The present invention relates to metal plating solution comprising at least one source of metal ions and detonation nanodiamonds, wherein the detonation nanodiamonds are substantially free of negatively charged functionalities, and to a method for producing the solution. The present invention further relates to metal plating method and to a metallic coating comprising metal and detonation nanodiamonds substantially free of negatively charged functionalities.

The present invention pertains to a process for packaging one or more products, said process comprising the following steps: (i) providing a package having an opening, said package comprising at least one sheet, said sheet comprising the following layers: a layer [layer (L1)] consisting of a composition [composition (C1)] comprising, preferably consisting of, at least one thermoplastic polymer [polymer (T1)], said layer (L1) having two opposite surfaces, wherein one surface comprises one or more grafted functional groups [surface (L1-S1-f)], directly adhered to the surface (L1-S1-f), a layer [layer (L2)] consisting of at least one metal compound [compound (M1)], and optionally, directly adhered to the layer (L2), a layer (L3) consisting of a composition [composition (C3)] comprising, preferably consisting of at least one thermoplastic polymer [polymer (T2)], said polymer (T2) being equal to or different from the polymer (T1); (ii) feeding the package provided in step (i) with one or more products; and (iii) sealing the package provided in step (ii). The present invention also pertains to said package, to a process for the manufacture of said package and to uses of said package in various applications.

The present invention pertains to a process for packaging one or more products, said process comprising the following steps: (i) providing a package having an opening, said package comprising at least one sheet, said sheet comprising the following layers: a layer [layer (L1)] consisting of a composition [composition (C1)] comprising, preferably consisting of, at least one thermoplastic polymer [polymer (T1)], said layer (L1) having two opposite surfaces, wherein one surface comprises one or more grafted functional groups [surface (L1-S1-f)], directly adhered to the surface (L1-S1-f), a layer [layer (L2)] consisting of at least one metal compound [compound (M1)], and optionally, directly adhered to the layer (L2), a layer (L3) consisting of a composition [composition (C3)] comprising, preferably consisting of at least one thermoplastic polymer [polymer (T2)], said polymer (T2) being equal to or different from the polymer (T1); (ii) feeding the package provided in step (i) with one or more products; and (iii) sealing the package provided in step (ii). The present invention also pertains to said package, to a process for the manufacture of said package and to uses of said package in various applications.

Provides a flexible copper clad laminate, which includes a polyimide substrate; a nickel-copper alloy layer; and a copper layer. The nickel-copper alloy layer is formed on at least one side of the polyimide substrate by electroless plating and comprises at least nickel, copper and phosphorus. A content of the copper is more than 30 wt % of the nickel-copper alloy layer, a content of the phosphorus is less than 5 wt % of the nickel-copper alloy layer, and a corrosion potential of the nickel-copper alloy layer in a 0.02 vol % sulfuric acid solution is greater than 20 mV. The copper layer is formed on a side of the nickel-copper alloy layer away from the polyimide substrate and combined with the nickel-copper alloy layer to form a metal conductive layer. In addition, the aforementioned flexible copper clad laminate has electrochemical corrosion resistance and sufficient peel strength, facilitating the production of flexible printed circuit boards.

Provides a flexible copper clad laminate, which includes a polyimide substrate; a nickel-copper alloy layer; and a copper layer. The nickel-copper alloy layer is formed on at least one side of the polyimide substrate by electroless plating and comprises at least nickel, copper and phosphorus. A content of the copper is more than 30 wt % of the nickel-copper alloy layer, a content of the phosphorus is less than 5 wt % of the nickel-copper alloy layer, and a corrosion potential of the nickel-copper alloy layer in a 0.02 vol % sulfuric acid solution is greater than 20 mV. The copper layer is formed on a side of the nickel-copper alloy layer away from the polyimide substrate and combined with the nickel-copper alloy layer to form a metal conductive layer. In addition, the aforementioned flexible copper clad laminate has electrochemical corrosion resistance and sufficient peel strength, facilitating the production of flexible printed circuit boards.

There is provided an object, wherein there are particles on the surface of the object, wherein the amount of particles is in the interval 0.041-6 g/cm.sup.2, wherein the particles comprise palladium in an amount corresponding to 0.02-2 g/cm.sup.2, neodymium in an amount corresponding to 0.001-2 g/cm.sup.2, and gold in an amount corresponding to 0.02-2 g/cm.sup.2, and wherein the particles comprise less than 30 ppm silver, which is considered as silver free. The coating is both biocompatible and antimicrobial and does not suffer from disadvantages associated with silver since the coating is silver free. The coating shows improved action against thrombosis.

A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A Ni content in the electroless copper plating layer is 0.01 to 1.2 wt %, and the electroless copper plating layer has a volume resistivity of 6.0 .Math.cm or lower. The copper clad laminate is capable of achieving a good volume resistivity at an electroless copper plating layer of a low dielectric resin film while suppressing a transmission loss when being applied to a flexible circuit board.

A semiconductor package includes a wiring board and a semiconductor element mounted on the wiring board. The wiring board includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring. The metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.

A copper clad laminate is provided that is capable of achieving a good volume resistivity at an electroless copper plating layer of a low dielectric resin film while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate. The copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHZ, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. An Ni content in the electroless copper plating layer is 0.01 to 1.2 wt %, and the electroless copper plating layer has a volume resistivity of 6.0 .Math.cm or lower.

The invention relates to metallic substrates surface coated with a coating layer comprising a metal and an additive.