Metal nanowire thin-films
10237974 ยท 2019-03-19
Assignee
Inventors
Cpc classification
H05K3/105
ELECTRICITY
H01L29/786
ELECTRICITY
H05K1/0274
ELECTRICITY
C23C18/166
CHEMISTRY; METALLURGY
Y10T428/24917
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H05K2201/10121
ELECTRICITY
H05K2203/013
ELECTRICITY
H05K1/09
ELECTRICITY
C23C18/143
CHEMISTRY; METALLURGY
International classification
B32B3/00
PERFORMING OPERATIONS; TRANSPORTING
H05K1/09
ELECTRICITY
C23C18/14
CHEMISTRY; METALLURGY
H01L29/786
ELECTRICITY
C23C18/16
CHEMISTRY; METALLURGY
H05K3/10
ELECTRICITY
Abstract
A conductive nanowire film having a high aspect-ratio metal is described. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.
Claims
1. A film comprising a plurality of nanowire bundles, each nanowire bundle comprising a plurality of conductive metal nanowires, the plurality of conductive metal nanowires comprising conductive metal nanowires having cross-sectional diameters between 3 and 5 nm and aspect-ratios of more than 500, wherein the conductive nanowires being a composite of 85-90% gold and 10-15% silver.
2. The film according to claim 1, wherein said aspect-ratio is greater than 1,000.
3. The film according to claim 1 comprising at least one surfactant.
4. The film according to claim 1, formed on a substrate.
5. The film according to claim 1, wherein the nanowires are distributed in a film of at least one surfactant.
6. A device comprising a film according to claim 1.
7. The device according to claim 6 being selected from an electrode structure, being optionally configured as a photocathode, a photocathode structure having an optically transparent substrate carrying said film, an optically transparent electrode, an electronic device having an electrodes' assembly, a transistor device wherein at least one of source, drain and gate electrodes comprises said film, a transistor device comprising a gate on an insulator structure comprising an electrically insulating substrate carrying said film, and an electroluminescent screen device comprising a luminescent substrate structure carrying said film.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) In order to understand the invention and to see how it may be carried out in practice, embodiments will now be described, by way of non-limiting example only, with reference to the accompanying drawings, in which:
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
DETAILED DESCRIPTION OF EMBODIMENTS
General Experimental Procedures
(10) The preparation of a high aspect-ratio metal nanowire mesh films with high conductivity, flexibility and transparency was based on an in-situ formation of the nanowires which occurred after the deposition of a thin film of precursor solution on top of a substrate of choice.
(11) Gold-silver nanowires were grown in a drying thin film containing a high cationic surfactant concentration which formed a liquid-crystalline template phase for the formation of a nanowire network. The nanowire network films were uniform over macroscopic (cm.sup.2 scale) areas and on a variety of substrates. These films, measuring only few nanometers in thickness were characterized by low sheet resistivities, in the range of 60-300 /sq, as formed, and a high transparency, comparable to indium tin oxide (ITO) films.
(12) One process for the preparation of the metal nanowire mesh films begins with the preparation of a relatively concentrated surfactant solution having at least 5%, or at least 7.5%, or from 5% to 30%, or from 5% to 21%, or from 7.5% to 21% (w/w) of a surfactant such as cetyltrimethylammonium bromide (CTAB) in ultrapure water. The formerly published process [9, 10] had only 1.6% CTAB. Such high concentrations require heating of the solution so as to produce a uniform micro-emulsion phase of the surfactant/water mixture.
(13) A solution of chloroauric acid was added to this emulsion to yield a final Au precursor concentration of between 1 and 4 mM and a higher concentration of sodium ascorbate was added at a concentration of 40 to 60 times higher than the gold concentration. The initiation of the metal deposition process occurred by adding a concentrated AgNO.sub.3 solution to the prepared solution at 30-40 C., while stirring, to a final silver concentration 2 times higher than that of the gold. The silver ions added were being reduced by the ascorbate ions and when small silver metal seeds formed, the reduction of gold ions by the ascorbate was catalyzed and the metal nanostructures began growing. Immediately after silver addition a thin-film of the solution was spread on the substrate of choice either by drop casting, dip-coating or spin-coating. The thickness of such a film depended on the viscosity (determined by surfactant concentration and temperature) and the spread conditions and was measured to be between 10 and 100 m. Next, the film was dried, in some cases by placing the substrate under mild heating by a lamp at 35-40 C. until the film fully dried, after about 10 minutes.
(14) For microscopy studies of the dried films, most of the surfactant was washed out with various solvents. For conductance measurements, a quick ethanol wash was sufficient to allow for good electrical contact, either to pre-fabricated electrodes patterned on the substrate or to electrodes patterned post-film-deposition, either by metal evaporation or by spreading silver paint on the film.
(15) In another process according to the invention, the aqueous solution was first formed by preparing a relatively concentrated surfactant solution having at least 5%, or at least 7.5%, or from 5% to 30%, or from 5% to 21%, or from 7.5% to 21% (w/w) of a surfactant such as cetyltrimethylammonium bromide (CTAB) in ultrapure water. A solution of chloroauric acid was added to this emulsion together with a concentrated AgNO.sub.3 solution, while stirring, to a final silver concentration 2 times higher than that of the gold. After a few minutes, a solution of sodium borohydride was added followed by a solution of sodium ascorbate. The silver and gold ions in the presence of the strongly reducing agent began undergoing reduction, forming silver/gold metal seeds, the reduction of gold and silver ions by the ascorbate was catalyzed and the metal nanostructures began growing.
