ELECTROCHEMICAL ANALYSIS OF METALLIC DEPOLARIZERS IN GOLD ELECTRODEPOSITION
20230280305 · 2023-09-07
Assignee
Inventors
- Patrick Saitta (New York, NY, US)
- Jingjing Wang (Livingston, NJ, US)
- Eugene Shalyt (Washington Township, NJ, US)
Cpc classification
G01N27/49
PHYSICS
G01N27/4161
PHYSICS
G01N27/4163
PHYSICS
G01N27/42
PHYSICS
International classification
Abstract
The present disclosure provides methods for determining concentration of various trace metal ions in aqueous solutions, such as gold plating solutions. At a particular fixed reduction potential, the cathodic current can suddenly increase in magnitude after a certain period of time (e.g., an incubation time) passes in the presence of a trace metal ion (e.g., Tl(I)), where the incubation time is inversely proportional to the concentration of trace metal in the electrolyte. The concentration of the trace metal can be calculated after measuring the incubation time and comparing it against a calibration curve.
Claims
1. A method for determining concentration of a metal ion, the method comprising: providing an aqueous solution comprising a first metal ion; performing a first amperometric scan to obtain a chronoamperometric voltammogram; calculating a first derivative of the chronoamperometric voltammogram; calculating concentration of the metal ion by comparing the first derivative of the chronoamperometric voltammogram to a calibration curve.
2. The method of claim 1, wherein the first metal ion is selected from the group consisting of As, Bi, Cd, Cu, Ga, Hg, Pb, Sb, Sn, Tl, Zn, Te, SeCN(−).
3. The method of claim 1, wherein the first metal ion is Tl(I).
4. The method of claim 1, wherein the aqueous solution is a gold plating solution comprising gold (I) ions.
5. The method of claim 1, wherein the concentration of the first metal ion is from about 0.1 to about 1000ppm.
6. The method of claim 4, wherein the ratio of the first metal ion to the gold (I) ions is from about 1:300 to about 1:5000.
7. The method of claim 1, wherein the calibration curve is prepared by: (i) providing a first test aqueous solution comprising a known concentration of the first metal ion; (ii) performing an amperometric scan to obtain a first test chronoamperometric voltammogram; (iii) calculating a first derivative of the first test chronoamperometric voltammogram; and optionally repeating (i)-(iii) using a test aqueous solution having a different concentration that the first test aqueous solution.
8. The method of claim 1, wherein the aqueous solution comprises sulfate ions, sulfite ions, or combinations thereof.
9. The method of claim 1, wherein the method comprises stripping plated metals from a working electrode.
10. The method of claim 1, wherein the first amperometric scan is performed at a fixed potential of −0.6V for 30-300 seconds with a rotation speed of 1000-4000 rpm.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
[0024]
[0025]
[0026]
[0027]
[0028]
DETAILED DESCRIPTION
[0029] The present disclosure provides a method for determining a concentration of a metal ion. To address the foregoing needs, the present disclosure provides a method for determining trace levels of various metal ions in aqueous samples such as but not limited to gold plating solutions. As used herein, the “trace levels” include a range of from 0.1 ppm to 1000 ppm.
[0030] For clarity, but not by way of limitation, the detailed description of the presently disclosed subject matter is divided into the following subsections: [0031] I. Definitions [0032] II. Methods for Detecting Trace Ions
I. DEFINITIONS
[0033] The terms used in this specification generally have their ordinary meanings in the art, within the context of this disclosure and in the specific context where each term is used. Certain terms are discussed below, or elsewhere in the specification, to provide additional guidance to the practitioner in describing the compositions and methods of the present disclosure and how to make and use them.
[0034] For purposes of interpreting this specification, the following definitions will apply and whenever appropriate, terms used in the singular will also include the plural and vice versa. In the event that any definition set forth below conflicts with any document incorporated herein by reference, the definition set forth below shall control.
