A coating made of platinum-gold alloy is provided, together with a method of its preparation by electrodeposition. The alloy is composed of more than 50 atomic percent platinum. The microstructure of the alloy consists of generally ellipsoidal grains. More than half of the grains have a major axis of 10 nm or less.

Method and apparatus are provided for electroplating a surface area of an internal wall defining a cooling cavity present in a gas turbine engine component.

Method and apparatus are provided for electroplating a surface area of an internal wall defining a cooling cavity present in a gas turbine engine component.

Proposed are an anodic aluminum oxide mold capable of manufacturing a molded article having at least a portion with a dimensional range of several tens of μm, and a mold structure including the same. Additionally, proposed are a method of manufacturing a molded article with a dimensional range of several tens of μm using the anodic aluminum oxide mold, and a molded article manufactured thereby.

A terminal fitting having a smaller terminal insertion force than before. The terminal fitting includes a backing material made of a metal material and a plating coating covering a surface of the backing material. The plating coating contains a Sn parent phase and Sn—Pd based particles dispersed in the Sn parent phase and includes an outermost layer having an outer surface in which the Sn parent phase and the Sn—Pd based particles are present. Further, the number of the Sn—Pd based particles present in the outer surface of the plating coating in a state where only the Sn parent phase is removed is 10 to 400 Sn—Pd based particles per 500 μm.sup.2.

A terminal fitting having a smaller terminal insertion force than before. The terminal fitting includes a backing material made of a metal material and a plating coating covering a surface of the backing material. The plating coating contains a Sn parent phase and Sn—Pd based particles dispersed in the Sn parent phase and includes an outermost layer having an outer surface in which the Sn parent phase and the Sn—Pd based particles are present. Further, the number of the Sn—Pd based particles present in the outer surface of the plating coating in a state where only the Sn parent phase is removed is 10 to 400 Sn—Pd based particles per 500 μm.sup.2.

The printed circuit board for the memory card includes an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.

The printed circuit board for the memory card includes an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.

The invention relates to a metal sheet which has a plurality of parts to be plated, a frame part and connector parts connecting the parts to be plated and the frame part and in which the plurality of the parts to be plated, the frame part and the connector parts are made of a metal.

The invention relates to a metal sheet which has a plurality of parts to be plated, a frame part and connector parts connecting the parts to be plated and the frame part and in which the plurality of the parts to be plated, the frame part and the connector parts are made of a metal.