An object is to provide a novel composition for blackening treatment that can sufficiently blacken copper circuits of printed wiring boards, circuits made of silver paste, and other various articles containing a copper-based metal, such as copper or a copper alloy, or a silver-based metal, such as silver or a silver alloy, without impairing the smoothness of the copper-based metal or silver-based metal. A composition is provided for blackening treatment of a copper-based metal or a silver-based metal, the composition comprising an aqueous solution containing: (i) at least one water-soluble metal compound selected from the group consisting of water-soluble palladium compounds, water-soluble ruthenium compounds, and water-soluble silver compounds; (ii) at least one halide selected from the group consisting of hydrohalic acids, metal halides, and ammonium halides; and (iii) at least one nitrogen atom-containing compound selected from the group consisting of alkylene diamines, polyalkylene polyamines, polyamide polyamines, and crosslinked polyamide polyamines.

An object is to provide a novel composition for blackening treatment that can sufficiently blacken copper circuits of printed wiring boards, circuits made of silver paste, and other various articles containing a copper-based metal, such as copper or a copper alloy, or a silver-based metal, such as silver or a silver alloy, without impairing the smoothness of the copper-based metal or silver-based metal. A composition is provided for blackening treatment of a copper-based metal or a silver-based metal, the composition comprising an aqueous solution containing: (i) at least one water-soluble metal compound selected from the group consisting of water-soluble palladium compounds, water-soluble ruthenium compounds, and water-soluble silver compounds; (ii) at least one halide selected from the group consisting of hydrohalic acids, metal halides, and ammonium halides; and (iii) at least one nitrogen atom-containing compound selected from the group consisting of alkylene diamines, polyalkylene polyamines, polyamide polyamines, and crosslinked polyamide polyamines.

A hot-dip Zn alloy plating layer is formed on a surface of a base steel sheet by immersing the base steel sheet in a hot-dip Zn alloy plating bath containing Al and Mg. An aqueous solution containing one of or two or more of polyatomic ions selected from the group consisting of a polyatomic ion including V.sup.5+, a polyatomic ion including Si.sup.4+, and a polyatomic ion including Cr.sup.6+ is then contacted with a surface of the hot-dip Zn alloy plating layer. The aqueous solution contains the polyatomic ion in a concentration of 0.01 g/L or more in terms of one of or two or more of atoms selected from the group consisting of V, Si, and Cr.

A hot-dip Zn alloy plating layer is formed on a surface of a base steel sheet by immersing the base steel sheet in a hot-dip Zn alloy plating bath containing Al and Mg. An aqueous solution containing one of or two or more of polyatomic ions selected from the group consisting of a polyatomic ion including V.sup.5+, a polyatomic ion including Si.sup.4+, and a polyatomic ion including Cr.sup.6+ is then contacted with a surface of the hot-dip Zn alloy plating layer. The aqueous solution contains the polyatomic ion in a concentration of 0.01 g/L or more in terms of one of or two or more of atoms selected from the group consisting of V, Si, and Cr.

A conductive substrate includes a transparent base material; a metal layer formed on at least one of surfaces of the transparent base material; and a blackened layer formed on the metal layer by a wet method.

A conductive substrate includes a transparent base material; a metal layer formed on at least one of surfaces of the transparent base material; and a blackened layer formed on the metal layer by a wet method.

Provided is a zinc-based plated steel sheet having a post-treated coating filmed thereon including: a steel sheet; a zinc plated layer formed on the steel sheet; and a post-treated coating formed on the plated layer, wherein the atomic ratio (O/M) of oxygen (O) to metals (M) contained in the post-treated coating is greater than 2 and less than 20, and a method for post-treating a zinc-based plated steel sheet. According to this, the zinc-based plated steel sheet having the post-treated coating formed thereon has the effects excellent in lubricity, weldability, adhesiveness, film-removing property and paintability. As the method of post-treating a zinc-based plated steel sheet of the present invention employs a simple coating method irrespective of the kind of plating layer, the process is simple and economical and the process operation cost is low.

A liquid passivation mixture for passivating an outer layer of a substrate comprises a first material selected from group consisting of sulfur or selenium and a base selected from a group consisting of quaternary ammonium compound, sodium hydroxide (NaOH), potassium hydroxide (KOH), and amine.

The present invention relates to novel corrosion inhibitor compositions for magnesium or magnesium alloys and to a process for inhibiting the corrosion of such metals using such compositions. The corrosion inhibitor composition comprises a compound comprising a carboxyl group preventing the re-deposition of noble impurities which significantly decreases the corrosion rate by complexing said noble impurities, e.g. iron, nickel and copper.

The present invention provides plated steel sheet for hot press use which is excellent in hot lubricity, coating adhesion, spot weldability, and coated corrosion resistance and a method of hot pressing plated steel sheet. The present invention is Plated steel sheet for hot press use and a method of hot pressing plated steel sheet characterized by being plated steel sheet for hot press use which contains an Al plating layer which is formed on one surface or both surfaces of said steel sheet, and a surface coating layer which is formed on said Al plating layer, said surface coating layer containing at least one Zn compound which is selected from a group comprised of Zn hydroxide, Zn phosphate, and a Zn organic acid.