Various inventions are disclosed in the microchip manufacturing arts. Conductive pattern formation by semi-additive processes are disclosed. Further conductive patterns and methods using activated precursors are also disclosed. Aluminum laminated surfaces and methods of circuit formation therefrom are further disclosed. Circuits formed on an aluminum heat sink are also disclosed. The inventive subject matter further discloses methods of electrolytic plating by controlling surface area of an anode.

A Ni-plated steel sheet includes a base steel sheet and a Ni-based coating layer that is disposed on a surface of the base steel sheet. The Ni-based coating layer includes a Fe—Ni alloy region that is formed on the surface of the base steel sheet. The Fe—Ni alloy region includes a mixed phase composed of a bcc phase and an fcc phase, and a component of the Fe—Ni alloy region includes 5 mass % or more of Fe and a remainder including 90 mass % or more of Ni.

A Ni-plated steel sheet includes a base steel sheet and a Ni-based coating layer that is disposed on a surface of the base steel sheet. The Ni-based coating layer includes a Fe—Ni alloy region that is formed on the surface of the base steel sheet. The Fe—Ni alloy region includes a mixed phase composed of a bcc phase and an fcc phase, and a component of the Fe—Ni alloy region includes 5 mass % or more of Fe and a remainder including 90 mass % or more of Ni.

A Ni-plated steel sheet includes a base steel sheet and a Ni-based coating layer that is disposed on a surface of the base steel sheet. The distribution of carbon concentration in a depth direction obtained by performing GDS analysis on the Ni-plated steel sheet has a peak indicating the carbon concentration that is equal to or more than twice the carbon concentration of a thickness middle portion of the base steel sheet in the vicinity of an interface between the base steel sheet and the Ni-based coating layer.

A Ni-plated steel sheet includes a base steel sheet and a Ni-based coating layer that is disposed on a surface of the base steel sheet. The distribution of carbon concentration in a depth direction obtained by performing GDS analysis on the Ni-plated steel sheet has a peak indicating the carbon concentration that is equal to or more than twice the carbon concentration of a thickness middle portion of the base steel sheet in the vicinity of an interface between the base steel sheet and the Ni-based coating layer.

A method is provided for fabricating a terminal electrode. The terminal electrode is applied on a multilayer ceramic capacitor (MLCC). The method prints inner electrodes on full area together with protective layers. The MLCC uses the thickness of thinned dielectric ceramic layers and the stacking of nickel inner-electrode layers. High capacitance is achieved at ends and sides with high electrode-to-ceramic ratios. Thus, the present invention uses a coating technology of ultra-low-temperature electrochemical deposition to fabricate low internal-stress MLCC terminal electrodes together with insulating protective layers for improving MLCC yield while cost reduced.

A method is provided for fabricating a terminal electrode. The terminal electrode is applied on a multilayer ceramic capacitor (MLCC). The method prints inner electrodes on full area together with protective layers. The MLCC uses the thickness of thinned dielectric ceramic layers and the stacking of nickel inner-electrode layers. High capacitance is achieved at ends and sides with high electrode-to-ceramic ratios. Thus, the present invention uses a coating technology of ultra-low-temperature electrochemical deposition to fabricate low internal-stress MLCC terminal electrodes together with insulating protective layers for improving MLCC yield while cost reduced.

In a terminal material with a silver coating film including a silver layer on a surface, a terminal and a terminal material having high reliability are easily manufactured with low cost without a heat treatment. A base material formed of copper or a copper alloy; and nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order are included, the nickel layer has a thickness of 0.05 μm to 5.00 μm and is formed of nickel or a nickel alloy, the intermediate layer has a thickness of 0.02 μm to 1.00 μm and is an alloy layer containing silver (Ag) and a substance X, and the substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium.

In a terminal material with a silver coating film including a silver layer on a surface, a terminal and a terminal material having high reliability are easily manufactured with low cost without a heat treatment. A base material formed of copper or a copper alloy; and nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order are included, the nickel layer has a thickness of 0.05 μm to 5.00 μm and is formed of nickel or a nickel alloy, the intermediate layer has a thickness of 0.02 μm to 1.00 μm and is an alloy layer containing silver (Ag) and a substance X, and the substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium.

External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.