Disclosed herein is a system, comprising: a detector configured to determine a number of photons of one or more characteristic X-rays emitted by a chemical element in the electrolyte and received by the detector, within a period of time; a processor configured to determine a concentration of the chemical element in the electrolyte based on the number; a controller configured to replenish the chemical element into the electrolyte or configured to stop electroplating with the electrolyte, based on the concentration.

There is provided an inexpensive plated product, which can prevent the increase of the contact resistance of a silver-plating film and the change of the color of the surface thereof after reflow-treating a plated product wherein the silver-plating film is formed on a portion of the surface thereof and wherein a tin-plating film is formed on a portion of the other portion of the surface thereof, and a method for producing the same. The plated product is produced by a method including the steps of: forming a nickel-plating film 12 on a surface of a base material 10 of copper or a copper alloy; forming a silver-plating film 16 on a portion of a surface of the nickel-plating film 12, and forming a tin-plating film 20 on a portion of the other portion of the surface of the nickel-plating film 12, to prepare a plated product which has the silver-plating film 16 and the tin-plating film 20 on the surface of the nickel-plating film 12 formed on the base material 10; and irradiating the surface of the plated product with infrared rays to heat the surface thereof to reflow-treat the tin-plating film 20 to cause the tin-plating film 20 to be a reflowed tin-plating layer 22.

Disclosed herein is a system, comprising: a detector configured to determine a number of photons of one or more characteristic X-rays emitted by a chemical element in the electrolyte and received by the detector, within a period of time; a processor configured to determine a concentration of the chemical element in the electrolyte based on the number; a controller configured to replenish the chemical element into the electrolyte or configured to stop electroplating with the electrolyte, based on the concentration.

There is provided an inexpensive plated product, which can prevent the increase of the contact resistance of a silver-plating film and the change of the color of the surface thereof after reflow-treating a plated product wherein the silver-plating film is formed on a portion of the surface thereof and wherein a tin-plating film is formed on a portion of the other portion of the surface thereof, and a method for producing the same. The plated product is produced by a method including the steps of: forming a nickel-plating film 12 on a surface of a base material 10 of copper or a copper alloy; forming a silver-plating film 16 on a portion of a surface of the nickel-plating film 12, and forming a tin-plating film 20 on a portion of the other portion of the surface of the nickel-plating film 12, to prepare a plated product which has the silver-plating film 16 and the tin-plating film 20 on the surface of the nickel-plating film 12 formed on the base material 10; and irradiating the surface of the plated product with infrared rays to heat the surface thereof to reflow-treat the tin-plating film 20 to cause the tin-plating film 20 to be a reflowed tin-plating layer 22.