Example 1
(16) A 8.3% (w/w) cetyltrimethylammonium bromide (CTAB) solution was prepared by heating and stirring the CTAB/water mixture at 50 C. for 5 minutes. To this solution, at 40 C., 500 L of 25 mM HAuCl.sub.4 solution and 425 L of 1.8 M freshly prepared sodium ascorbate solution were added and stirred together. Then, 250 L of 100 mM AgNO.sub.3 solution were added while stirring. The final CTAB concentration in the nanowire growth solution was 7.5%. 30 seconds after the addition of the Ag solution, the stirring was discontinued and the solution was deposited on a substrate and let dry for 15-45 minutes at 35-40 C.
(17) Transmission electron microscopy (TEM) and scanning electron microscopy (SEM) imaging revealed metal nanowire networks of varying wire densities and entanglement, depending on the exact solution and deposition conditions, uniformly spread over the substrates (See,
(18) Nanowire films were obtained from solutions that had up to 21% CTAB concentrations, 5 mM HAuCl.sub.4, 0.2M sodium ascorbate and 10 mM AgNO.sub.3. These concentrated CTAB solutions were highly viscous and required longer mixing and heating times to prepare homogeneous solution thereof. With such growth solutions it was easy to coat the substrates by simple dip-coating.
(19) The composition of the substrate did not influence the final results since the high surfactant concentration ensured proper wetting of either hydrophobic or hydrophilic surfaces. So far, the process produced similar results on silicon, fused silica, polycarbonate and carbon substrates. Differences between various substrates were mostly due to edge effects of the drying film which were more substantial in cases of small substrates such as TEM grids. The high level of uniformity and thus nanowire percolation, as seen in
(20) Electrical measurements, done on several length scales at various arbitrary positions on the substrates using various types of contacts have shown ohmic conductance of the order of 100-500 /sq and 75-85% transmittance in the visible range (
(21) Contrary to the metal nanowire films prepared by the processes of the invention, films prepared by the methods of the art, particularly those described in references [9 and 10] do not result in the formation of mesh film arrangements of the type observed in
Example 2
(22) A solution comprising surfactant cetyltrimethylammonium bromide (CTAB), chloroauric acid, as a gold precursor at a molar ratio of 1:200 relative to the CTAB concentration, and sodium ascorbate, at a molar ratio of 60:1 relative to the gold concentration, was prepared. The nanowire growth solutions had CTAB concentrations of 0.25 M and 0.6 M, significantly higher than the 0.1 M used by Murphy [12]. In addition, the growth solution contained a relatively high concentration of silver nitrate, twice the concentration of the Au(III) ions. When the four components were mixed together at 35 C. the gold ions were reduced to the colorless Au(I) state, forming a [AuX.sub.2].sup.-CTA.sup.+ complex (XCl, Br) but further reduction to the metallic state required the addition of catalytic metal seed particles. Similarly, the silver ions formed an AgBr-CTAB complex.
(23) As an alternative, a small amount of sodium borohydride dissolved in water (e.g., 0.001-0.0001%) was added to the precursor solution in order to initiate metal reduction in this solution. The borohydride amount was enough to reduce up to 0.02% of the metal ions to form small metallic seed particles which catalyzed the reduction of the rest of the metal ions by the ascorbate. Immediately after the borohydride addition, the solution was deposited as a thin film, 100 m thick, on the substrate of choice that was kept at 35 C. and a relative humidity of 50% for drying. The viscosity of the deposited solution at 35 C. was 2 cP for the 0.25 M CTAB solution and 100 cP for the 0.6 M CTAB solution.
(24)
(25) A closer inspection of a sample with high surfactant concentration (0.6 M) and relatively low silver concentration (4 mM, relative to the usual 6 mM) revealed regions with discontinuous, segmented nanowires (inset of
(26) The processes of the invention may be performed using various different substrates such as silicon, quartz and polyethylene terphtalate (PET).
(27) Conductance measurements of the nanowire films were performed on various length scales. For example,
(28) In addition, the films were deposited over Si wafers with a 100 nm thick oxide layer and gold electrodes patterned on top with inter-electrode 2-20 m gaps (
(29) Furthermore, the nanowire films were deposited on a 1 cm.sup.2 fused silica substrates (also from 0.6 M CTAB), silver paint was applied in two parallel lines at the edges of the substrate and sheet resistances of the order of 100 /sq were measured after mild ethanol washing. In particular, the high flexibility of the film was demonstrated (
(30)
(31) The optical extinction of the films was measured using a standard spectrophotometer. A transmission curve for a film with relatively high transparency and sheet resistance of 200 /sq is presented in
Example 3
(32) As recited above, in some experiments, prior to the addition of the reducing agent (e.g., sodium ascorbate) to the Au precursor solution, the silver solution was added to the Au precursor solution and only then the mild reducing agent e.g., sodium ascorbate was added. Under such conditions no metal reduction was induced. Subsequently, low concentration (e.g., 1/100 of that of the sodium ascorbate or lower) of a stronger reducing agent with respect to ascorbate was added to the solution. Such stronger reducing agent should have a reduction potential (E.sup.0) of 0.5 V or more negative. Non-limiting examples are sodium borohydride, sodium cyanoborohydride and hydrazine. The addition of the strong reducing agent initiated metal reduction in this solution and subsequent metal deposition on the substrate.