The invention relates to a method of electroless deposition of platinum group metals and their alloys from a plating bath onto a substrate, comprising a reduction step of one or more platinum group metal precursors with a reducing agent, wherein the reducing agent is a primary or secondary monohydroxyalcohol or a mixture of primary or secondary monohydroxyalcohols. The invention also provides a plating bath suitable for use in said method.

The invention relates to a method of electroless deposition of platinum group metals and their alloys from a plating bath onto a substrate, comprising a reduction step of one or more platinum group metal precursors with a reducing agent, wherein the reducing agent is a primary or secondary monohydroxyalcohol or a mixture of primary or secondary monohydroxyalcohols. The invention also provides a plating bath suitable for use in said method.

Provided is a fuel distribution pipe connected to a fuel pipe and distributes and supplies fuel to a plurality of fuel injection devices, comprising: a tubular base material forming a body of the fuel distribution pipe; and a plating layer formed on a surface of the base material, wherein the base material includes a sealing surface formed on an inner peripheral surface thereof and comes into press-contact with the fuel pipe, and wherein a thickness of the plating layer on the sealing surface is thinner than that of the plating layer on an outer peripheral surface of the fuel distribution pipe.

Provided is a fuel distribution pipe connected to a fuel pipe and distributes and supplies fuel to a plurality of fuel injection devices, comprising: a tubular base material forming a body of the fuel distribution pipe; and a plating layer formed on a surface of the base material, wherein the base material includes a sealing surface formed on an inner peripheral surface thereof and comes into press-contact with the fuel pipe, and wherein a thickness of the plating layer on the sealing surface is thinner than that of the plating layer on an outer peripheral surface of the fuel distribution pipe.

The present invention provides a bump that can prevent diffusion of a metal used as a base conductive layer of the bump into a surface of an Au layer or an Ag layer. A conductive bump of the present invention is a conductive bump formed on a substrate. The conductive bump comprises, at least in order from the substrate: a base conductive layer; a Pd layer; a Pt layer; and an Au layer or an Ag layer having directly contact with the Pd layer, wherein a diameter of the conductive bump is 20 m or less.

A method is provided, including the following operations: performing a deposition process on a substrate, the deposition process configured to deposit a ruthenium layer in a feature on the substrate, the ruthenium layer being doped with zinc at an atomic percentage less than approximately 30 percent; after depositing the ruthenium layer, annealing the substrate, wherein the annealing is configured to cause migration of the zinc to an interface of the ruthenium layer and an oxide layer of the substrate, the migration of the zinc producing an adhesive barrier at the interface that inhibits electromigration of the ruthenium layer.

The present invention concerns a tin plating bath comprising tin ions; at least one complexing agent selected from the group consisting of pyrophosphate ions, linear polyphosphate ions and cyclic polyphosphate ions and a nitrogen and sulfur containing stabilizing additive and titanium (III) ions as a reducing agent suitable to reduce tin ions to metallic tin. The present invention further discloses a method of depositing tin or a tin alloy onto a surface of a substrate. The tin plating bath is particularly suitable to be used in the electronics and semiconductor industry.

The present invention concerns a tin plating bath comprising tin ions; at least one complexing agent selected from the group consisting of pyrophosphate ions, linear polyphosphate ions and cyclic polyphosphate ions and a nitrogen and sulfur containing stabilizing additive and titanium (III) ions as a reducing agent suitable to reduce tin ions to metallic tin. The present invention further discloses a method of depositing tin or a tin alloy onto a surface of a substrate. The tin plating bath is particularly suitable to be used in the electronics and semiconductor industry.

The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.

The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.