The present invention provides an iron-aluminum-based plated steel sheet, and a manufacturing method therefor, the iron-aluminum-based plated steel sheet comprising a base steel sheet and a plated layer formed on the surface of the base steel sheet, wherein the alloy plated layer comprises: a diffusion layer comprising an Fe—Al-based intermetallic compound having a cubic structure; and an alloyed layer formed on the diffusion layer and composed of an alloy phase differing from that of the cubic structure, the thickness of the diffusion layer is 3-20 μm, and the thickness of the diffusion layer is greater than 50% of the total thickness of the plated layer.

A high-strength coatings and methods of fabrication to yield single-crystal-like nickel containing nanotwins and stacking faults.

An apparatus includes a printed circuit board (PCB), a power component disposed on the PCB, the power component to generate heat, and a multilayered coating disposed over the power component and at least a portion of the PCB to dissipate heat from the power component, the multilayered including: an electrical insulation layer comprising a non-polar compound and disposed on the power component and the at least a portion of the PCB; a chromium layer disposed on the electrical insulation layer; and a copper layer disposed on the chromium layer that is at least 10 microns (μm) thick, the copper layer conformally adhered to a top of the power component and to the PCB.

Processes and apparatus are described for atmospheric pressure plasma jet deposition onto a substrate. The process comprises feeding a solution comprising a dissolved metal precursor into a plasma jet. The dissolved metal precursor comprises a precursor metal selected from Groups 2 to 16, with the proviso that the precursor metal does not comprise Mn. The plasma jet is directed towards a surface of the substrate such that material from the plasma jet becomes deposited onto the surface of the substrate. The process provides a means to manufacture conductive, semiconducting or insulating deposits on a substrate in a material-efficient manner without the need for high-temperature post-treatment steps.

A device including a hard shield material; a layer including aluminum or copper; and a silicon layer having a first thickness is disclosed. The device can also include a silicon layer having a second thickness. A method of making the device is also disclosed.

The present invention provides a steel sheet plated with aluminum-iron and a preparation method therefor, the steel sheet comprising: a base steel sheet; and a plated layer formed on the surface of the base steel sheet and comprising: an alloyed layer containing at least one of Fe3Al, FeAl(Si), Fe2Al5, and FeAl3; and an aluminum layer formed on the alloyed layer and having a thickness less than 10% of that of the plated layer, wherein the plated layer is 20-35 μm in thickness and contains 1-20 wt % of Mg as measured by GDS at a position 0.1 μm deep from the surface of the plated layer and 10 wt % of oxygen as measured by GDS at a position 0.1 μm deep from the surface of the plated layer.

A method for making a component for use in a semiconductor processing chamber is provided. A component body is formed from a conductive material having a coefficient of thermal expansion of less than 10.0×10.sup.−6/K. A metal oxide layer is then disposed over a surface of the component body.

A hot stamped body comprising a steel base material and an Al—Zn—Mg-based plating layer formed on a surface of the steel base material, wherein the plating layer has a predetermined chemical composition, the plating layer comprises an interfacial layer positioned at an interface with the steel base material and containing Fe and Al and a main layer positioned on the interfacial layer, the main layer comprises, by area ratio, 10.0 to 90.0% of an Mg—Zn containing phase, 5.0 to less than 30.0% of an Fe—Al containing phase, and 2.0 to 25.0% of an Al—Si containing oxide phase, the Mg—Zn containing phase comprises at least one selected from the group consisting of an MgZn phase, Mg.sub.2 Zn.sub.3 phase, and MgZn.sub.2 phase, and the Fe—Al containing phase comprises at least one of an FeAl phase and Fe—Al—Zn phase.

This steel sheet for hot stamping includes a base material, an Al-Si alloy plating layer in which the Al content is 75 mass% or more, the Si content is 3 mass% or more and the total of the Al content and the Si content is 95 mass% or more and a Ni plating layer in which the Ni content is more than 90 mass% in this order, the chemical composition of the base material is, by mass%, C: 0.01% or more and less than 0.70%, Si: 0.005% to 1.000%, Mn: 0.40% to 3.00%, Nb: 0.010% to 0.200%, a solid solution of Nb: 0.010% to 0.150%, sol. A1: 0.00020% to 0.50000%, P: 0.100% or less, S: 0.1000% or less, N: 0.0100% or less, Cu: 0% to 1.00%, Ni: 0% to 1.00%, V: 0% to 1.00%, Ti: 0% to 0.150%, Mo: 0% to 1.000%, Cr: 0% to 1.000%, B: 0% to 0.0100%, Ca: 0% to 0.010%. REM: 0% to 0.300%, and a remainder: Fe and an impurity, the Al-Si alloy plating layer has a thickness of 7 to 148 .Math.m, and the Ni plating layer has a thickness of more than 200 nm and 2500 nm or less.

Provided are a plated steel sheet and a method for manufacturing same, the plated steel sheet comprising: a base steel sheet; a Zn—Mg—Al plating layer provided on at least one surface of the base steel sheet; and an Fe—Al inhibition layer provided between the base steel sheet and the Zn—Mg—Al plating layer. The plating layer comprises, by weight %, 4 to 10% of Mg and 5.1-25% of Al and the remainder being Zn and unavoidable impurities with respect to components not including iron (Fe) diffused from the base steel sheet. The plating layer comprises a 24-50% MgZn.sub.2 phase in phase fraction. In the MgZn.sub.2 phase, an Al single phase is present in the ratio of 1-30% relative to the cross-sectional area of the total MgZn.sub.2 phase.