There is provided a cleaning liquid for semiconductor substrates having undergone CMP, the cleaning liquid being excellent in storage stability. In addition, there is provided a method of cleaning semiconductor substrates having undergone CMP. The cleaning liquid for semiconductor substrates having undergone CMP shows alkaline properties and contains: an amine compound that is at least one selected from the group consisting of a primary amine, a secondary amine, a tertiary amine, and their salts; a chelating agent; and water. The amine compound content is not less than 25.5 mass % and less than 90 mass % based on the total mass of the cleaning liquid, and the water content is 10 to 60 mass % based on the total mass of the cleaning liquid.

Methods for refurbishing aerospace components by removing corrosion and depositing protective coatings are provided herein. In one or more embodiments, a method of refurbishing an aerospace component includes exposing the aerospace component containing corrosion to an aqueous cleaning solution. The aerospace component contains a nickel superalloy, an aluminide layer disposed on the nickel superalloy, and an aluminum oxide layer disposed on the aluminide layer. The method includes removing the corrosion from a portion of the aluminum oxide layer with the aqueous cleaning solution to reveal the aluminum oxide layer, then exposing the aluminum oxide layer to a post-rinse, and forming a protective coating on the aluminum oxide layer.

A process for anticorrosion treatment of a metallic surface, including bringing the surface into successive contact with the an alkaline or acidic cleaner composition, a first rinsing composition, optionally a second rinsing composition, an acidic conversion composition, optionally a third rinsing composition, and a composition including a (meth)acrylate- and/or epoxide-based cathodic electrophoretic coating. At least one of the compositions includes at least one compound of the formula R.sup.1O—(CH.sub.2).sub.x—Z—(CH.sub.2).sub.y—OR.sup.2. R.sup.1 and R.sup.2 are each, independently of one another, H or an HO—(CH.sub.2).sub.w— group with w≥2. X and y are each, independently of one another, from 1 to 4 and Z is an S atom or a C—C triple bond. An aqueous composition for reducing corrosive removal of material in anticorrosion treatment of metallic surfaces is disclosed.

Embodiments of the present disclosure generally relate to methods for refurbishing aerospace components by removing corrosion and depositing protective coatings. In one or more embodiments, a method of refurbishing an aerospace component includes exposing the aerospace component containing corrosion to an aqueous cleaning solution. The aerospace component contains a nickel superalloy, an aluminide layer disposed on the nickel superalloy, and an aluminum oxide layer disposed on the aluminide layer. The method includes removing the corrosion from a portion of the aluminum oxide layer with the aqueous cleaning solution to reveal the aluminum oxide layer, then exposing the aluminum oxide layer to a post-rinse, and forming a protective coating on the aluminum oxide layer.

[Problem] An object is to provide novel composite copper foils. [Means to solve the problem] A composite copper foil comprises a copper foil and a layer of metal other than copper, the metal layer being formed on at least a part of a surface of the copper foil, wherein at least a part of the composite copper foil has protrusions on a surface thereof, and each protrusion has a height of 10 nm or more but 1000 nm or less in a cross-section of the composite copper foil.

Provided is a cleaning liquid composition which is useful for cleaning of a substrate or the like that has been subjected to a chemical mechanical polishing (CMP) process, etc in the production steps of an electronic device such as a semiconductor element. A cleaning liquid composition according to the present invention is used for the purpose of cleaning a substrate that has a Cu wiring, and comprises one or more basic compounds and one or more nitrogen-containing monocyclic heterocyclic aromatic compounds that contain one or more carboxyl groups or ester groups, provided that in cases where one or more amino groups are contained therein, only amino groups directly bonded to a nitrogen-containing heterocyclic rind are contained. This cleaning liquid composition has a hydrogen ion concentration (pH) of 8-12.

Provided is a cleaning liquid composition which is useful for cleaning of a substrate or the like that has been subjected to a chemical mechanical polishing (CMP) process, etc in the production steps of an electronic device such as a semiconductor element. A cleaning liquid composition according to the present invention is used for the purpose of cleaning a substrate that has a Cu wiring, and comprises one or more basic compounds and one or more nitrogen-containing monocyclic heterocyclic aromatic compounds that contain one or more carboxyl groups or ester groups, provided that in cases where one or more amino groups are contained therein, only amino groups directly bonded to a nitrogen-containing heterocyclic rind are contained. This cleaning liquid composition has a hydrogen ion concentration (pH) of 8-12.

A method for the production of metal sheet including a substrate having two faces, at least one of which is coated with a metal coating including between 0.1 and 10% by weight of Mg and optionally between 0.1 and 20% by weight of Al, the remainder of the metal coating being Zn. The method includes at least the steps of providing a steel substrate having two faces, depositing a metal coating on at least one face hot dipping of the substrate, solidifying the metal coating, applying onto the outer surfaces of the metal coating an aqueous solution having a pH of 7 to 13 and including a magnesium ion complexing agent, for which the dissociation constant pKd of the complexing reaction of the agent with the magnesium is greater than or equal to 2, and to the metal sheet obtainable with this method.

A method for the production of metal sheet including a substrate having two faces, at least one of which is coated with a metal coating including between 0.1 and 10% by weight of Mg and optionally between 0.1 and 20% by weight of Al, the remainder of the metal coating being Zn. The method includes at least the steps of providing a steel substrate having two faces, depositing a metal coating on at least one face hot dipping of the substrate, solidifying the metal coating, applying onto the outer surfaces of the metal coating an aqueous solution having a pH of 7 to 13 and including a magnesium ion complexing agent, for which the dissociation constant pKd of the complexing reaction of the agent with the magnesium is greater than or equal to 2, and to the metal sheet obtainable with this method.

A process for anticorrosion treatment of a metallic surface, including bringing the surface into successive contact with the an alkaline or acidic cleaner composition, a first rinsing composition, optionally a second rinsing composition, an acidic conversion composition, optionally a third rinsing composition, and a composition including a (meth)acrylate- and/or epoxide-based cathodic electrophoretic coating. At least one of the compositions includes at least one compound of the formula R.sup.1O—(CH.sub.2).sub.x—Z—(CH.sub.2).sub.y—OR.sup.2. R.sup.1 and R.sup.2 are each, independently of one another, H or an HO—(CH.sub.2).sub.w— group with w≥2. X and y are each, independently of one another, from 1 to 4 and Z is an S atom or a C—C triple bond. An aqueous composition for reducing corrosive removal of material in anticorrosion treatment of metallic surfaces is disclosed.