[0035] As used herein, the use of the word “a” or “an” when used in conjunction with the term “comprising” in the claims and/or the specification can mean “one,” but it is also consistent with the meaning of “one or more,” “at least one,” and “one or more than one.”
[0036] The terms “comprise(s),” “include(s),” “having,” “has,” “can,” “contain(s),” and variants thereof, as used herein, are intended to be open-ended transitional phrases, terms or words that do not preclude additional acts or structures. The present disclosure also contemplates other embodiments “comprising,” “consisting of” and “consisting essentially of,” the embodiments or elements presented herein, whether explicitly set forth or not.
[0037] As used herein, the term “about” or “approximately” means within an acceptable error range for the particular value as determined by one of ordinary skill in the art, which will depend in part on how the value is measured or determined, i.e., the limitations of the measurement system. For example, “about” can mean within 3 or more than 3 standard deviations, per the practice in the art. Alternatively, “about” can mean a range of up to 20%, preferably up to 10%, more preferably up to 5%, and more preferably still up to 1% of a given value.
[0038] As used herein, the term “high level” when used in context of a concentration of a metal ion in a solution refers to a concentration in the range of grams per liter (g/L).
[0039] As used herein, the term “low level” when used in context of a concentration of a metal ion in a solution refers to a concentration in the range of parts per million (ppm).
[0040] Grain refiner, as used herein, has its ordinary meaning in the art of electroplating, i.e., it is additive that helps to control electroplating process by being attracted to “high points” on the plated surface. Left untreated, the high points would tend to attract more metal deposition compared to lower points resulting in a rough surface. A grain refiner inhibits further deposition. As these points are replaced by other higher points the grain refiner will drift away and reposition itself.
[0041] The term “trace”, as used herein, refers to a concentration less than 1000 ppm. In certain embodiments, trace levels refer to a concentration range of from 0.1 ppm to 1000 ppm.
[0042] The term chelated, as used herein, refers to a metal ion that is chemically bonded to an ion or a molecule by a coordinate bonding.
II. Methods for Detecting Trace Ions
[0043] The present disclosure provides an accurate, fast, and easy-to-use method for determining trace levels of various metal ions in aqueous samples. In certain embodiments, the trace metal ions are As, Bi, Cd, Cu, Ga, Hg, Pb, Sb, Sn, Tl, Zn, Te, SeCN(−). In certain embodiments, the trace metal ion is Tl. In certain embodiments, the trace metal ion is Tl(I).
[0044] In certain embodiments, the aqueous sample is a gold electroplating solution. In certain embodiments, the gold level is more than 1000-fold higher than the level of the trace metal ion, such as but not limited to Tl(I). As would be readily known by a person of ordinary skill in the art, the presence of gold ions in the solution interferes with detecting trace metal ions, such as Tl(I). In certain embodiments, the gold plating solution includes other species that can interfere with detecting trace metal ions, such as Tl(I), including sulfate ions (SO.sub.4.sup.2-), and sulfite ions (SO.sub.3.sup.2-).
[0045] The method of the present disclosure combines multiple elements to determine trace levels of various metal ions. In certain embodiments, the method includes deriving analytical signals from the electrodeposition experiments. Such a method contrasts with the methods known in the art that implement stripping as a part of the experiment. In certain embodiments, the method also includes the use of electrochemical etching for the electrode surface recovery in a separate electrolyte rather than electrochemical stripping from the same metal electrolyte for electrodeposition experiments. In certain embodiments, the method further includes deriving analytical signals based on the incubation time rather than suppression/acceleration ratio, as found in CVS methods commonly described in the art. In certain embodiments, the method disclosed herein is sensitive, selective, inexpensive, rapid, and free from various interfering ions. Furthermore, the presently disclosed method does not require procedures that are difficult to be automated, such as but not limited to organic solvent extraction or sample heating.
