A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

The present invention discloses a de-bouncing keypad and a preparation method thereof, wherein the keypad is composed of a rubber substrate and a metal contact having three layers of layered structures. A layer of tin alloy or lead alloy is plated on a surface of the metal contact by electroplating or chemical plating. The metal contact plated with the tin alloy or lead alloy has excellent contact bouncing resistance and arc-ablation resistance, and the metal contact is further composited with the rubber to shape and prepare the rubber de-bouncing keypad.

The present invention discloses a de-bouncing keypad and a preparation method thereof, wherein the keypad is composed of a rubber substrate and a metal contact having three layers of layered structures. A layer of tin alloy or lead alloy is plated on a surface of the metal contact by electroplating or chemical plating. The metal contact plated with the tin alloy or lead alloy has excellent contact bouncing resistance and arc-ablation resistance, and the metal contact is further composited with the rubber to shape and prepare the rubber de-bouncing keypad.

A method of performing electroless electrochemical atomic layer deposition is provided and includes: providing a substrate including an exposed upper metal layer; exposing the substrate to a first precursor solution to create a sacrificial metal monolayer on the exposed upper metal layer via underpotential deposition, where the first precursor solution is an aqueous solution including a reducing agent; subsequent to the forming of the sacrificial metal monolayer, rinsing the substrate; subsequent to the rinsing of the substrate, exposing the substrate to a second precursor solution to replace the sacrificial metal monolayer with a first deposition layer; and subsequent to replacing the sacrificial metal monolayer with the first deposition layer, rinsing the substrate. The exposure of the substrate to the first precursor solution and the exposure of the substrate to the second precursor solution are electroless processes.

A copper-clad aluminum composite wire that can reduce an amount of copper to be used. A structure of the copper-clad aluminum composite wire includes: a wire made of an aluminum material, where a surface of the wire made of an aluminum material is sequentially provided with an intermediate metal layer and a copper layer; and assuming that a thickness of the copper layer is t.sub.1, a density of the copper layer is .sub.1, a thickness of the intermediate metal layer is t.sub.2, a density of the intermediate metal layer is .sub.2, a radius of the wire made of an aluminum material is R, and a density of the wire made of an aluminum material is .sub.3, $t_1=\sqrt{{\left(R+t_2\right)}^2+\frac{K_1\left(t_2^2+2t_{2}R\right){}_2+K_1{R}^2}{}}$

The conductive fine particles according to the present invention each have: a core particle containing an acrylic resin; and a silver layer provided directly on the surface of the core particle directly or provided on the surface of the core particle via a nickel layer, wherein the surface coverage rate of the silver layer is 70% or higher.

The conductive fine particles according to the present invention each have: a core particle containing an acrylic resin; and a silver layer provided directly on the surface of the core particle directly or provided on the surface of the core particle via a nickel layer, wherein the surface coverage rate of the silver layer is 70% or higher.

A coated particle includes a surface of a base material particle which is coated with carbon particles. The carbon particles are produced by a step of disposing an explosive substance which shows a liquid state at normal temperature and normal pressure in a periphery of a raw material substance containing an aromatic compound having three or more nitro groups, and a step of detonating the explosive substance.

An additive for a composite plating solution, containing non-conductive fine particles, nickel ions, and water. A method for preventing solidification of a precipitate of non-conductive fine particles in an additive for a composite plating solution, including incorporating nickel ions in an additive for a composite plating solution containing non-conductive fine particles and water.