C23F1/14

ANTI-COKING NANOMATERIAL BASED ON STAINLESS STEEL SURFACE, AND PREPARATION METHOD THEREFOR
20190186036 · 2019-06-20 ·

An anti-coking nanomaterial based on a stainless steel surface. In percentage by weight, the nanomaterial comprises: 0 to 3% of carbon, 23% to 38% of oxygen, 38% to 53% of chromium, 10% to 35% of ferrum, 0 to 2% of molybdenum, 0 to 4% of nickel, 3.5 to 5% of silicon, 0 to 1% of calcium, and the balance of impurity elements. Also disclosed are a preparation method for the anti-coking nanomaterial, the anti-coking nanomaterial that is based on a stainless steel surface and that is prepared by using the preparation method, and a stainless steel substrate comprising the anti-coking nanocrystalline material.

METHOD FOR REDUCING SURFACE ROUGHNESS

A surface of an article is modified by aluminizing an initial surface at a first temperature to form a first aluminized layer and a sublayer, removing at least a portion of the first aluminized layer, aluminizing the sublayer at a second temperature to form a second aluminized layer, and finally removing at least a portion of the second aluminized layer to form a processed surface. The second temperature is less than the first temperature and a roughness of the processed surface is less than the roughness of the initial surface.

Methods of reducing the adhesion of a maskant

A method for reducing adhesion between a maskant and a substrate, wherein the maskant is adhered to a surface of the substrate, the method comprising applying a composition to the maskant.

Methods of reducing the adhesion of a maskant

A method for reducing adhesion between a maskant and a substrate, wherein the maskant is adhered to a surface of the substrate, the method comprising applying a composition to the maskant.

Method of preparing metal mask substrate
12024780 · 2024-07-02 · ·

A method of preparing a metal mask substrate includes providing a metal substrate. Next, a gloss is measured and obtained from the surface of the metal substrate. Next, the gloss is determined whether to be within a predetermined range. When the gloss is determined within the predetermined range, a photolithography process is performed to the metal substrate, where the predetermined range is between 90 GU and 400 GU.

Method of preparing metal mask substrate
12024780 · 2024-07-02 · ·

A method of preparing a metal mask substrate includes providing a metal substrate. Next, a gloss is measured and obtained from the surface of the metal substrate. Next, the gloss is determined whether to be within a predetermined range. When the gloss is determined within the predetermined range, a photolithography process is performed to the metal substrate, where the predetermined range is between 90 GU and 400 GU.

Low-power electro-thermal film devices and methods for making the same

A low-power transparent electro-thermal film device is provided. The device includes a transparent substrate, a transparent conductor layer disposed at least one side of the transparent substrate, and a plurality of inner electrodes disposed on the transparent conductor layer and including a first plurality of inner electrodes extending in a comb shape from a first electrode bus bar and a second plurality of inner electrodes extending in the comb shape from a second electrode bus bar. The first plurality of inner electrodes inter-lock with the second plurality of inner electrodes.

Low-power electro-thermal film devices and methods for making the same

A low-power transparent electro-thermal film device is provided. The device includes a transparent substrate, a transparent conductor layer disposed at least one side of the transparent substrate, and a plurality of inner electrodes disposed on the transparent conductor layer and including a first plurality of inner electrodes extending in a comb shape from a first electrode bus bar and a second plurality of inner electrodes extending in the comb shape from a second electrode bus bar. The first plurality of inner electrodes inter-lock with the second plurality of inner electrodes.

Cu-MoTi ETCHING SOLUTION
20190144748 · 2019-05-16 ·

A CuMoTi etching solution is provided. The CuMoTi etching solution includes 5 to 30 wt % of an oxidant, 3 to 15 wt % of an acid, 3 to 15 wt % of an inorganic salt, and the balance deionized water. The oxidant is selected from hydrogen peroxide or persulfuric acid. The acid is selected from polycarboxylic acids, amino acids, or inorganic acids. The inorganic salt is selected from diammonium hydrogen phosphate or ammonium dihydrogen phosphate.

SUPERHYDROPHOBIC SURFACE ARRANGEMENT, ARTICLE COMPROMISING SAME AND METHOD OF MANUFACTURE THEREOF
20190127856 · 2019-05-02 ·

The present invention is concerned with a superhydrophobic surface arrangement, an article having the same and a method of making same. The arrangement is configured for generating, upon contact by water droplets, pancaking bouncing and reducing liquid contact time. The arrangement has an array of posts residing on a surface and extending from the surface, said posts having an elongate configuration with a base portion at one end and an upper portion at an opposite end. By way of the configuration of the posts and the Weber number the surface arrangement in use pancake bouncing of liquid droplets and reduction of contact time of the liquid droplets are effected.