[0046] In certain embodiments, when the trace metal is detected in a gold electroplating solution, there are four (4) main cathodic reactions possible: generation of H.sub.2 from hydronium ion, generation of H.sub.2 from water, electrodeposition of the trace metal ion, and electrodeposition of gold. Each of these electrochemical reactions is shown below as equations 1-4. For purposes of illustration, the trace metal is Tl(I), but it can be any one of As, Bi, Cd, Cu, Ga, Hg, Pb, Sb, Sn, Zn, Te, and SeCN(−).
2H.sup.+2e.sup.−.fwdarw.H.sub.2E.sub.0=0V (1)
2H.sub.2O+2e.sup.−.fwdarw.H.sub.2+2OH.sup.−E.sub.0=−0.83V (2
Tl.sup.++e.sup.−.fwdarw.TlE.sub.0=−0.34V (3)
Au.sup.++e.sup.−.fwdarw.AuE.sub.0=1.691V (4)
[0047] Although based on the reduction potential, the electrodeposition of Au(I) appears to be favorable, this metal ion is typically chelated, which shifts the reduction potential to the negative region. Therefore, only the evolution of hydrogen (as shown in Equations 1 and 2) and the trace metal ion's deposition on the electrode surface occur at the initial time of polarization. In certain embodiments, as shown in Equation 3, the trace metal ion is Tl(I). The rate of electrodeposition is mass-transport limited, and therefore, a rotating disc electrode is used to induce a flux of analyte to the electrode. The rate of electrodeposition of the metal ion, such as but not limited to Tl(I), is described by Levich equation (5) shown below:
I.sub.L=(0.62)nFAD.sup.2/3ω.sup.1/2v.sup.−1/6C (5)
[0048] I.sub.L is the Levich current, n is the number of moles of electrons transferred in the half reaction (number), F is the Faraday constant (C/mol), A is the electrode area (cm.sub.2), D is the diffusion coefficient (see Fick's law of diffusion) (cm.sup.2/s), ω is the angular rotation rate of the electrode (rad/s), v is the kinematic viscosity (cm.sup.2/s), C is the analyte concentration (mol/cm.sup.3). In this form of the equation, the constant with a value of 0.620 has units of rad.sup.−1/2. It is noted that current (I) is proportional to the concentration of the trace metal and electrode surface area.
[0049] Faraday equation (6) provides that the mass of electrodeposited trace metal ion per electrode surface is proportional to its bulk concentration*time. If it is assumed that a monolayer of the trace metal is formed on the electrode, the surface coverage is also proportional to the bulk concentration*time.
m=zIt (6)
[0050] In this equation, m is the mass of the electrodeposited metal, z is the electrochemical equivalent, I is the current and t is time.
[0051] It has unexpectedly been found that there is a critical value of the trace metal coverage at which the electrodeposition current suddenly accelerates under certain conditions (e.g., proper potential). The time to reach this critical surface coverage is referred to herein as “incubation time.” Incubation time can be experimentally determined by the duration of time from the beginning of electroplating to the first derivative of the current reaching maximum absolute value in the amperometric scan. It is inversely proportional to the concentration of trace metal (e.g., Tl(I)) in the electrolyte. The present disclosure, therefore, provides a method of measuring the incubation time and correlating it to the concentration of the trace metal, such as, but not limited to Tl(I).
[0052] In certain embodiments, the present disclosure provides a method to measure trace metal ions, such as, but not limited to Tl(I) with error <5% and relative standard deviation (RSD) <3%.
[0053] In certain embodiments, after collecting a measurement, the electrode is covered with a film of electrodeposited metal, which should be removed to provide a clean surface thereby enabling a new round of sample analysis. This can be done by one or the combination of the following: mechanical removal, e.g., by polishing, chemical etching, and electrochemical etching method. In certain embodiments, it can be beneficial to perform chemical/electrochemical etching in a special etching solution rather than the analytical solution used for the analytical scan. Composition of such cleaning solution(s) can include one or more strong oxidizer (unless oxidation achieved electrochemically), and strong chelators to keep the etched metal soluble. Examples of strong oxidizers include but are not limited to aqua regia (a mixture of nitric acid and hydrochloric acid, optimally in a molar ratio of 1:3), and hydrogen peroxide. Examples of strong chelators suitable for the method of the present disclosure include but are not limited to thiocyanide and thiourea.
