The present disclosure relates to an ultra-high-strength plated steel sheet and a method for molding the same, and more particularly, to an ultra-high-strength plated steel sheet having high tensile strength without the occurrence of plating peeling and hydrogen delayed fracture phenomenon during roll forming molding, and a method for molding the same.

A steel sheet has a tensile strength of 1310 MPa or higher, a specified chemical composition, and a steel microstructure containing martensite at an area ratio of 70% or more, bainite at an area ratio of 30% or less, and ferrite and retained austenite at a total area ratio of 10% or less, in which, at a ¼ thickness position of the steel sheet, a number density of carbides having long axes of 0.5 μm or more is 60000 carbides/mm.sup.2 or less, in a ¼-to-¾ thickness region of the steel sheet, a number density of inclusion grains having equivalent circle diameters of 4.0 μm or more is 10 grains/mm.sup.2 or more and 30 grains/mm.sup.2 or less, and, in a surface-to-¼ thickness region of the steel sheet, a number density of inclusion grains having equivalent circle diameters of 4.0 μm or more is 27 grains/mm.sup.2 or less.

The present invention relates to a cold-rolled steel sheet comprising: a base steel sheet; and a nickel or nickel alloy coating layer formed on the base steel sheet, wherein the adhesion amount of the nickel or nickel alloy is 50 mg/m.sup.2 or less.

According to the present invention, provided are a high-strength cold-rolled steel sheet and a manufacturing for manufacturing same. In the high-strength cold-rolled steel sheet, a metal layer is coated on a cold-rolled steel sheet to a thickness of nanometers, followed by annealing, thereby suppressing the formation of oxides of Si, Mn, and the like on the surface of the steel sheet to within a range in which the elution of Fe is not suppressed, and thus the high-strength cold-rolled steel sheet has improved phosphatability.

Provided are a conductive film and a preparation method for the same, which relate to the technical field of conductive films. The preparation method for the conductive film includes: forming a metal process layer on a surface of an insulating layer by means of evaporation deposition, wet electroplating or chemical plating; forming a metal transition layer on a surface of the metal process layer facing away from the insulating layer by means of magnetron sputtering; and forming a metal functional layer on a surface of the metal transition layer facing away from the metal process layer. The conductive film obtained by this preparation method can have relatively good conductivity and density while having a relatively thick metal conductive layer.

The invention relates to a method for coating a steel sheet or steel strip to which an aluminium-based coating is applied in a dip-coating process and the surface of the coating is freed of a naturally occurring aluminium oxide layer. In order to provide a low-cost method for coating steel sheets or steel strips that makes the steel sheets or steel strips outstandingly suitable for the production of components by means of press hardening and for the further processing thereof, it is proposed that transition metals or transition metal compounds are subsequently deposited on the freed surface of the coating to form a top layer. The invention also relates to a method for producing press-hardened components from the aforementioned steel sheets or steel strips with an aluminium-based coating.

An electrodeposited copper foil includes a bulk copper foil. When a weight of the electrodeposited copper foil is increased to 105.0 wt % during a thermogravimetric analysis (TGA) performed on the electrodeposited copper foil at a heating rate of 5° C./min and an air flow rate of 95 mL/min, a heating temperature of the TGA is defined as T.sub.105.0 wt % and in a range of 550° C. to 750° C.

A true random number generator is presented that includes a CMOS matrix detector with a top surface. A shell is positioned over the top surface, and the shell includes a radiation source and a luminophore or scintillator constructed to emit photons towards the top surface when the luminophore or scintillator is struck by electrons from the radioactive decay of the source of the radiation. The CMOS detector matrix is constructed to detect the photons emitted from the luminophore or scintillator and to produce a signal for the detected photons. The signal is communicated to a processor that produces true random numbers based on the signal from the detected photons.

Provided is a liquid mixture for filling blind holes in copper foil, relating to the technical field of electroplating hole filling. The liquid mixture comprises copper sulfate pentahydrate 210-240 g/L, citric acid 40-50 g/L, tartaric acid 10-20 g/L, chloride ion 40-70 ppm, accelerator 0.5-2 g/L, leveling agent 5-15 g/L, inhibitor 5-10 g/L, and sulfonate ion liquid 50-180 g/L. The leveling agent comprises tetranitro blue tetrazolium blue and triazolyl acetyl hydrazide.

The present invention relates to a method for lithiation of an intercalation-based anode or a non-reactive plating-capable foil or a reactive alloy capable anode, whereby utilization of said lithiated intercalation-based anode or a plating-capable foil or reactive alloy capable anode in a rechargeable battery or electrochemical cell results in an increased amount of lithium available for cycling, and an improved reversible capacity during charge and discharge.

The invention relates to sheet metal packaging products, in particular tinplate or electrolytically chrome-plated sheet steel (ECCS), consisting of a sheet steel substrate (S) with a thickness in the region of 0.1 mm to 0.6 mm and a coating (B), in particular made of tin and/or chromium or chromium and chromium oxide, that is electrolytically deposited on at least one side of the sheet metal substrate. In addition, at least one surface of the sheet metal packaging product provided with the coating (B) has a surface profile with periodically repeating structure elements in at least one direction, wherein an autocorrelation function resulting from the surface profile has a plurality of side lobes with a height of at least 20%, preferably at least 30% of the height of the main lobe. These sheet metal packaging products have improved and novel surface properties.