An aqueous acidic copper electroplating bath that produces a satin deposit includes a source of copper ions, an acid, a satin additive, and optionally one or more acidic copper electroplating bath additive(s), wherein the satin additive includes a block copolymer with the structure of RO(EO)m(PO)nH.

A method for fabricating a circuit board comprises preparing an elastomeric substrate having a roughened surface. The elastomeric substrate is stretched before an electrically conductive material is electrolessly deposited onto the roughened surface. A suitable amount of electrically conductive material is deposited onto the elastomeric substrate before the elastomeric substrate is released from its stretch.

A method for fabricating a circuit board comprises preparing an elastomeric substrate having a roughened surface. The elastomeric substrate is stretched before an electrically conductive material is electrolessly deposited onto the roughened surface. A suitable amount of electrically conductive material is deposited onto the elastomeric substrate before the elastomeric substrate is released from its stretch.

The present disclosure provides an electroplating method, comprising providing an electroplating solution, wherein the electroplating solution includes an effective microorganisms aqueous solution and metal chloride; disposing a workpiece, wherein at least a part of the workpiece is in contact with the electroplating solution; and performing an electroplating process to electroplate metal of the metal chloride onto the workpiece.

The present disclosure provides an electroplating method, comprising providing an electroplating solution, wherein the electroplating solution includes an effective microorganisms aqueous solution and metal chloride; disposing a workpiece, wherein at least a part of the workpiece is in contact with the electroplating solution; and performing an electroplating process to electroplate metal of the metal chloride onto the workpiece.

Provided is a valve seat insert for an internal combustion engine, which has both an excellent heat dissipation property and excellent wear resistance. The valve seat insert for an internal combustion engine is used while being press-fitted into an aluminum alloy cylinder head, is made of an iron-based sintered alloy, is formed by integrating two layers of a functional member side layer and a supporting member side layer, and has a plating film on at least an outer peripheral side. The plating film is preferably a copper plating film. The plating film is a plating film having a thickness of 1 to 100 μm and a hardness of 50 to 300 HV, and the hardness of the plating film is adjusted so as to satisfy a range of 1.05 to 4.5 times hardness of the cylinder head in Vickers hardness HV. Pores contained in the valve seat insert are preferably sealed with a curable resin before plating treatment. Consequently, a valve seat insert for an internal combustion engine which does not go through complicated processes, is not accompanied by a significant decrease in wear resistance compared with the prior art, and has an excellent heat dissipation property is provided. If a roughened surface region is further formed at at least one portion on the outer peripheral surface of the valve seat insert in addition to the plating film, a falling out resistance property is improved. The same effect can be obtained even if the valve seat insert is a single layer of only the functional member side layer.

The invention relates to a composition and a process for the deposition of conductive polymers on dielectric substrates. In particular, the invention relates to a composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising at least one polymerizable monomer which is capable to form a conductive polymer, an emulsifier and an acid, characterized in that the composition comprises at least one metal-ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, boron-ions, indium-ions and alkyl imidazolium-ions. The acid is typically a high molecular weight polymeric acid having molecular weight of at least 500,000 Da including, for example, polystyrene sulfonic acid having a molecular weight of approximately 1,000,000 Da.

To provide a manufacturing method of a laminate body, including: a step of forming onto a supporting body a curable resin composition layer formed from a thermosetting resin composition to obtain a curable resin composition layer with a supporting body; a step of laminating the curable resin composition onto a substrate on a curable resin composition layer forming surface side to obtain a pre-cured composite with a supporting body formed from a substrate and a curable resin composition layer with a supporting body; a step of performing a first heating of the pre-cured composite and thermally curing the curable resin composition layer to obtain a cured composite with a supporting body formed from a substrate and a cured resin layer with a supporting body; a step of performing hole punching from the supporting body side of the cured composite with a supporting body to form a via hole in the cured resin layer; step of removing resin residue in the via hole of the cured composite with a supporting body; a step of peeling the supporting body from the cured composite with a supporting body to obtain a cured composite formed from a substrate and a cured resin layer, and a step of forming a dry plated conductor layer by dry plating on an inner wall surface of the via hole of the cured composite and on the cured resin layer.

To provide a manufacturing method of a laminate body, including: a step of forming onto a supporting body a curable resin composition layer formed from a thermosetting resin composition to obtain a curable resin composition layer with a supporting body; a step of laminating the curable resin composition onto a substrate on a curable resin composition layer forming surface side to obtain a pre-cured composite with a supporting body formed from a substrate and a curable resin composition layer with a supporting body; a step of performing a first heating of the pre-cured composite and thermally curing the curable resin composition layer to obtain a cured composite with a supporting body formed from a substrate and a cured resin layer with a supporting body; a step of performing hole punching from the supporting body side of the cured composite with a supporting body to form a via hole in the cured resin layer; step of removing resin residue in the via hole of the cured composite with a supporting body; a step of peeling the supporting body from the cured composite with a supporting body to obtain a cured composite formed from a substrate and a cured resin layer, and a step of forming a dry plated conductor layer by dry plating on an inner wall surface of the via hole of the cured composite and on the cured resin layer.

A photovoltaic cell is proposed. The photovoltaic cell includes a substrate of semiconductor material, and a plurality of contact terminals each one arranged on a corresponding contact area of the substrate for collecting electric charges being generated in the substrate by the light. For at least one of the contact areas, the substrate includes at least one porous semiconductor region extending from the contact area into the substrate for anchoring the whole corresponding contact terminal on the substrate. In the solution according to an embodiment of the invention, each porous semiconductor region has a porosity decreasing moving away from the contact area inwards the substrate. An etching module and an electrolytic module for processing photovoltaic cells, a production line for producing photovoltaic cells, and a process for producing photovoltaic cells are also proposed.