[0054] Although the method of measuring trace materials has been described in connection with gold plating solutions, it is also suitable for generic analysis of trace metal ions, such as but not limited to Tl, in other aqueous samples.
EXAMPLES
[0055] The presently disclosed subject matter will be better understood by reference to the following Example, which is provided as exemplary of the presently disclosed subject matter, and not by way of limitation.
Example 1: Detection of Tl (I) in Gold Plating Solution
[0056] Example 1 provides a protocol for determining Tl(I) concentrations in a gold plating solution according to certain embodiments of the present disclosure. Example 1 also describes the preparation of a calibration curve that can be used to determine the concentration of Tl(I) ions in an aqueous gold plating solution.
[0057] Au plating sample solution containing Tl(I) was added to a beaker with 25 mL of supporting electrolyte composed of 20-80 g/L of sulfite as in sodium sulfite (pH 6-10), and the solution was mixed. Three electrodes were prepared for an amperometric scan: a platinum rotating disk electrode, a stainless steel auxiliary electrode, and a Ag/AgCl reference electrode. The three electrodes were then placed in the beaker, and a first amperometric scan was performed at a fixed potential of −0.6V for a duration of 30-300 seconds with a rotation speed of 1000-4000 rpm. The electrodes were then removed from the beaker and cleaned with deionized water (DI water) twice. Au deposit on the Pt working electrode was removed by electrochemical oxidation in presence of thiocyanide chelator.
[0058] Incubation time (T_sample) was obtained by calculating the first derivative of the chronoamperometric voltammogram obtained from the first amperometric scan after noise reduction processing of the raw signal using filters such as the Savitzky—Golay filter. Tl(I) concentration was subsequently calculated based on T_sample against the calibration curve, which was prepared as described below.
[0059] The calibration curves were prepared by scanning samples containing known Tl(I) concentrations. TlNO.sub.3 or Tl.sub.2(SO.sub.4) were used as sources for Tl(I) ions. A solution containing 25 mL of supporting electrolyte Na.sub.3[Au(SO.sub.3).sub.2] (Au=1 g/L) and Na.sub.2SO.sub.3 was combined with a test solution with Tl(I) ions. Platinum rotating disk electrode, stainless steel auxiliary electrode, and Ag/AgCl reference electrode were placed in the solution. An amperometric scan was performed at a fixed potential of −0.6V for 30 seconds with a rotation speed of 1000-4000 rpm. As shown in
[0060] After preparation of the calibration curves, five (5) samples were prepared as shown in Table 1:
TABLE-US-00001 TABLE 1 Composition of standard samples tested Au, g/L [SO.sub.3].sup.2−, g/L Sample ID (as in Na.sub.3[Au(SO.sub.3).sub.2] (as in Na.sub.2SO.sub.3) Tl, ppm Sample#1 13 20 20 Sample#2 15 40 30 Sample#3 17 90 40 Sample#4 17 90 20 Sample#5 13 20 40
[0061] Each of the samples was then tested as described above, and the results are shown in Table 2. As shown in Table 2, an additional sample was tested, including a composition as shown in the “Sample#2” sample spiked with a large amount of sulfate. As shown in Table 2, the measurement was not affected by the presence of sulfate ions, which is important since sulfate ions are the main byproducts of the gold sulfite plating bath, formed by the oxidation of sulfite ions.
