Patent classifications
C25D1/22
NICKEL-COBALT MATERIAL AND METHOD OF FORMING
A nickel-cobalt material and method of forming includes forming a doped nickel-cobalt precursor material. The method also includes heat treating the doped nickel-cobalt precursor material, wherein the heat treating includes at least heating within a temperature zone below the onset temperature for grain growth in the doped nickel-cobalt precursor material.
Cathode for thin film microbattery
A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.
Cathode for thin film microbattery
A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.
Method of forming a homogeneous solid metallic anode for a thin film microbattery
A method of providing an anode composed of a homogeneous solid metallic alloy is provided. The alloy includes 100 ppm to 1000 ppm Bi, 100 ppm to 1000 ppm In, and Zn. The method includes fabricating a cathode in a first cavity in a first dielectric element. The method further includes fabricating an anode in a second cavity in a second dielectric element. The method further includes joining the cathode and the anode in a complanate manner.
Method of forming a homogeneous solid metallic anode for a thin film microbattery
A method of providing an anode composed of a homogeneous solid metallic alloy is provided. The alloy includes 100 ppm to 1000 ppm Bi, 100 ppm to 1000 ppm In, and Zn. The method includes fabricating a cathode in a first cavity in a first dielectric element. The method further includes fabricating an anode in a second cavity in a second dielectric element. The method further includes joining the cathode and the anode in a complanate manner.
COPPER FOIL AND MANUFACTURING METHOD THEREOF, AND CURRENT COLLECTOR OF ENERGY STORAGE DEVICE
A copper foil and a manufacturing method of the same, and a current collector of an energy storage device are provided. The manufacturing method includes forming a copper foil by direct-current electroplating on a surface of a cathode and separating the copper foil from the cathode after the electroplating, wherein the structure of the copper foil includes columnar grains of a (111) orientation having a volume ratio of 70% or more. The conditions of the direct-current electroplating include performing at a range of 35 C. to 55 C. using a plating solution containing 40 g/L to 120 g/L of copper ions, 40 g/L to 110 g/L of sulfuric acid, and 30 ppm to 90 ppm of chloride ions at a current density between 20 ASD and 60 ASD.
Method of making forming screens
A process of constructing a forming screen through metal deposition in a nonconductive preform structure to achieve a desired aspect ratio of the forming screen thickness to open area.
Controlling porosity of an interference lithography process by fine tuning exposure time
A method to control the density of a three-dimensional photonic crystal template involves changing the irradiation time from at least four laser beams to yield a periodic percolating matrix of mass and voids free of condensed matter from a photoresist composition. The photoresist composition includes a photoinitiator at a concentration where the dose or irradiation is controlled by the irradiation time and is less than the irradiation time that would convert all photoinitiator to initiating species such that the density of the three-dimensional photonic crystal template differs for different irradiation times. A deposition of reflecting or absorbing particles can be patterned on the surface of the photoresist composition to form a template with varying densities above different areas of the substrate.
Method of manufacturing electroformed components
In manufacturing of a first electroformed component and a second electroformed component having portions fitted to each other into close contact, after the first electroformed component is formed, the first electroformed component is used as a portion of an electroforming mold to form the second electroformed component. Using the first electroformed component as a portion of the electroforming mold to form the second electroformed component, the shape of the first electroformed component is transferred to the second electroformed component. As a result, multiple types of components differing in shape may be accurately manufactured concurrently in a series of manufacturing steps.
Method of manufacturing electroformed components
In manufacturing of a first electroformed component and a second electroformed component having portions fitted to each other into close contact, after the first electroformed component is formed, the first electroformed component is used as a portion of an electroforming mold to form the second electroformed component. Using the first electroformed component as a portion of the electroforming mold to form the second electroformed component, the shape of the first electroformed component is transferred to the second electroformed component. As a result, multiple types of components differing in shape may be accurately manufactured concurrently in a series of manufacturing steps.