This chemical conversion-treated steel sheet (10) has a chemical conversion treatment coating (12) upon a plating layer (17) of a steel sheet (11). The chemical conversion treatment coating (12) contains a fluororesin, a base resin which is a resin other than a fluororesin, metal flakes (13), and a chemical conversion treatment component. The content of the fluororesin in relation to the total quantity of resins is 3.0 mass % or more in terms of fluorine atoms, the content of the base resin in relation to 100 parts by mass of the fluororesin is 10 parts by mass or more, and the content of metal flakes (13) in the chemical conversion treatment coating (12) is more than 20 mass % but at most 60 mass %.

A tin-based solder melt or aqueous tin plating bath composition comprising a source of tin and a stabilizing additive of chemical structure: ##STR00001##
wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8, R.sup.9, and R.sup.10 are independently selected from hydrogen atom, hydrocarbon groups R having at least one and up to twelve carbon atoms, groups OR wherein R is selected from hydrogen atom and hydrocarbon groups R, and halogen atoms, and wherein any two, three, or four of R.sup.1, R.sup.2, R.sup.3, R.sup.4, and R.sup.5 or any two, three, or four of R.sup.6, R.sup.7, R.sup.8, R.sup.9, and R.sup.10 are optionally interconnected to form a fused ring system; R.sup.11 and R.sup.12 are independently selected from hydrogen atom and hydrocarbon groups R; and r is either 0 or 1. Methods for coating and/or bonding metal substrates by use of the above-described solder compositions are also described.

A tin-based solder melt or aqueous tin plating bath composition comprising a source of tin and a stabilizing additive of chemical structure: ##STR00001##
wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8, R.sup.9, and R.sup.10 are independently selected from hydrogen atom, hydrocarbon groups R having at least one and up to twelve carbon atoms, groups OR wherein R is selected from hydrogen atom and hydrocarbon groups R, and halogen atoms, and wherein any two, three, or four of R.sup.1, R.sup.2, R.sup.3, R.sup.4, and R.sup.5 or any two, three, or four of R.sup.6, R.sup.7, R.sup.8, R.sup.9, and R.sup.10 are optionally interconnected to form a fused ring system; R.sup.11 and R.sup.12 are independently selected from hydrogen atom and hydrocarbon groups R; and r is either 0 or 1. Methods for coating and/or bonding metal substrates by use of the above-described solder compositions are also described.

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

Coatings for magnetic materials, such as rare earth magnets, are described. The coatings are designed to reduce or prevent the release of one or both of nickel and cobalt from the coatings or from the underlying magnetic material. The coatings are designed to resist corrosion and release of nickel and cobalt when exposed to moist conditions. The coatings are also designed to be robust enough to withstand damage due to scratch forces. In some embodiments, the coatings include multiple layers of one or of metal and non-metal materials. The coated magnets are well suited for use in the manufacture of wearable consumer products.

Coatings for magnetic materials, such as rare earth magnets, are described. The coatings are designed to reduce or prevent the release of one or both of nickel and cobalt from the coatings or from the underlying magnetic material. The coatings are designed to resist corrosion and release of nickel and cobalt when exposed to moist conditions. The coatings are also designed to be robust enough to withstand damage due to scratch forces. In some embodiments, the coatings include multiple layers of one or of metal and non-metal materials. The coated magnets are well suited for use in the manufacture of wearable consumer products.

Aqueous catalysts of nanoparticles of precious metals and stabilizers of flavonoid derivatives are used to electrolessly plate metal on non-conductive substrates. Such substrates include printed circuit boards.

A conductive nanowire film based on a high aspect-ratio metal is disclosed. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.

A conductive nanowire film based on a high aspect-ratio metal is disclosed. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.

Pyrimidine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal plating on metal clad and un-clad substrates. The catalysts are monomers and free of tin and antioxidants.