A method of electroplating a metal foam includes placing a metal foam to be plated into an electroplating chamber with a plating material source, circulating an electrolyte through the chamber to carry metal ions from the plating material source, the circulating being selected and controlled to produce an even coating of plating material on surfaces of the metal foam.

This invention is related to a method for the preparation of halide perovskite or perovskite-related materials on a substrate and to optoelectronic devices and photovoltaic cells comprising the perovskites prepared by the methods of this invention The method for the preparation of the perovskite includes a direct conversion of elemental metal or metal alloy to halide perovskite or perovskite-related materials.

A method of electroplating a metal foam includes placing a metal foam to be plated into an electroplating chamber with a plating material source, circulating an electrolyte through the chamber to carry metal ions from the plating material source, the circulating being selected and controlled to produce an even coating of plating material on surfaces of the metal foam.

A method of electroplating a metal foam includes placing a metal foam to be plated into an electroplating chamber with a plating material source, circulating an electrolyte through the chamber to carry metal ions from the plating material source, the circulating being selected and controlled to produce an even coating of plating material on surfaces of the metal foam.

A process of forming a thin film photoactive layer of an optoelectronic device comprising: providing a substrate having a surface comprising or coated with a metal M selected from at least one of Pb, Sn, Ge, Si, Ti, Bi, or In; and converting the metal surface or metal coating of the substrate to a perovskite layer.

A process of forming a thin film photoactive layer of an optoelectronic device comprising: providing a substrate having a surface comprising or coated with a metal M selected from at least one of Pb, Sn, Ge, Si, Ti, Bi, or In; and converting the metal surface or metal coating of the substrate to a perovskite layer.

A non-line-of-sight (NLOS) coating process is provided for a substrate having first and second transverse surfaces where the second surface lacks a LOS for depositional processing. The NLOS coating process includes electroplating or electroless plating a crack-resistant interlayer coating to at least the second surface and applying a wear-resistant coating to the crack-resistant interlayer coating by electrolytic or electroless plating.

A non-line-of-sight (NLOS) coating process is provided for a substrate having first and second transverse surfaces where the second surface lacks a LOS for depositional processing. The NLOS coating process includes electroplating or electroless plating a crack-resistant interlayer coating to at least the second surface and applying a wear-resistant coating to the crack-resistant interlayer coating by electrolytic or electroless plating.

A manufacturing method of a metal/resin composite structure of the invention is a manufacturing method for manufacturing a metal/resin composite structure obtained by bonding a steel member and a thermoplastic resin member formed of a thermoplastic resin or a resin composition including the thermoplastic resin, to each other, the method comprising. The manufacturing method of a metal/resin composite structure includes a first step of applying a metal plating layer that is formed of a metal having smaller ionization tendency than ionization tendency of iron and including a roughened surface on a side opposite to a surface to be in contact with the steel member, to at least a bonding portion surface of the steel member to be bonded to the thermoplastic resin member; a second step of processing at least the surface of the metal plating layer with inorganic acid; and a step of molding the thermoplastic resin member and bonding the steel member and the thermoplastic resin member, so that at least a part of the thermoplastic resin member is in contact with the bonding portion surface of the steel member.

The present invention provides a methodology of making lead foam by an electrochemical process in which non-conducting poly urethane foam was metalized using palladium chloride solution which was then coated with lead using the plating bath containing fluoboric acid, Lead as fluoborate solutions, boric acid and urea. The process was operated at a current density ranging from 0.5 A/dm.sup.2 to 5 A/dm.sup.2, bath pH from 0.5 to 2.0, at temperature range from 30 C. to 50 C., followed with suitable post plating treatments. The surface morphology of the lead foam thus obtained was studied. The composition and purity of the lead foam was characterized with XRD. The porosity obtained depends upon the rate of deposition. The average value of the porosity realized in the range 86-79% with respect to time of deposition 2-6 h and the corresponding thickness of 45 to 60 micron.