TABLE-US-00002 TABLE 2 Analysis results of standard samples. Sample #2 spiked with Sample Sample Sample Sample Sample 80 g/L #1 #2 #3 #4 #5 SO.sub.4.sup.2- Expected, 20 30 40 20 40 30 ppm Measured 19.43 30.50 38.80 19.18 38.77 30.04 #1, ppm Measured 19.85 30.66 40.46 NA NA #2, ppm Measured 19.64 30.58 39.63 19.18 38.77 30.04 average, ppm Accuracy −1.79% 1.93% −0.92% −4.08% −3.08% 0.13% RSD 1.49% 0.38% 2.96%
[0062] As shown in Table 2, the present method provided very accurate measurements of Tl(I) in the aqueous gold plating solution.
[0063] The process was then repeated with another sample (“Process Sample”) of unknown Tl(I) concentration. Three samples were taken—the first sample was tested as it was (Process Sample (PS), the second sample was spiked with 10 ppm of Tl(I) ions (PS spiked with 10 ppm
[0064] T1), and the third sample was 75% diluted with DI water (PS_75% diluted with DIW), as shown in Table 3.
TABLE-US-00003 TABLE 3 Analysis results Process Sample, the Process Sample spiked with pure Tl(I) and the Process Sample diluted with DI water. Process PS spiked with PS_75% diluted Sample (PS) 10 ppm Tl with DIW Expected, ppm NA 42.48 24.36 Measured, ppm 32.48 42.86 24.26 Accuracy NA 0.90% −0.44%
[0065] As shown in Table 3, the Process Sample was measured to have 32.48 ppm of Tl(I). The sample, which was spiked with 10 ppm of Tl(I), was measured to have a concentration of 42.86, which is about 0.90% difference from the expected. When the Process Sample was 75% diluted with DI water, the measured concentration was 24.26ppm, which was only 0.44% different from the predicted 24.36 ppm.
[0066] Chronoamperometry graphs and first derivatives thereof of the samples shown in Tables 2 and 3 are shown in
[0067] Table 4 shows the analysis results of a set of gold plating samples where the Au level variation in these samples was much larger than the sample set in Table 1, and Tl concentration was lower than in the samples shown in Table 1. The samples were tested using the procedure stated above. It was observed that the Au level in the sample affects the incubation time to a much smaller extent than Tl. It was found that a 75% variation of Au concentration in samples (Au range/middle point value) caused a deviation of about 9% in the inverse of incubation time. When the Au variation is less than 45% in a set of samples, the analysis error is less than 5%; therefore, the effect of Au can be ignored. The example is the sample set in Table 1. Otherwise, the signal should be compensated based on the analytical result of Au.
[0068] Different approaches can be employed, such as adding a suitable amount of Au into the supporting electrolyte to keep the Au concentration constant across different samples or multivariant analysis with Au concentration as a variable in addition to the incubation time. The latter approach was applied in the 2.sup.nd sample set in Table 4:
TABLE-US-00004 TABLE 4 Analysis results of Samples with Increased Variation of Au Levels. Sam- Sam- Sam- Sam- Sam- ple#6 ple#7 ple#8 ple#9 ple#10 Au prepared, g/L 10 16 22 22 10 Tl Expected, ppm 5 12 20 5 20 Tl Measured #1, 5.00 12.41 19.93 4.84 19.82 ppm Tl Measured #2, 5.15 12.33 20.21 4.79 19.65 ppm Tl Measured 5.08 12.37 20.07 4.81 19.73 average, ppm Accuracy 1.58% 3.11% 0.36% −3.76% −1.33% RSD 2.07% 0.45% 1.00% 0.68% 0.61%
[0069] Although the presently disclosed subject matter and its advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the disclosed subject matter. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, and composition of matter, methods and processes described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosed subject matter of the presently disclosed subject matter, processes, machines, manufacture, compositions of matter, methods, or procedures, presently existing or later to be developed that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the presently disclosed subject matter. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, methods, or procedures.
[0070] Various patents, patent applications, publications, product descriptions, protocols, and sequence accession numbers are cited throughout this application, the inventions of which are incorporated herein by reference in their entireties for all purposes.