A method for depositing carbon on a substrate in a processing chamber includes arranging the substrate on a substrate support in the processing chamber. The substrate includes a carbon film having a first thickness formed on at least one underlying layer of the substrate. The method further includes performing a first etching step to etch the substrate to form features on the substrate, remove portions of the carbon film, and decrease the first thickness of the carbon film, selectively depositing carbon onto remaining portions of the carbon film, and performing at least one second etching step to etch the substrate to complete the forming of the features on the substrate.

A surface coated cutting tool comprises a tool body. A TiAlCN layer having an average layer thickness of 2.0 to 20.0 μm and represented by (Ti.sub.(1-x)Al.sub.x)(C.sub.yN.sub.(1-y)) is provided on the surface of the tool body and has an average content ratio x.sub.avg of Al and an average content ratio y.sub.avg of C that satisfy 0.60≤x.sub.avg≤0.95 and 0.00≤y.sub.avg≤0.05, an area ratio occupied by crystal grains having an NaCl-type face-centered cubic structure that satisfies 90 area % or more, and crystal grains satisfying 0.01 μm<d≤0.20 μm in 10 to 40 area %. An average maximum length in a direction parallel to the surface of the tool body in each region in which the crystal grains having d of 0.01 μm<d≤0.20 μm are adjacent and connected to each other in the upper layer side region is 5.0 μm or less.

A coated tool includes a base and a coating layer. The coating layer includes a first layer including TiCN, a second layer including Al.sub.2O.sub.3, and a third layer including at least one of TiN and TiCN. Cl content included in the first, second and third layers is first, second and third Cl content. Each of the first Cl content and the third Cl content is larger than the second Cl content. The first Cl content is more than 0.2 atomic % and not more than 2 atomic %. The third Cl content is more than 0.2 atomic % and not more than 2 atomic %. A cutting tool of the present disclosure includes a holder which has a length from a first end to a second end and includes a pocket on a side of the first end; and the coated tool located in the pocket.

A coated cutting tool comprises a substrate and a coating layer formed on a surface of the substrate, and has a rake face and a flank. The coating layer comprises an alternating laminate structure in which first compound layers containing AlN and second compound layers containing a compound are laminated in an alternating manner, the compound having a composition represented by formula (1) below:

(Ti.sub.1-xAl.sub.x)N  (1)

(wherein x satisfies 0.40≤x≤0.70). An average thickness T.sub.1 per first compound layer is 5 nm or more to 160 nm or less, and an average thickness T.sub.2 per second compound layer is 8 nm or more to 200 nm or less. A ratio of T.sub.1 to T.sub.2 is 0.10 or more to 0.80 or less. An average thickness T.sub.3 of the alternating laminate structure is 2.5 μm or more to 7.0 μm or less. A ratio (H/E) of hardness H to elastic modulus E is 0.065 or more to 0.085 or less at the rake face or the flank.

Described herein is a plasma resistant protective coating composition and bulk composition that provides enhanced erosion and corrosion resistance upon the coating composition's or the bulk composition's exposure to harsh chemical environment (such as hydrogen based and/or halogen based chemistries) and/or upon the coating composition's or the bulk composition's exposure to high energy plasma. Also described herein is a method of coating an article with a plasma resistant protective coating using electronic beam ion assisted deposition, physical vapor deposition, or plasma spray. Also described herein is a method of processing wafer, which method exhibits a reduced number of yttrium based particles.

Methods of applying an inorganic material to a metal substrate that includes a metallic material having an austenite transformation temperature. The method includes depositing inorganic particles onto a surface of the metal substrate. In some embodiments, methods may include depositing inorganic particles at a deposition temperature that does not cause the metallic material to exceed the austenite transformation temperature. The inorganic particles deposited onto the surface of the metal substrate may form an abrasion-resistant coating on the surface of the metal substrate. The difference between the coefficient of thermal expansion of the metallic material and the coefficient of thermal expansion of the abrasion-resistant coating may be 10×10.sup.−6/degrees C. or less.

An article may include a substrate and a coating system on the substrate. The coating system may include an environmental barrier coating (EBC) layer and a CMAS resistant layer on the EBC layer (e.g., as the top coat of the system). The CMAS layer includes a rare-earth (RE) monosilicate composition including a plurality of RE metal cations, wherein RE monosilicate composition is configured to react with CMAS to form a reaction product including a RE apatite phase with a RE.sub.2O.sub.3.SiO.sub.2 composition, wherein the RE of the RE.sub.2O.sub.3.SiO.sub.2 composition includes at least one of the plurality of RE metal cations of the RE monosilicate.

An article may include a substrate and a coating system on the substrate. The coating system may include a thermal barrier coating (TBC) layer and a CMAS resistant layer on the TBC layer. The CMAS layer includes a rare-earth (RE) monosilicate composition including a plurality of RE metal cations, wherein RE monosilicate composition is configured to react with CMAS to form a reaction product including a RE apatite phase with a RE.sub.2O.sub.3.SiO.sub.2 composition, wherein the RE of the RE.sub.2O.sub.3.SiO.sub.2 composition includes at least one of the plurality of RE metal cations of the RE monosilicate.

A coated cutting tool for chip forming machining of metals includes a substrate having a surface coated with a chemical vapour deposition (CVD) coating. The substrate is coated with a coating having a layer of α-Al.sub.2O.sub.3, wherein the α-Al.sub.2O.sub.3 layer exhibits a texture coefficient TC(0 0 12)≥7.2 and wherein the ratio of I(0 0 12)/I(0 1 14)≥0.8. The coating further includes a MTCVD TiCN layer located between the substrate and the α-Al.sub.2O.sub.3 layer. The MTCVD TiCN layer exhibits a pole figure, as measured by EBSD, in a portion of the MTCVD TiCN layer parallel to the outer surface of the coating and less than 1 μm from the outer surface of the MTCVD TiCN, wherein a pole plot based on the data of the pole figure, with a bin size of 0.25° over a tilt angle range of 0°≤β≤45° from the normal of the outer surface of the coating shows a ratio of intensity within β≤15° tilt angle to the intensity within 0°≤β≤45° of ≥45%.

The present invention discloses a high-temperature stable ceramic coating structure including a microalloy comprising the elements Al, V and N producible by a gas phase deposition process.