A method for manufacturing a wiring board according to the present disclosure includes: in the following order, (a) a step of irradiating an insulating layer composed of a resin composition with active energy rays; (b) a step of adsorbing an electroless plating catalyst to the insulating layer; and (c) a step of forming a metal layer on a surface of the insulating layer by electroless plating, in which in the step (a), a modified region having a thickness of 20 nm or more in a depth direction from the surface of the insulating layer and voids communicating from the surface of the insulating layer is formed by irradiation of the active energy rays.

A wiring board according to the present disclosure includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring, in which the metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.

A substrate liquid processing apparatus configured to supply a plating liquid to a substrate includes a substrate holder configured to hold the substrate; a plating liquid sending device configured to send the plating liquid to a first flow path; a temperature controller connected to the plating liquid sending device via the first flow path and configured to control a temperature of a fluid supplied through the first flow path; an extrusion fluid sending device configured to send an extrusion fluid different from the plating liquid to the first flow path; and a discharge device connected to the temperature controller and configured to discharge a fluid supplied from the temperature controller.

An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, including copper ions; a reducing agent; a complexing agent for copper ions; wherein the bath further includes at least one compound according to formula (1):

##STR00001## in which Z.sup.1 and Z.sup.2 are independently selected from the group consisting of hydrogen; carboxylic acid; carboxylate; sulfonic acid; sulfonate; carboxamide; nitrile; nitro; trialkylammonium; 2-carboxyvinyl; 2-vinylcarboxylate; 2-(trialkylammonium)vinyl; hydroxamic acid; and oxime; provided at least one of Z.sup.1 and Z.sup.2 is not hydrogen; and in which R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are: i. R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are hydrogen; or ii. R.sup.1 with R.sup.2 form together an aromatic ring, R.sup.3 and R.sup.4 are hydrogen; or iii. R.sup.3 with R.sup.4 form together an aromatic ring, R.sup.1 and R.sup.2 are hydrogen; or iv. both R.sup.1 with R.sup.2 and R.sup.3 with R.sup.4 form together an aromatic ring, respectively.

An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, including copper ions; a reducing agent; a complexing agent for copper ions; wherein the bath further includes at least one compound according to formula (1):

##STR00001## in which Z.sup.1 and Z.sup.2 are independently selected from the group consisting of hydrogen; carboxylic acid; carboxylate; sulfonic acid; sulfonate; carboxamide; nitrile; nitro; trialkylammonium; 2-carboxyvinyl; 2-vinylcarboxylate; 2-(trialkylammonium)vinyl; hydroxamic acid; and oxime; provided at least one of Z.sup.1 and Z.sup.2 is not hydrogen; and in which R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are: i. R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are hydrogen; or ii. R.sup.1 with R.sup.2 form together an aromatic ring, R.sup.3 and R.sup.4 are hydrogen; or iii. R.sup.3 with R.sup.4 form together an aromatic ring, R.sup.1 and R.sup.2 are hydrogen; or iv. both R.sup.1 with R.sup.2 and R.sup.3 with R.sup.4 form together an aromatic ring, respectively.

Method of forming a metallic plating (9) on a substrate (1), comprising the steps of: —providing a substrate (1) comprising a hydrocarbon-based polymer containing C—C and either or both of C—H and N—H bonds; —covalently bonding an azide-containing primer compound (3) to said substrate (1) by C—H and/or N—H insertion, said primer compound (3) comprising molecules each having at plurality of C—H and/or C—N insertion sites; —in the absence of in-situ polymerisation, covalently bonding a pre-synthesised chelating polymer (5) to said primer compound (3) by C—H and/or N—H insertion, said chelating polymer (5) being capable of forming ligand bonds with metal atoms or ions; —dispersing a plating catalyst (7) in said pre-synthesised polymer (5); —forming said metallic plating (9) on said pre-synthesised polymer (5) by means of electroless plating or electroplating

A multifunctional coating method involves cleaning a surface, applying a layer of corrosion-resistant alloy coating to the surface, and applying an oleo-hydrophobic composite coating over the corrosion-resistant alloy coating. An oil and gas pipe has an inner surface with a multifunctional coating applied using the multifunctional coating method, and has an inner oleo-hydrophobic composite coating, beneath the inner oleo-hydrophobic composite coating a corrosion-resistant alloy coating, and beneath the corrosion-resistant alloy coating untreated pipe or any other metallic substrate.

A multifunctional coating method involves cleaning a surface, applying a layer of corrosion-resistant alloy coating to the surface, and applying an oleo-hydrophobic composite coating over the corrosion-resistant alloy coating. An oil and gas pipe has an inner surface with a multifunctional coating applied using the multifunctional coating method, and has an inner oleo-hydrophobic composite coating, beneath the inner oleo-hydrophobic composite coating a corrosion-resistant alloy coating, and beneath the corrosion-resistant alloy coating untreated pipe or any other metallic substrate.

A conductive fabric filter includes a non-woven fabric coated with copper by electroless plating, and the non-woven fabric has pores and is conductive.

The present invention provides a bump that can prevent diffusion of a metal used as a base conductive layer of the bump into a surface of an Au layer or an Ag layer. A conductive bump of the present invention is a conductive bump formed on a substrate. The conductive bump comprises, at least in order from the substrate: a base conductive layer; a Pd layer; a Pt layer; and an Au layer or an Ag layer having directly contact with the Pd layer, wherein a diameter of the conductive bump is 20 μm or less.