A wafer plating fixture for use in simultaneously electroplating a two substrates. The wafer plating fixture including: an electrically conductive carrier bus; a plurality of contact clips electrically coupled to the carrier bus and configured to hold the two substrates in place and electrically couple the two substrates to the carrier bus; and a non-conductive substrate backer to separate the two substrates coupled to the carrier bus. A method of electroplating a plurality of substrates. The method including: mounting two substrates to be plated onto a wafer plating fixture; mounting the wafer plating fixture on a continuous belt of plating system; dipping the wafer plating fixture with the two substrates held thereon into an electroplating bath; and applying a voltage to the two substrates via the wafer plating fixture.

Provided is a substrate holder and a substrate treatment apparatus capable of positioning a substrate even in a case in which the substrate receives a frictional force and the like from a support surface. A substrate holder 200 according to the present invention includes: a first holding member 300; a second holding member 500 adapted to pinch a substrate W with the first holding member 300; three or more positioning members 360 including contact surfaces 342 that come into contact with side end portions of the substrate W; a first moving member 380 including a plurality of engaging portions 384 that are engaged with the positioning members 360 such that the positioning members 360 with a state in which distances of an ideal axis L and contact surfaces 376 of the positioning members 360 are equal to each other maintained; and a first biasing member 310 adapted to bias the first moving member 380, in which the first moving member 380 delivers a biasing force of the first biasing member 310 to each of the positioning members 360, and the positioning members 360 are biased in a direction in which the contact surfaces 376 approaches the ideal axis L with the delivered biasing force.

Provided is a substrate holder and a substrate treatment apparatus capable of positioning a substrate even in a case in which the substrate receives a frictional force and the like from a support surface. A substrate holder 200 according to the present invention includes: a first holding member 300; a second holding member 500 adapted to pinch a substrate W with the first holding member 300; three or more positioning members 360 including contact surfaces 342 that come into contact with side end portions of the substrate W; a first moving member 380 including a plurality of engaging portions 384 that are engaged with the positioning members 360 such that the positioning members 360 with a state in which distances of an ideal axis L and contact surfaces 376 of the positioning members 360 are equal to each other maintained; and a first biasing member 310 adapted to bias the first moving member 380, in which the first moving member 380 delivers a biasing force of the first biasing member 310 to each of the positioning members 360, and the positioning members 360 are biased in a direction in which the contact surfaces 376 approaches the ideal axis L with the delivered biasing force.

The present disclosure provides for improvements in fixturing parts in preparation for an electroplating process, thus reducing part handling. The system provides a reusable masking tool comprising a main body having an opening with a removeable coverplate positioned within the opening and one or more locking tabs engaging a corresponding relief slot in at least one of the sidewalls of the main body. The system also comprises a fastener moveably secured within the main body and extending through a top surface of the main body. The main body, fastener, and coverplate may be fabricated from a polymer material by way of an additive manufacturing process. A shank, fabricated from a conductive material, extends through the fastener and is engaged with the fastener such that upon rotation of the fastener, the shank is drawn into contact with the gas turbine engine component, thus providing a conduit for the electroplating process.

An apparatus for electroplating includes a cup configured to support a substrate, and a cone including at least three distance measuring devices arranged on a lower surface thereof and facing the substrate. Each distance measuring device is configured to transmit a laser pulse towards the substrate, the laser pulse impinging the substrate, receive a reflected laser pulse from the substrate, calculate a turnaround time of the laser pulse, and calculate a distance between the distance measuring device and the substrate using the turnaround time for determining an inclination of the substrate.

Provided is a technique that allows measuring a film thickness of a substrate in a plating process.

A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, a rotation mechanism 30, a plurality of contact members 50, a coil 60, a current sensor 65, and a film thickness measuring device 70. The plurality of contact members 50 are disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact members 50 contact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coil 60 generates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensor 65 detects the current generated in the coil. The film thickness measuring device 70 measures a film thickness of the substrate based on the current detected by the current sensor in the plating process.

A plating apparatus includes a workpiece holder, a plating bath, and a clamp ring. The plating bath is underneath the workpiece holder. The clamp ring is connected to the workpiece holder. The clamp ring includes channels communicating an inner surface of the clamp ring and an outer surface of the clamp ring.

A plating apparatus includes a workpiece holder, a plating bath, and a clamp ring. The plating bath is underneath the workpiece holder. The clamp ring is connected to the workpiece holder. The clamp ring includes channels communicating an inner surface of the clamp ring and an outer surface of the clamp ring.

A method of forming a multilayered zinc alloy coating comprises steps of providing a bath of an aqueous electrolyte including zinc and a second electrodepositable component in an electrolytic cell having an anode and a cathode; applying a current or voltage between the anode and the cathode; modulating the applied current or voltage over time between at least two current or voltage values to thereby modulate the current density over multiple cycles between at least two current density values, wherein a first current density value is in a range of 0.3 to less than 2 A/dm.sup.2 and a second current density value is higher than the first current density value and is in a range of 0.6 to less than 5 A/dm.sup.2; and controlling the modulation of the applied current or voltage to obtain a multilayered structure having multiple layers of one or more of alternating proportions of the second component, alternating corrosion potential, alternating grain size, and alternating grain orientation, wherein one or more of the multiple layers has a thickness in the range of 1 to 10 μm.

A method of forming a multilayered zinc alloy coating comprises steps of providing a bath of an aqueous electrolyte including zinc and a second electrodepositable component in an electrolytic cell having an anode and a cathode; applying a current or voltage between the anode and the cathode; modulating the applied current or voltage over time between at least two current or voltage values to thereby modulate the current density over multiple cycles between at least two current density values, wherein a first current density value is in a range of 0.3 to less than 2 A/dm.sup.2 and a second current density value is higher than the first current density value and is in a range of 0.6 to less than 5 A/dm.sup.2; and controlling the modulation of the applied current or voltage to obtain a multilayered structure having multiple layers of one or more of alternating proportions of the second component, alternating corrosion potential, alternating grain size, and alternating grain orientation, wherein one or more of the multiple layers has a thickness in the range of 1 to 10 μm.