Patent classifications
C25D3/48
ELECTROCHEMICAL ANALYSIS OF METALLIC DEPOLARIZERS IN GOLD ELECTRODEPOSITION
The present disclosure provides methods for determining concentration of various trace metal ions in aqueous solutions, such as gold plating solutions. At a particular fixed reduction potential, the cathodic current can suddenly increase in magnitude after a certain period of time (e.g., an incubation time) passes in the presence of a trace metal ion (e.g., Tl(I)), where the incubation time is inversely proportional to the concentration of trace metal in the electrolyte. The concentration of the trace metal can be calculated after measuring the incubation time and comparing it against a calibration curve.
High aspect ratio gratings fabricated by electrodeposition
A method is provided for making gratings of gold or other metal in silicon substrates. The disclosed method may achieve high aspect ratios. According to the disclosed method, a silicon wafer is through-etched. A seed layer of metal is vapor-deposited on one side of the wafer, and a layer of metal is electrodeposited on the seed layer. The electrodeposited metal plugs the trenches and provides a conductive surface for subsequent electrodeposition. The trenches are then filled by electrodeposition from within the trenches, so that the walls of the metal grating grow on the metal plugs.
High aspect ratio gratings fabricated by electrodeposition
A method is provided for making gratings of gold or other metal in silicon substrates. The disclosed method may achieve high aspect ratios. According to the disclosed method, a silicon wafer is through-etched. A seed layer of metal is vapor-deposited on one side of the wafer, and a layer of metal is electrodeposited on the seed layer. The electrodeposited metal plugs the trenches and provides a conductive surface for subsequent electrodeposition. The trenches are then filled by electrodeposition from within the trenches, so that the walls of the metal grating grow on the metal plugs.
ELECTROCHEMICAL SENSOR FOR SIMULTANEOUS DETECTION AND MEASUREMENT OF MULTIPLE PHARMACEUTICALS
Provided herein are devices and systems for measuring a dosage of a medication used by a subject. Further provided herein are methods, systems, and media for dosing regulation and prescription compliance.
ELECTROCHEMICAL SENSOR FOR SIMULTANEOUS DETECTION AND MEASUREMENT OF MULTIPLE PHARMACEUTICALS
Provided herein are devices and systems for measuring a dosage of a medication used by a subject. Further provided herein are methods, systems, and media for dosing regulation and prescription compliance.
ELECTRODEPOSITED METAL MODIFIED LASER SCRIBED GRAPHENE ELECTRODE AND METHOD
A biomarker detection sensor includes a substrate; a working electrode formed by laser-scribing directly into the substrate so that a material of the substrate is transformed into graphene; a metal nanostructure formed on a graphene surface of the working electrode, wherein the metal nanostructure is shaped as a tree with plural branches extending away from the graphene surface; an aptamer covering a first surface area of the metal nanostructure; a reference electrode; and a counter electrode.
ELECTRODEPOSITED METAL MODIFIED LASER SCRIBED GRAPHENE ELECTRODE AND METHOD
A biomarker detection sensor includes a substrate; a working electrode formed by laser-scribing directly into the substrate so that a material of the substrate is transformed into graphene; a metal nanostructure formed on a graphene surface of the working electrode, wherein the metal nanostructure is shaped as a tree with plural branches extending away from the graphene surface; an aptamer covering a first surface area of the metal nanostructure; a reference electrode; and a counter electrode.
Layered Plating Stack for Improved Contact Resistance in Corrosive Environments
A layered plating stack which includes an underlying plating layer formed on a substrate; an intermediate plating layer; an outer plating layer; and at least one strike layer of noble metal. The noble metal of the strike layer is a different metal than the metal of the intermediate plating layer. The layered plating stack with the strike layer maintains contact resistance of below 25 mohms when tested under a load of at least approximately 30 grams after 1 or more days of exposure to a gaseous environment which includes Cl.sub.2, NO.sub.2 and SO.sub.2. The layered plating stack with the strike layer also maintains a contact resistance of below 25 mohms when tested under a load of at least approximately 30 grams with a wipe of at least approximately 0.1 mm after exposure to a gaseous environment which includes one or more of H.sub.2S, Cl.sub.2, NO.sub.2 and SO.sub.2.
Layered Plating Stack for Improved Contact Resistance in Corrosive Environments
A layered plating stack which includes an underlying plating layer formed on a substrate; an intermediate plating layer; an outer plating layer; and at least one strike layer of noble metal. The noble metal of the strike layer is a different metal than the metal of the intermediate plating layer. The layered plating stack with the strike layer maintains contact resistance of below 25 mohms when tested under a load of at least approximately 30 grams after 1 or more days of exposure to a gaseous environment which includes Cl.sub.2, NO.sub.2 and SO.sub.2. The layered plating stack with the strike layer also maintains a contact resistance of below 25 mohms when tested under a load of at least approximately 30 grams with a wipe of at least approximately 0.1 mm after exposure to a gaseous environment which includes one or more of H.sub.2S, Cl.sub.2, NO.sub.2 and SO.sub.2.
COATED WIRE
A wire comprising a silver-based wire core having a double-layer coating comprised of an inner layer of palladium or nickel and an adjacent outer layer of gold, wherein the wire exhibits at least one of the intrinsic properties A1) to A3): A1) the average grain size of the crystal grains in the wire core, measured in longitudinal direction, is in the range of from 0.7 to 1.1 μm; A2) the fraction of twin boundaries, measured in longitudinal direction of the wire, is in the range of from 5 to 40%; and, A3) 20 to 70% of the crystal grains of the wire core are oriented in <100> direction, and 3 to 40% of the crystal grains of the wire core are oriented in <111> direction, each % with respect to the total number of crystal grains with orientation parallel to the drawing direction of the wire.