A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.

The present disclosure provides a radio wave transmissive metallic member having an excellent metallic luster. The present disclosure relates to a metallic member and a method for manufacturing the same. The metallic member comprises a substrate body, an ion-exchange resin layer formed on the substrate body, and a metal particle layer formed on the ion-exchange resin layer, wherein metal particles having a high aspect ratio are longitudinally oriented with respect to the ion-exchange resin layer and the substrate body.

The present disclosure provides a radio wave transmissive metallic member having an excellent metallic luster. The present disclosure relates to a metallic member and a method for manufacturing the same. The metallic member comprises a substrate body, an ion-exchange resin layer formed on the substrate body, and a metal particle layer formed on the ion-exchange resin layer, wherein metal particles having a high aspect ratio are longitudinally oriented with respect to the ion-exchange resin layer and the substrate body.

A catalyst solution for electroless plating is provided. The catalyst solution is printable and devoid of an amine. The catalyst solution comprises a catalytic metal salt, a solvent, and an epoxy.

A catalyst solution for electroless plating is provided. The catalyst solution is printable and devoid of an amine. The catalyst solution comprises a catalytic metal salt, a solvent, and an epoxy.

A substrate processing method includes: preparing a substrate in which patterns of a conductor and an insulator are formed in a substrate surface of the substrate; coating the substrate surface of the substrate with an ionic liquid including a metal salt; and applying energy to the substrate coated with the ionic liquid. The applying the energy to the substrate includes forming a metal layer on a surface of the conductor by precipitating a metal of the metal salt on the surface of the conductor by a reduction reaction of the metal salt.

A substrate processing method includes: preparing a substrate in which patterns of a conductor and an insulator are formed in a substrate surface of the substrate; coating the substrate surface of the substrate with an ionic liquid including a metal salt; and applying energy to the substrate coated with the ionic liquid. The applying the energy to the substrate includes forming a metal layer on a surface of the conductor by precipitating a metal of the metal salt on the surface of the conductor by a reduction reaction of the metal salt.

A wiring board includes a substrate, conductive pads and at least one protective layer group. The conductive pads are disposed on the substrate. The at least one protective layer group is disposed on a side of the conductive pads away from the substrate; a protective layer group includes an oxidation protective layer and a palladium alloy layer that are stacked, and the oxidation protective layer is closer to the substrate than the palladium alloy layer. A material of the oxidation protective layer includes a nickel-based alloy.