Patent classifications
C23C28/042
ANTI-MICROBIAL COATING PHYSICAL VAPOR DEPOSITION SUCH AS CATHODIC ARC EVAPORATION
A bioactive coated substrate includes a base substrate, an outermost bioactive layer disposed over the base substrate, and a topcoat layer disposed on the outermost bioactive layer. Characteristically, the topcoat layer defines a plurality of pinholes that expose the outermost bioactive layer. A method for forming the bioactive coated substrate is also provided.
Atomic layer deposition of protective coatings for semiconductor process chamber components
A multi-component coating composition for a surface of a semiconductor process chamber component comprising at least one first film layer of a yttrium oxide or a yttrium fluoride coated onto the surface of the semiconductor process chamber component using an atomic layer deposition process and at least one second film layer of an additional oxide or an additional fluoride coated onto the surface of the semiconductor process chamber component using an atomic layer deposition process, wherein the multi-component coating composition is selected from the group consisting of YO.sub.xF.sub.y, Y.sub.xAl.sub.yO, Y.sub.xZr.sub.yO and Y.sub.xZr.sub.yAl.sub.zO.
SEQUENCING CHIP AND MANUFACTURING METHOD THEREFOR
Provided are a chip matrix, a sequencing chip, and a manufacturing method thereof. The chip matrix includes: a wafer layer (111), the wafer layer (111) having cutting lines that are evenly distributed thereon; a first silicon oxide layer (112), the first silicon oxide layer (112) being made of silicon oxide and formed on an upper surface of the wafer layer (111); a transition metal oxide layer (113), the transition metal oxide layer (113) being made of transition metal oxide and formed on an upper surface of the first silicon oxide layer (112). The chip matrix has characteristics such as resistances against high temperature, high humidity and other harsh environments. Meanwhile, by changing pH, surfactant and other components of a solution containing sequences to be sequenced, a surface functional region of the chip matrix can specifically adsorb a sequence to be sequenced.
TWO-LAYERED DENSE METAL ANTICORROSIVE COATING FORMED BY LOW-TEMPERATURE SINTERING, PREPARATION METHOD THEREFOR, AND USE THEREOF
The invention discloses a two-layered dense metal anticorrosive coating formed by low temperature sintering with an outer layer of an inorganic ceramic coating and an inner layer of a base oxide coating. The raw materials comprise the following components by weight: 50-60 weight percent silicone compound, 20-35 weight percent thermal expansion coefficient adjuster, 3-7 weight percent binder, 5-10 weight percent adhesion adjuster, and 1-4 weight percent catalyst. A preparation process for the two-layered dense metal anticorrosive coating formed by low-temperature sintering comprises the following steps: 1) grinding, 2) wet mixing, 3) drying, 4) grinding, 5) coating, 6) sintering. The coating of this invention has high adhesion, outstanding anti-corrosion resistance, and good durability.
CUTTING TOOL
A cutting tool comprises a substrate and an AlTiN layer, the AlTiN layer including a first major surface and a second major surface, the AlTiN layer including a first region having a distance of 0 nm or more and 30 nm or less from the first major surface and having a maximum oxygen content ratio of more than 0 atomic % and less than 5 atomic %, a second region having a distance of more than 30 nm and 100 nm or less from the first major surface and having a maximum oxygen content ratio of 5 atomic % or more and 30 atomic % or less, and a third region having a distance of more than 100 nm and 150 nm or less from the first major surface and having a maximum oxygen content ratio of more than 0 atomic % and less than 5 atomic %.
CUTTING TOOL
A cutting tool comprises a substrate and an AlTiN layer, the AlTiN layer including a first major surface and a second major surface, the AlTiN layer including a first region having a distance of 0 nm or more and 30 nm or less from the first major surface and having a maximum oxygen content ratio of 30 atomic % or more, a second region having a distance of more than 30 nm and 100 nm or less from the first major surface and having a maximum oxygen content ratio of 5 atomic % or more and less than 30 atomic %, and a third region having a distance exceeding 100 nm from the first major surface and having a maximum oxygen content ratio of less than 5 atomic %.
CUTTING TOOL
A cutting tool comprises a substrate and an AlTiN layer, the AlTiN layer including cubic Al.sub.xTi.sub.(1-x)N crystal grains, an atomic ratio x of Al in the Al.sub.xTi.sub.(1-x)N being 0.7 or more and 0.95 or less, the AlTiN layer including a first major surface on a side of a surface of the cutting tool and a second major surface on a side of the substrate, the AlTiN layer including a first region having a distance of 0 nm or more and 100 nm or less from the first major surface, and a second region having a distance of more than 100 nm and 150 nm or less from the first major surface, the first region having a maximum oxygen content ratio of 5 atomic % or more and 30 atomic % or less, the second region having a maximum oxygen content ratio of less than 5 atomic %.
Method For Producing Improved Cold-Forming Tools For High-Strength And Super-High-Strength Steels, And Cold-Forming Tool
The invention relates to a method for producing a cold forming tool, particularly for cold forming super-high-strength steels, wherein the cold forming tool is the upper and/or lower tool of a forming tool set, wherein the cold forming tool is made of a metal material and has a forming surface that is designed so that a formed metal sheet has the desired final contour of the component, characterized in that a hard material layer is deposited on the forming surface of the forming tool by means of physical gas-phase deposition, wherein the hard material layer consists of a titanium nitride adhesive layer and alternating layers of aluminum titanium nitride and aluminum chromium nitride deposited thereon, wherein a titanium nitride top layer or alternatively a titanium carbon nitride top layer is deposited as the final layer as the outermost outer surface oriented toward a workpiece that is to be formed.
Surface coated cutting tool and method for manufacturing the same
A surface coated cutting tool comprises a base material and a coating layer that coats the base material, the coating layer including an alternate layer composed of a first unit layer and a second unit layer alternately stacked, the first unit layer being composed of a nitride containing aluminum and zirconium, in the first unit layer, when the total number of metal atoms constituting the first unit layer is represented as 1, a ratio thereto of the number of atoms of the zirconium being not less than 0.65 and not more than 0.95, the second unit layer being composed of a nitride containing titanium and silicon, in the second unit layer, when the total number of metal atoms constituting the second unit layer is represented as 1, a ratio thereto of the number of atoms of the silicon being larger than 0 and not more than 0.20.
Coating and coated cutting tool comprising the coating
A coating includes a layer having an alumina matrix and at least one of zirconia grains and hafnia grains in the alumina matrix. An average grain size of the at least one of the zirconia grains and hafnia grains is 100 nm or less. A coated cutting tool includes a substrate and the coating bonded to the substrate. The substrate has a rake face, a flank face, and a cutting edge formed at the intersection of the rake face and the flank face.