C25D3/50

SYSTEMS AND METHODS FOR PROCESSING ASH

Disclosed herein are systems and methods for processing ash. For example, in certain embodiments, the method comprises dissolving at least a portion of ash in acid. In some embodiments, the acid is produced in a reactor. In some embodiments, dissolving at least a portion of ash in acid produces refined silica (SiO.sub.2) (e.g., amorphous silica, substantially pure silica, and/or a substantial amount of silica). According to certain embodiments, the ash can be further processed (e.g., using electro winning, pH-based precipitation, and/or electrorefining) to obtain other components instead of or in addition to refined silica.

Palladium plating solution and plating method

The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound: one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.

Palladium plating solution and plating method

The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound: one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.

ELECTROCHEMICAL SENSOR FOR SIMULTANEOUS DETECTION AND MEASUREMENT OF MULTIPLE PHARMACEUTICALS

Provided herein are devices and systems for measuring a dosage of a medication used by a subject. Further provided herein are methods, systems, and media for dosing regulation and prescription compliance.

ELECTROCHEMICAL SENSOR FOR SIMULTANEOUS DETECTION AND MEASUREMENT OF MULTIPLE PHARMACEUTICALS

Provided herein are devices and systems for measuring a dosage of a medication used by a subject. Further provided herein are methods, systems, and media for dosing regulation and prescription compliance.

Layered Plating Stack for Improved Contact Resistance in Corrosive Environments

A layered plating stack which includes an underlying plating layer formed on a substrate; an intermediate plating layer; an outer plating layer; and at least one strike layer of noble metal. The noble metal of the strike layer is a different metal than the metal of the intermediate plating layer. The layered plating stack with the strike layer maintains contact resistance of below 25 mohms when tested under a load of at least approximately 30 grams after 1 or more days of exposure to a gaseous environment which includes Cl.sub.2, NO.sub.2 and SO.sub.2. The layered plating stack with the strike layer also maintains a contact resistance of below 25 mohms when tested under a load of at least approximately 30 grams with a wipe of at least approximately 0.1 mm after exposure to a gaseous environment which includes one or more of H.sub.2S, Cl.sub.2, NO.sub.2 and SO.sub.2.

Layered Plating Stack for Improved Contact Resistance in Corrosive Environments

A layered plating stack which includes an underlying plating layer formed on a substrate; an intermediate plating layer; an outer plating layer; and at least one strike layer of noble metal. The noble metal of the strike layer is a different metal than the metal of the intermediate plating layer. The layered plating stack with the strike layer maintains contact resistance of below 25 mohms when tested under a load of at least approximately 30 grams after 1 or more days of exposure to a gaseous environment which includes Cl.sub.2, NO.sub.2 and SO.sub.2. The layered plating stack with the strike layer also maintains a contact resistance of below 25 mohms when tested under a load of at least approximately 30 grams with a wipe of at least approximately 0.1 mm after exposure to a gaseous environment which includes one or more of H.sub.2S, Cl.sub.2, NO.sub.2 and SO.sub.2.

COATED WIRE
20230374690 · 2023-11-23 ·

A wire comprising a silver-based wire core having a double-layer coating comprised of an inner layer of palladium or nickel and an adjacent outer layer of gold, wherein the wire exhibits at least one of the intrinsic properties A1) to A3): A1) the average grain size of the crystal grains in the wire core, measured in longitudinal direction, is in the range of from 0.7 to 1.1 μm; A2) the fraction of twin boundaries, measured in longitudinal direction of the wire, is in the range of from 5 to 40%; and, A3) 20 to 70% of the crystal grains of the wire core are oriented in <100> direction, and 3 to 40% of the crystal grains of the wire core are oriented in <111> direction, each % with respect to the total number of crystal grains with orientation parallel to the drawing direction of the wire.

COATED WIRE
20230374690 · 2023-11-23 ·

A wire comprising a silver-based wire core having a double-layer coating comprised of an inner layer of palladium or nickel and an adjacent outer layer of gold, wherein the wire exhibits at least one of the intrinsic properties A1) to A3): A1) the average grain size of the crystal grains in the wire core, measured in longitudinal direction, is in the range of from 0.7 to 1.1 μm; A2) the fraction of twin boundaries, measured in longitudinal direction of the wire, is in the range of from 5 to 40%; and, A3) 20 to 70% of the crystal grains of the wire core are oriented in <100> direction, and 3 to 40% of the crystal grains of the wire core are oriented in <111> direction, each % with respect to the total number of crystal grains with orientation parallel to the drawing direction of the wire.

STABLE HYDROGEN EVOLUTION ELECTROCATALYST BASED ON 3D METAL NANOSTRUCTURES ON A TI SUBSTRATE

The present invention relates to an electrocatalyst comprising a Ti substrate coated with a 3D Cu nanostructured matrix decorated with a mixture of amorphous TiO.sub.2 and nanoparticles of a noble metal, preferably Pt nanoparticles, an electrochemical cell comprising said electrocatalyst and their use for hydrogen production via hydrogen evolution reaction (HER) in basic conditions. The present invention also refers to an in situ process for the preparation of said electrocatalyst and simultaneous production of hydrogen, comprising the steps of: (a) providing an electrochemical cell having a 3-electrode configuration comprising a starting working electrode which comprises a Ti substrate coated with vertically oriented CuO nanoplatelets, the cell further comprising a counter electrode and a reference electrode; (b) adding an aqueous basic electrolyte solution to the cell of step (a), said aqueous basic electrolyte solution comprising a precursor of a noble metal, preferably a Pt precursor; (c) applying a negative potential with respect to the reference electrode to the cell of step b).

The present invention also refers to a process for producing hydrogen which utilizes the electrochemical cell comprising the electro-catalyst according to the invention.