In one example, a method for manufacturing an electronic device housing is described. A coating layer may be formed on a surface of a metal substrate. Further, an edge region of the metal substrate may be chamfered by applying water-based anti-corrosion cutting fluid to form an exposed surface portion of the metal substrate. On the exposed surface portion, a transparent protective passivation layer may be formed. Furthermore, a first electrophoretic deposition layer may be formed on the transparent protective passivation layer.

In one example, a method for manufacturing an electronic device housing is described. A coating layer may be formed on a surface of a metal substrate. Further, an edge region of the metal substrate may be chamfered by applying water-based anti-corrosion cutting fluid to form an exposed surface portion of the metal substrate. On the exposed surface portion, a transparent protective passivation layer may be formed. Furthermore, a first electrophoretic deposition layer may be formed on the transparent protective passivation layer.

A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

Described herein are electrochemical-additive manufacturing (ECAM) systems comprising electrophoretically-deposited masks selectively covering a set of individually-addressable electrodes (pixels) in the electrode arrays (printheads). For example, an electrophoretically-deposited mask, comprising one or more patches, can be used to block the electric current through certain array portions thereby preventing electrolytic deposition on the corresponding portions of the deposition electrode during ECAM processes. In some examples, electrode array portions can be masked to cover damaged portions (e.g., stuck-on control circuits, electrically and/or ionically conductive passages in the electrode array) and/or to form special patterns of inactive array portions (that no longer need to be controlled using deposition control circuits). Such electrophoretically-deposited masks can be formed in an ECAM system or an external system. The mask forming can be a single-stage process or a multi-stage process. Furthermore, the mask position can be self-defining, e.g., based on defect location and/or severity of defects.

Described herein are electrochemical-additive manufacturing (ECAM) systems comprising electrophoretically-deposited masks selectively covering a set of individually-addressable electrodes (pixels) in the electrode arrays (printheads). For example, an electrophoretically-deposited mask, comprising one or more patches, can be used to block the electric current through certain array portions thereby preventing electrolytic deposition on the corresponding portions of the deposition electrode during ECAM processes. In some examples, electrode array portions can be masked to cover damaged portions (e.g., stuck-on control circuits, electrically and/or ionically conductive passages in the electrode array) and/or to form special patterns of inactive array portions (that no longer need to be controlled using deposition control circuits). Such electrophoretically-deposited masks can be formed in an ECAM system or an external system. The mask forming can be a single-stage process or a multi-stage process. Furthermore, the mask position can be self-defining, e.g., based on defect location and/or severity of defects.

A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

Described herein are methods and systems for additive manufacturing of parts comprising electrolytic deposits and electrophoretic deposits. Such methods and methods provide various new ways for integrating different materials into composite parts. Specifically, an additive manufacturing system comprises an electrode array with individually-addressable electrodes. Each individually-addressable electrode is coupled to a separate deposition control circuit, which selectively connects this electrode to a power supply. When forming a composite part, the electrode array can control the location of each electrolytic deposit (by controlling the current flow through each individually-addressable electrode) and each electrophoretic deposit (by controlling the electric field distribution). An electrolyte solution or an electrophoretic suspension is provided between the electrode array and deposition electrode to form corresponding deposits. In addition to the electrode-array provided control, alternating the electrolytic and electrophoretic deposition operations can be used to locate the corresponding deposits within a composite part.

Described herein are methods and systems for additive manufacturing of parts comprising electrolytic deposits and electrophoretic deposits. Such methods and methods provide various new ways for integrating different materials into composite parts. Specifically, an additive manufacturing system comprises an electrode array with individually-addressable electrodes. Each individually-addressable electrode is coupled to a separate deposition control circuit, which selectively connects this electrode to a power supply. When forming a composite part, the electrode array can control the location of each electrolytic deposit (by controlling the current flow through each individually-addressable electrode) and each electrophoretic deposit (by controlling the electric field distribution). An electrolyte solution or an electrophoretic suspension is provided between the electrode array and deposition electrode to form corresponding deposits. In addition to the electrode-array provided control, alternating the electrolytic and electrophoretic deposition operations can be used to locate the corresponding deposits within a composite part.