The present disclosure relates to a structural coating and preparation method and use thereof. The structural coating provided in the present disclosure includes a titanium transition layer and platinum-hafnium composite structure layers laminated in sequence on a surface of a substrate; the number of the platinum-hafnium composite structure layer is ≥3; the platinum-hafnium composite structure layer includes a hafnium layer and a platinum layer laminated in sequence.

Fe-Al-based plated hot-stamped member exhibiting excellent formed part corrosion resistance and post-coating corrosion resistance and manufacturing method. The hot-stamping member includes Fe-Al-based plated layer on one or both surfaces of a base material, the base material has a predetermined steel component, Fe-Al-based plated layer has a thickness of 10 μm or more and 60 μm or less, formed by A, B, C and D layers sequentially from a surface toward the base material, and each of the four layers is a Fe-Al-based intermetallic compound containing Al, Fe, Si, Mn and Cr for predetermined contents with the balance made up of impurities, the D layer further contains Kirkendall voids each of which cross-sectional area is 3 μm.sup.2-30 μm.sup.2 for 10 pieces/6000 μm.sup.2 or more and 40 pieces/6000 μm.sup.2 or less.

Provided is a highly corrosion-resistant plated steel sheet having plating adhesion and resistance to liquid metal embrittlement. A highly corrosion-resistant plated steel sheet comprises a base steel sheet and a plated layer, which sequentially comprises an Fe—Al alloy layer and an MgZn.sub.2 layer from an interface with the base steel sheet.

Provided are a Sn—Bi—In-based low melting-point joining member used in a Pb-free electroconductive joining method in mounting a semiconductor component, and is usable for low-temperature joining, and a manufacturing method therefor.

A Sn—Bi—In-based low melting-point joining member, including a Sn—Bi—In alloy that has a composition within a range represented by a quadrangle in a Sn—Bi—In ternary phase diagram, a first quadrangle having four vertices including: Point 1 (1, 69, 30), Point 2 (26, 52, 22), Point 3 (40, 10, 50), and Point 4 (1, 25, 74), where Point (x, y, z) is defined as a point of x mass % Sn, y mass % Bi and z mass % In, and that also has a melting point of 60 to 110° C. As well as a method for producing a Sn—Bi—In-based low melting-point joining member, including a plating step of forming a plated laminate on an object to be plated, the plated laminate including a laminated plating layer obtained by performing Sn plating, Bi plating, and In plating respectively such that the laminated plating layer has a composition within the range represented by the first quadrangle.

A coated steel member includes: a steel sheet substrate containing, as a chemical composition, by mass %, C: 0.25% to 0.65%, Si: 0.10% to 1.00%, Mn: 0.30% 1.00%, P: 0.050% or less, S: 0.0100% or less, N: 0.010% or less, Ti: 0.010% to 0.100%, B: 0.0005% to 0.0100%, Nb: 0.02% to 0.10%, Mo: 0.10% to 1.00%, Cu: 0.15% to 1.00%, and Ni: 0.05% to 0.25%; and a coating formed on a surface of the steel sheet substrate and containing Al and Fe. The maximum Cu content in a range from the surface to a depth of 5.0 μm is 150% or more of the Cu content of the steel sheet substrate.

A method of forming an electrode in accordance with an exemplary embodiment includes a process of forming a mask pattern on one surface of a base to expose a partial area of the one surface of the base by using a mask material that is polymer including an end tail having at least one bonding structure of covalent bond and double bond, a process of loading the base on which the mask pattern is formed into a chamber, and a process of forming a conductive layer containing copper on the exposed one surface of the base by using an atomic layer deposition method that alternately injects a source material containing copper and a reactive material that reacts with the source material into the chamber.

Thus, according to the method of forming an electrode in accordance with an exemplary embodiment, a thin-film caused by a material for forming an electrode is not formed on a surface of the mask pattern. Therefore, a residue is not remained when the mask pattern is removed to prevent a defect caused by the residue from being generated.

A press hardening method including the following steps: A. the provision of a steel sheet for heat treatment being optionally coated with a zinc- or aluminum-based pre-coating, B. the flexible rolling of the steel sheet in the rolling direction so as to obtain a steel sheet having a variable thickness, C. the cutting of the rolled steel sheet to obtain a tailored rolled blank, D. the deposition of a hydrogen barrier pre-coating over a thickness from 10 to 550 nm, E. the heat treatment of the tailored rolled blank to obtain a fully austenitic microstructure in the steel, F. the transfer of the tailored rolled blank into a press tool, G. the hot-forming of the tailored rolled blank to obtain a part having a variable thickness,H. the cooling of the part having a variable thickness obtained at step G).

A press hardening method including: A. provision of a steel sheet for heat treatment, being optionally precoated with a zinc- or aluminum-based pre-coating, B. deposition of a hydrogen barrier pre-coating comprising chromium and not comprising nickel over a thickness from 10 to 550 nm, C. cutting of the precoated steel sheet to obtain a blank, D. heat treatment of the blank at a furnace temperature from 800 to 970° C., during a dwell time from 1 to 12 minutes, in an atmosphere having an oxidizing power equal or higher than that of an atmosphere consisting of 1% by volume of oxygen and equal or smaller than that of an atmosphere consisting of 50% by volume of oxygen, such atmosphere having a dew point between −30 and +30° C., E. transfer of the blank into a press tool, F. hot-forming at a temperature from 600 to 830° C. to obtain a part, G. cooling of the part obtained at step E).

A structure (piping part (121)) has a cured product of a thermosetting resin composition (resin molded body (101)) and a plating layer (103) formed on a surface of the cured product, in which the plating layer (103) has a Cu layer (second plating layer (107)) and a thickness of the Cu layer (second plating layer (107)) is 2 μm or more and 50 μm or less.

A decorative component includes a plurality of metal finish layers deposited over a substrate and a plurality of sub-layers. The outermost metal finish layer is selectively deposited or removed to define one or more recesses to create different appearances of the component. The outer metal layer may undergo laser ablation to remove at least a portion of the outer layer while still exposing the outer layer in the area of removed material. The recess may extend fully through the outer layer to expose the underlying metal finish layer, and/or the recess may have a sloped bottom surface to define a gradient appearance. The outer layer may be applied over a mask that is applied to the underlying layer, such that the outer layer is selectively applied. The outer layer may be removed to expose the underlying finish layer without exposing a nickel sublayer and without requiring a top coat.