methods further include performing a post-coating process to remove the second material from the coating, wherein after the post-coating process the coating consists essentially of the first material and has a porosity that is approximately equivalent to a volume occupied by the second material prior to the post-coating process.

Methods for forming a porous coating with a controlled porosity and pore size are described. The methods include mixing a first powder comprising a first material with a second powder comprising a second material to form a mixed powder comprising 30-99 vol. % of the first powder and 1-70 vol. % of the second powder. The methods further include performing cold spray coating to deposit a coating comprising the first material and the second material onto an article, wherein the coating comprises approximately 30-99 vol. % of the first material and 1-70 vol. % of the second material. The methods further include performing a post-coating process to remove the second material from the coating, wherein after the post-coating process the coating consists essentially of the first material and has a porosity that is approximately equivalent to a volume occupied by the second material prior to the post-coating process.

A ceramic electronic component including a ceramic element assembly, an external electrode, and an underlying layer. In this ceramic electronic component, the underlying layer is formed on the ceramic element assembly, the external electrode is formed on the underlying layer, the underlying layer is formed of a metal material and a glass material containing a silicon atom, and the metal material exists in a highly dispersed state in the glass material.

A ceramic electronic component including a ceramic element assembly, an external electrode, and an underlying layer. In this ceramic electronic component, the underlying layer is formed on the ceramic element assembly, the external electrode is formed on the underlying layer, the underlying layer is formed of a metal material and a glass material containing a silicon atom, and the metal material exists in a highly dispersed state in the glass material.

A conductive structure is provided. The conductive ink composition includes a silver complex formed by mixing a silver carboxylate, at least one dissolving agent that dissolves the silver carboxylate, and a catalyst. The catalyst includes an amine that decarboxylates the silver carboxylate to make the conductive ink composition. The catalyst decarboxylates the silver carboxylate at a temperature of 100 C. or less. An ink composition comprising a metallic salt with a sterically bulky counter ion and a ligand is also provided. An ink composition for milking a conductive structure, comprising a reducible metal complex formed by mixing: a reducing agent, wherein the reducing agent is dissolved in a dissolving agent; and at least one metal salt or metal complex comprising a Group 4, 5, 6, 7, 8, 9, 10, 11, or 12 metal, wherein the reducing agent reduces the metal to form the conductive structures farther provided.

A conductive structure is provided. The conductive ink composition includes a silver complex formed by mixing a silver carboxylate, at least one dissolving agent that dissolves the silver carboxylate, and a catalyst. The catalyst includes an amine that decarboxylates the silver carboxylate to make the conductive ink composition. The catalyst decarboxylates the silver carboxylate at a temperature of 100 C. or less. An ink composition comprising a metallic salt with a sterically bulky counter ion and a ligand is also provided. An ink composition for milking a conductive structure, comprising a reducible metal complex formed by mixing: a reducing agent, wherein the reducing agent is dissolved in a dissolving agent; and at least one metal salt or metal complex comprising a Group 4, 5, 6, 7, 8, 9, 10, 11, or 12 metal, wherein the reducing agent reduces the metal to form the conductive structures farther provided.

A process of forming a mixed metal oxide solid is provided. The process includes the steps of obtaining a precursor composition comprising at least two metal or metalloid-containing compounds, the metal or metalloid of the at least two compounds being different, one from the other; and allowing the at least two metal or metalloid-containing compounds of the precursor composition to at least partially react by hydrolysis and/or condensation. The at least two metal or metalloid-containing compounds may have different points of zero charge (PZC). Further material or articles comprising a substrate or material coated with or otherwise in physical connection to the mixed metal oxide solid formed according to the process are also provided.

A process of forming a mixed metal oxide solid is provided. The process includes the steps of obtaining a precursor composition comprising at least two metal or metalloid-containing compounds, the metal or metalloid of the at least two compounds being different, one from the other; and allowing the at least two metal or metalloid-containing compounds of the precursor composition to at least partially react by hydrolysis and/or condensation. The at least two metal or metalloid-containing compounds may have different points of zero charge (PZC). Further material or articles comprising a substrate or material coated with or otherwise in physical connection to the mixed metal oxide solid formed according to the process are also provided.