Patent classifications
C25D13/06
Insulated flat conductive wire having high aspect ratio, method for manufacturing same, and coil
This insulated flat conductive wire includes: a flat conductive wire having an aspect ratio a/b of 12 or more, wherein the aspect ratio is a ratio of a length a of a long side of a rectangular cross-section to a length b of a short side thereof; and an insulating film which consists of a polyamide-imide resin or a polyimide resin and coats the flat conductive wire, wherein the insulating film has a film thickness t1 of 10 m or more at a center portion of the long side of the rectangular cross-section, and the insulating film has a film thickness ratio t1/t2 of 0.80 to 1.35, and wherein the film thickness ratio t1/t2 is a ratio of the film thickness t1 at the center portion of the long side to a film thickness t2 at an edge portion of the long side of the rectangular cross-section.
RADIATIVE COOLING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
A radiative cooling substrate and a manufacturing method of the radiative cooling substrate are provided. The radiative cooling substrate includes a metallic substrate and a chitosan layer disposed on the metallic substrate with a thickness of 0.5 m to 10 m. The chitosan layer emits radiation within a waveband between 8 m and 13 m.
RADIATIVE COOLING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
A radiative cooling substrate and a manufacturing method of the radiative cooling substrate are provided. The radiative cooling substrate includes a metallic substrate and a chitosan layer disposed on the metallic substrate with a thickness of 0.5 m to 10 m. The chitosan layer emits radiation within a waveband between 8 m and 13 m.
MULTI-MATERIAL ASSEMBLY AND METHODS OF MAKING THERE OF
A multi-material assembly is provided, as well as methods of making a multi-material assembly. The multi-material assembly includes a first coated structural component and a second structural component. The first coated structural component includes a first uncoated portion, and an adhesive is positioned between the second structural component and the first uncoated portion that secures the first coated structural component to the second structural component.
CATIONIC ELECTRODEPOSITION COATING MATERIAL COMPOSITION
The present invention relates to a cationic electrodeposition coating composition containing a resin emulsion containing an aminated resin (A) and a blocked isocyanate curing agent (B), characterized in that a deposited electrodeposition coating film of the cationic electrodeposition coating composition has a coating film viscosity in a range of 5,000 to 1,000,000 mPa.Math.s at 110 C., and a portion resulting from removal of a resin component from the deposited electrodeposition coating film of the cationic electrodeposition coating composition has a polarity term in a range of 2 to 30 mN/m.
CATIONIC ELECTRODEPOSITION COATING MATERIAL COMPOSITION
The present invention relates to a cationic electrodeposition coating composition containing a resin emulsion containing an aminated resin (A) and a blocked isocyanate curing agent (B), characterized in that a deposited electrodeposition coating film of the cationic electrodeposition coating composition has a coating film viscosity in a range of 5,000 to 1,000,000 mPa.Math.s at 110 C., and a portion resulting from removal of a resin component from the deposited electrodeposition coating film of the cationic electrodeposition coating composition has a polarity term in a range of 2 to 30 mN/m.
Solution composition and method for single-bath post treatment of substrate
Disclosed is a solution composition which may be used for a single-bath electrochemical passivation and a method using the same. The solution composition includes a metal cation, a metal-oxide anion; and an organic ligand, and optionally includes a non-metallic oxide anion or a polymer. The solution composition may prevent undesired precipitation of metal oxides before performing passivation. In addition, the method of passivation using the solution composition in a single-bath use is also provided.
Solution composition and method for single-bath post treatment of substrate
Disclosed is a solution composition which may be used for a single-bath electrochemical passivation and a method using the same. The solution composition includes a metal cation, a metal-oxide anion; and an organic ligand, and optionally includes a non-metallic oxide anion or a polymer. The solution composition may prevent undesired precipitation of metal oxides before performing passivation. In addition, the method of passivation using the solution composition in a single-bath use is also provided.
Multi-material assembly and methods of making thereof
A multi-material assembly is provided, as well as methods of making a multi-material assembly. The multi-material assembly includes a first coated structural component and a second structural component. The first coated structural component includes a first uncoated portion, and an adhesive is positioned between the second structural component and the first uncoated portion that secures the first coated structural component to the second structural component.
Method for preparing cationic electrodeposition coating composition
The objective of the present invention is to provide a method for preparing a cationic electrodeposition coating composition that contains a bismuth compound and exhibits excellent coating material stability, curability, coating film appearance and the like. The present invention provides a method for preparing a cationic electrodeposition coating composition, which comprises a step for mixing a resin emulsion (i) and a pigment-dispersed paste, and wherein: the resin emulsion (i) contains an aminated resin (A) and a blocked isocyanate curing agent (B); the pigment-dispersed paste contains a bismuth mixture (C) that is obtained by mixing a bismuth compound (c1) and an organic acid (c2) in advance, a pigment-dispersed resin (D), an amine-modified epoxy resin emulsion (ii) that contains an amine-modified epoxy resin (E), and a pigment (F); the pigment-dispersed resin (D) has a hydroxyl number of 20-120 mgKOH/g; and the amine-modified epoxy resin (E) has a hydroxyl number of 150-650 mgKOH/g.