Patent classifications
C23C28/048
Emissivity controlled coatings for semiconductor chamber components
A component for a semiconductor processing chamber, the component including a substrate and a coating layer provided on a surface of the substrate, wherein the coating layer includes at least a first coating layer having a thermal emissivity of more than 0.98 to 1, having plasma resistance, and having a color value L in a range of 35 to 40 through a thickness direction thereof.
Modified metal materials, surface modifications to improve cell interactions and antimicrobial properties, and methods for modifying metal surface properties
The present disclosure is directed to modified metal materials for implantation and/or bone replacement, and to methods for modifying surface properties of metal substrates for enhancing cellular adhesion (tissue integration) and providing antimicrobial properties. Some embodiments comprise surface coatings for metal implants, such as titanium-based materials, using (1) electrochemical processing and/or oxidation methods, and/or (2) laser processing, in order to enhance bone cell-materials interactions and achieve improved antimicrobial properties. One embodiment comprises the modification of a metal surface by growth of in situ nanotubes via anodization, followed by electrodeposition of silver on the nanotubes. Other embodiments include the use of LENS™ processing to coat a metal surface with calcium-based bioceramic composition layers. These surface treatment methods can be applied as a post-processing operation to metallic implants such as hip, knee and spinal devices as well as screws, pins and plates.
TA-C BASED COATINGS WITH IMPROVED HARDNESS
A substrate is coated with a multi-layer coating, comprising in order: (i) a first functional layer comprising ta-C, (ii) a second functional layer comprising ta-C, (iii) (a) a third functional layer comprising ta-C and a first intermediate layer comprising a carbide of a first element, or (b) a first intermediate layer comprising a carbide of a first element, and a second intermediate layer comprising the first element, wherein the ta-C has a hydrogen content less than 10% and an sp2 content less than 30%; wherein (i) the Young's modulus or (ii) the hardness or (iii) both the Young's modulus and the hardness independently stay the same or increase from layer to layer in (iii) (a) from the first intermediate layer to the first functional layer, or in (iii) (b) from the second intermediate layer to the first functional layer.
Bonded alumina coating for stainless steel
A method for manufacturing an alumina-based layer structure having transition regions between layers is disclosed. The method may include ion milling a stainless steel structure surface to partially reduce a metal oxide layer from, and create an exposed portion of, the surface. The method may include oxidizing the exposed portion of the surface to form a crystallized metal oxide bonding layer, growing a crystallized alumina layer onto the metal oxide bonding layer, and diffusing metal from the surface into the crystallized alumina layer, to form a graded aluminate spinel layer. The method may include forming a first transition region from the graded aluminate spinel layer to a crystalline alumina layer, growing the crystalline alumina layer from the first transition region, forming a second transition region from the crystalline alumina layer to an amorphous alumina layer, and growing the amorphous alumina layer from the second transition region.
THERMALLY CONDUCTIVE AND PROTECTIVE COATING FOR ELECTRONIC DEVICE
A protective coating layer, an electronic device including such a protective coating layer, and the methods of making the same are provided. The electronic device includes a substrate, a thin film circuit layer disposed over the substrate, and a protective coating layer disposed over the thin film circuit layer. The protective coating layer includes a first coating and a second coating disposed over the first coating. Each coating has a cross-plane thermal conductivity in a direction normal to a respective coating surface equal to or higher than 0.5 W/(m*K). The first coating and the second coating have different crystal or amorphous structures, different crystalline orientations, different compositions, or a combination thereof to provide different nanoindentation hardness. The first coating has a hardness lower than that of the second coating.
Cutting tool
Provided is a cutting tool including a base material and a coating layer provided on the base material, the coating layer including a titanium carbonitride layer provided on the base material, an intermediate layer provided on the titanium carbonitride layer in contact therewith, and an alumina layer provided on the intermediate layer in contact therewith, the intermediate layer being composed of a compound made of titanium, carbon, oxygen, and nitrogen, the intermediate layer having a thickness of more than 1 μm, when P.sub.N1 atomic % represents an atomic ratio of the nitrogen in an interface between the intermediate layer and the alumina layer, and P.sub.N2 atomic % represents an atomic ratio of the nitrogen at a point A away from the interface by 1 μm on a side of the intermediate layer, a ratio P.sub.N1/P.sub.N2 of the P.sub.N1 to the P.sub.N2 being more than or equal to 1.03.
CUTTING TOOL
A cutting tool comprises a substrate and an AlTiN layer, the AlTiN layer including a first major surface and a second major surface, the AlTiN layer including a first region having a distance of 0 nm or more and 30 nm or less from the first major surface and having a maximum oxygen content ratio of more than 0 atomic % and less than 5 atomic %, a second region having a distance of more than 30 nm and 100 nm or less from the first major surface and having a maximum oxygen content ratio of 5 atomic % or more and 30 atomic % or less, and a third region having a distance of more than 100 nm and 150 nm or less from the first major surface and having a maximum oxygen content ratio of more than 0 atomic % and less than 5 atomic %.
SURFACE COATING TREATMENT
A component for use as part of a plasma processing chamber is provided. The component has a component body adapted for use as part of a plasma processing chamber. A first ceramic coating of a ceramic material is on a surface of the component body, wherein the first ceramic coating has a first side adjacent to the component body and a second side spaced apart from the component body and wherein the first ceramic coating has a porosity and density. A second ceramic coating of the ceramic material is on the second side of the first ceramic coating, wherein the second ceramic coating has a porosity that is less than the porosity of the first ceramic coating and the second ceramic coating has a density that is greater than the density of the first ceramic coating.
ARTICLE HAVING VARIABLE COMPOSITION COATING
A coated article includes a substrate and an MCrAlY coating supported on the substrate. The M includes at least one of nickel, cobalt, and iron, Cr is chromium, Al is aluminum, and Y is yttrium. The composition of the MCrAlY coating varies in an amount of at least one of Cr, Al, and Y by location on the substrate with respect to localized property requirements. In one example, the coated article is an article of a gas turbine engine.
CUTTING TOOL
A cutting tool including a rake face and a flank face includes: a substrate; and a coating film disposed on the substrate, wherein the coating film includes an Al.sub.2O.sub.3 layer, residual stress of the Al.sub.2O.sub.3 layer has a minimum value R.sub.min at at least a portion of a region f1 in the flank face, the minimum value R.sub.min is more than or equal to −0.25 GPa and less than or equal to −0.1 GPa.