A roughened nickel-plated sheet including a roughened nickel layer on at least one surface of a metal substrate as the outermost layer thereof, the roughened nickel layer being formed of a plurality of nickel protrusions. When the structure of the roughened nickel-plated sheet is observed at height positions with a focused ion beam scanning electron microscope (FIB-SEM), the absolute value of the change rate of the nickel occupancy is equal to or less than a predetermined value, and the nickel occupancy and the number of nickel protrusions present at a height position located 2.0 μm from the base position of the roughened nickel layer toward the surface in the height direction are equal to or more than predetermined values, respectively.

Disclosed herein is a composition including copper ions and at least one additive including a polyalkyleneimine backbone including N-hydrogen atoms, where (a) the polyalkyleneimine backbone has a mass average molecular weight MW of from 600 g/mol to 100 000 g/mol, (b) the N-hydrogen atoms are each substituted by a polyoxyalkylene group including an oxyethylene and a C.sub.3 to C.sub.6 oxyalkylene unit, and (c) the average number of oxyalkylene units in the polyoxyalkylene groups is of from more than 10 to less than 30 per N-hydrogen atom in the polyalkyleneimine.

A high-strength coatings and methods of fabrication to yield single-crystal-like nickel containing nanotwins and stacking faults.

A method for electrolysis of water and a method for preparing a catalyst for electrolysis of water are provided. The method for electrolysis of water includes using a high entropy alloy as a catalyst. Further, the method for preparing a catalyst for electrolysis of water includes the steps of placing a substrate in an aqueous electrolyte containing a high entropy alloy precursor and performing an electroplating process on the substrate to form a high entropy alloy catalyst on the substrate.

An electrodeposited copper foil includes a bulk copper foil. When a weight of the electrodeposited copper foil is increased to 105.0 wt % during a thermogravimetric analysis (TGA) performed on the electrodeposited copper foil at a heating rate of 5° C./min and an air flow rate of 95 mL/min, a heating temperature of the TGA is defined as T.sub.105.0 wt % and in a range of 550° C. to 750° C.

The invention relates to sheet metal packaging products, in particular tinplate or electrolytically chrome-plated sheet steel (ECCS), consisting of a sheet steel substrate (S) with a thickness in the region of 0.1 mm to 0.6 mm and a coating (B), in particular made of tin and/or chromium or chromium and chromium oxide, that is electrolytically deposited on at least one side of the sheet metal substrate. In addition, at least one surface of the sheet metal packaging product provided with the coating (B) has a surface profile with periodically repeating structure elements in at least one direction, wherein an autocorrelation function resulting from the surface profile has a plurality of side lobes with a height of at least 20%, preferably at least 30% of the height of the main lobe. These sheet metal packaging products have improved and novel surface properties.

This application provides a metal foil. The metal foil may include a first metal layer and a metal base layer that are stacked up. A roughness Rz of a surface that is of the metal base layer and that is oriented toward the first metal layer is α.sub.1 μm, a roughness Rz of a surface that is of the first metal layer and that is oriented back from the metal base layer is β.sub.1 μm, α.sub.1 may be in a range of 1.8 to 2.9, and β.sub.1 may be in a range of 1 to 1.4.

A method of making an assembly can include juxtaposing a top surface of a first electrically conductive element at a first surface of a first substrate with a top surface of a second electrically conductive element at a major surface of a second substrate. One of: the top surface of the first conductive element can be recessed below the first surface, or the top surface of the second conductive element can be recessed below the major surface. Electrically conductive nanoparticles can be disposed between the top surfaces of the first and second conductive elements. The conductive nanoparticles can have long dimensions smaller than 100 nanometers. The method can also include elevating a temperature at least at interfaces of the juxtaposed first and second conductive elements to a joining temperature at which the conductive nanoparticles can cause metallurgical joints to form between the juxtaposed first and second conductive elements.

A method for decorating a substrate which includes the succession of the following steps: provide the substrate; deposit a layer of a sacrificial material over a surface of the substrate; structure the sacrificial material layer so as to create in this sacrificial material layer a plurality of cavities to form a decorative or technical pattern; eliminate the sacrificial material layer except at the location where the pattern is provided.

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.