An oxide superconducting wire, includes a laminate including a base material, an intermediate layer, and an oxide superconducting layer, the intermediate layer being laminated on a main surface of the base material, the intermediate layer being constituted of one or more layers having an orientation, the intermediate layer having one or more first non-orientation regions extending in a longitudinal direction of the base material, the oxide superconducting layer being laminated on the intermediate layer, the oxide superconducting layer having a crystal orientation controlled by the intermediate layer, the oxide superconducting layer having second non-orientation regions located on the first non-orientation regions, and a metal layer which covers at least a front surface and side surfaces of the oxide superconducting layer in the laminate.

The present invention relates to an electrodeposited diamond wire saw using patterned non-conductive materials in which non-conductive materials are pre-patterned along the outer circumference of a wire on which diamond grit should not be rubbed, before the diamond grit is upset, in order to efficiently improve the manufacturing process, and to a method for manufacturing same. According to one preferred embodiment of the invention, the method for manufacturing an electrodeposited diamond wire saw includes: printing a masking solution on the outer circumference of a wire in a plurality of directions when the wire is inserted for patterning; and upsetting diamond grit on the remaining regions of the outer circumference of the wire, with the exception of the patterned region.

A forming method for a heating element of an electronic cigarette and a manufacturing method for an atomization assembly are provided, the forming method comprises coiling a heating wire into a heating coil, dividing the heating coil into sections including a plurality of heating sections and connecting sections; providing a deposition preventing layer on an external surface of the heating section; electroplating the heating coil, coating outer peripheral faces of all of the connecting sections of the heating coil with coatings having an electrical resistivity lower than that of the heating wire; removing the deposition preventing layer; and cutting the heating coil electroplated. The present application makes the manufacturing process of the heating element and the atomization assembly continues automatically, the production efficiency is improved, the resistance of the heating element or atomization assembly manufactured is more stable, and the product quality is higher.

An example method for connectorizing a superconducting cable is described herein. The method can include depositing an oxide layer on a surface of a superconducting cable, electroplating a metal layer on the surface of the superconducting cable, and soldering a connector to the metal layer coated on the surface of the superconducting cable. The oxide layer allows the metal layer to adhere to the surface of the superconducting cable.

A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of: (a) pure silver consisting of (a1) silver in an amount in the range of from 99.99 to 100 wt.-% and (a2) further components in a total amount of from 0 to 100 wt.-ppm or (b) doped silver consisting of (b1) silver in an amount in the range of from >99.49 to 99.997 wt.-%, (b2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to <5000 wt.-ppm and (b3) further components in a total amount of from 0 to 100 wt.-ppm, or (c) a silver alloy consisting of (c1) silver in an amount in the range of from 89.99 to 99.5 wt.-%, (c2) at least one alloying element selected from the group consisting of nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount in the range of from 0.5 to 10 wt.-% and (c3) further components in a total amount of from 0 to 100 wt.-ppm, or (d) a doped silver alloy consisting of (d1) silver in an amount in the range of from >89.49 to 99.497 wt.-%, (d2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to <5000 wt.-ppm, (d3) at least one alloying element selected from the group consisting of nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount in the range of from 0.5 to 10 wt.-% and (d4) further components in a total amount of from 0 to 100 wt.-ppm, wherein the at least one doping element (d2) is other than the at least one alloying element (d3), wherein the individual amount of any further component is less than 30 wt.-ppm, wherein the individual amount of any doping element is at least 30 wt.-ppm, wherein all amounts in wt.-% and wt.-ppm are based on the total weight of the core, and wherein the coating layer is a double-layer comprised of a 1 to 1000 nm inner layer of gold and an adjacent 0.5 to 100 nm thick outer layer of palladium or a double-layer comprised of a 0.5 to 100 nm thick inner layer of palladium and an adjacent >200 to 1000 nm thick outer layer of gold.

A method of manufacturing an orthodontic appliance includes plating a first pattern of a material on a substrate to define a layer. Repeating plating of the first material one or more times forms an additional pattern. A layered structure is built up and forms a portion of the orthodontic appliance. A pattern of a second material different from a first material may be plated on the substrate or on a pattern of the first material. The material may be a sacrificial material that may be later removed. The orthodontic appliance may be an archwire or a self-ligating orthodontic bracket having one or more layered structures formed by plating patterns of the material. Plating may include plating patterns of materials so as to form a movable member in place relative to a bracket body.

Provided is a bonding wire capable of reducing the occurrence of defective loops. The bonding wire includes: a core material which contains more than 50 mol % of a metal M; an intermediate layer which is formed over the surface of the core material and made of Ni, Pd, the metal M, and unavoidable impurities, and in which the concentration of the Ni is 15 to 80 mol %; and a coating layer formed over the intermediate layer and made of Ni, Pd and unavoidable impurities. The concentration of the Pd in the coating layer is 50 to 100 mol %. The metal M is Cu or Ag, and the concentration of Ni in the coating layer is lower than the concentration of Ni in the intermediate layer.

Method for producing metallic surface discharge electrodes on nonmetallic substrates comprising the following steps: a) producing a metallic seed layer on a substrate; b) electrically contacting the seed layer with a metal wire network and an electrolyte containing metal ions; c) electrodepositing a metal film from the electrolyte at least on the seed layer, with the metal wire network being embedded into the metal film, wherein d) metal wire filaments that are movable relative to one another are arranged to form an electrically percolating metal wire network, e) the arrangement of the metal wire filaments is cast into a gel and the gel is dried thereafter to the gel matrix, and f) the dried gel matrix with the metal wire network embedded therein is applied to the substrate and is wetted with a solvent of the gel matrix. Furthermore, the invention relates to a semifinished product for carrying out the method.

An electrical discharge machining electrode wire includes a core including a copper or a copper alloy, and a covering layer covering a periphery of the core and including a zinc. The covering layer includes an inner layer including a γ-phase of copper-zinc based alloy and covering the periphery of the core, and an outer layer including an ε-phase of copper-zinc based alloy and covering a periphery of the inner layer. An x-ray diffraction intensity of (0001) of the ε-phase is more than twice an x-ray diffraction intensity of (332) of the γ-phase.

A method for preparing a copper-based graphene/aluminum composite wire with high electrical conductivity is disclosed. An electrodeposition solution for the wire includes the following components, in mass percentage: 20 wt % of CuSO.sub.4, 0.005 wt % to 0.020 wt % of benzalacetone, 2 wt % to 5 wt % of NaCl, 0.08 wt % to 0.5 wt % of graphene, 0.003 wt % to 0.016 wt % of N,N-dimethylformamide (DMF), and the balance of deionized water. The preparation process of the wire is composed of: electrodeposition, drawing, and annealing. The obtained wire has excellent electrical conductivity and tensile strength, which can effectively improve the electric power transmission efficiency and reduce the electrical power loss. By the above electrodeposition solution and simple preparation method, a utility model wire with high transmission efficiency can be prepared, where the comprehensive performance and microstructure of the composite can be ensured by controlling process parameters.