Apparatus and methods for electroless surface finishing on glass. A planarization process is performed on buildup dielectric and/or solder resist to create a flatter, more planar, upper surface for a substrate having a glass layer. Planarity is characterized by having surface variations of less than about 5 microns, as measured by recesses and/or protrusions. The planar surface enables finishing the substrate surface with an electroless NiPdAu process.

Apparatus and methods for electroless surface finishing on glass. A planarization process is performed on buildup dielectric and/or solder resist to create a flatter, more planar, upper surface for a substrate having a glass layer. Planarity is characterized by having surface variations of less than about 5 microns, as measured by recesses and/or protrusions. The planar surface enables finishing the substrate surface with an electroless NiPdAu process.

A wiring board according to the present disclosure includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring, in which the metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.

There is provided a metal plate coated stainless material (100) which includes a stainless steel sheet (10) having formed thereon a passivation film (11) having a Cr/O value in the range of 0.05 to 0.2 and a Cr/Fe value in the range of 0.5 to 0.8 at the surface as measured by an Auger electron spectroscopy analysis and a metal plated layer (20) formed on the passivation film (11) of the stainless steel sheet (10), in which the metal plated layer (20) is a plated layer formed from any one metal selected from among Ag, Pd, Pt, Rh, Ru, Cu, Sn and Cr, or an alloy of these metals.

There is provided a metal plate coated stainless material (100) which includes a stainless steel sheet (10) having formed thereon a passivation film (11) having a Cr/O value in the range of 0.05 to 0.2 and a Cr/Fe value in the range of 0.5 to 0.8 at the surface as measured by an Auger electron spectroscopy analysis and a metal plated layer (20) formed on the passivation film (11) of the stainless steel sheet (10), in which the metal plated layer (20) is a plated layer formed from any one metal selected from among Ag, Pd, Pt, Rh, Ru, Cu, Sn and Cr, or an alloy of these metals.

There is provided a method for producing a metal-plated stainless material, the method including performing an acid treatment of treating a stainless steel material with an acidic solution; performing an etching of treating the stainless steel material after the acid treatment with an etching treatment agent; and a modifying the surface of the stainless steel material after the etching into a state suitable for a metal plating process.

A method is provided, including the following operations: performing a deposition process on a substrate, the deposition process configured to deposit a ruthenium layer in a feature on the substrate, the ruthenium layer being doped with zinc at an atomic percentage less than approximately 30 percent; after depositing the ruthenium layer, annealing the substrate, wherein the annealing is configured to cause migration of the zinc to an interface of the ruthenium layer and an oxide layer of the substrate, the migration of the zinc producing an adhesive barrier at the interface that inhibits electromigration of the ruthenium layer.

The present invention relates to a process for obtaining a multilayer composition, to a composition obtainable via such method and to an article comprising said composition. The process comprises at least the following: i. providing a polymeric layer (L1) comprising an aromatic polymer selected from the group consisting of poly(aryl ether sulfone) polymer (P1) and a polyarylene sulphide (P2), and having at least one surface (S1); ii. treating at least the surface (S1) of (L1) with a radio-frequency glow N discharge process in the presence of an etching gas medium comprising a nitrogen-containing gas to obtained an etched surface (52); iii. optionally, contacting the etched surface (S2) obtained in step ii. with a composition (LC3) comprising a surfactant to obtain at least a pre-treated surface (S2a); iv. contacting the etched surface (S2) obtained in step ii. or the pre-treated surface (S2a) obtained in step iii. with a liquid composition (LC1) comprising at least a metal (MC) in ionic form and having a pH not less than 9.0, so as to provide an article having at least one surface (S-3) treated with a composition containing metal (MC) in ionic form; v. reducing metal (MC) in ionic form on (S-3) to its metallic form by contacting (S-3) with a liquid composition (LC2) containing a reducing agent; vi. forming by electroless deposition a layer (L2) onto the at least one treated surface obtained in step v., said layer (L2) comprising at least one metal compound (M1) and metal (MC) in ionic form; vii. applying an additional layer (L3) comprising a metal (M2), equal to or different from (M1), directly on layer (L2); and, optionally, viii. applying an additional layer (L4) of a metal (M2) on (L3).

A conductive nanowire film having a high aspect-ratio metal is described. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.

A conductive nanowire film having a high aspect-ratio metal is described. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.