A method of metal plating components includes placing a component and a spacer on a brochette, placing the brochette with the component and the spacer on a structure, and placing the structure with the brochette into a metal plating tank having a metal plating solution such that the component is submersed in the metal plating solution. The spacer is configured to mask a portion of the least one component and the component and the spacer are arranged on the brochette such that the spacer prevents the portion of the component from being contacted by the metal plating solution. The method also includes metal plating a surface of the component submersed in the metal plating solution, removing the structure with the brochette from the metal plating solution, drying the component on the brochette, and removing the dried component and the spacer from the brochette. Metal plating systems are also provided.

An electrolytic treatment apparatus 1 (1A) configured to perform an electrolytic treatment on a target substrate includes a substrate holder 10 and an electrolytic processor 20. The substrate holder 10 includes an insulating holding body 11 configured to hold the target substrate and an indirect negative electrode 12 disposed within the holding body 11. A negative voltage is applied to the indirect negative electrode 12. The electrolytic processor 20 is disposed to face the substrate holder 10 and configured to apply a voltage to the target substrate and an electrolyte in contact with the target substrate.

It is configured that a frame body is locked to a back panel by: inserting a number of first pins of the frame body into a number of first holes of the back panel; moving a fastening body outward by a moving mechanism of a lock mechanism; and fitting a notch into a concave portion at the tip of the first pin.

To provide a substrate holder having a new positioning structure, which does not use a plate spring, and a plating apparatus using this substrate holder. A substrate holder is provided. This substrate holder has a first holding member having a first surface configured to contact with a substrate, and a second holding member for sandwiching and holding the substrate together with the first holding member. The first holding member has a positioning member for positioning the substrate in contact with the first surface at a prescribed position of the first surface. The positioning member is configured to move between a first position where the substrate is to be positioned at the prescribed position of the first surface, in contact with a peripheral edge part of the substrate, and a second position not in contact with the substrate. The second holding member has a driving member configured to cause the positioning member to be positioned at the first position, at the time when holding the substrate by the first holding member and the second holding member.

To provide a substrate holder having a new positioning structure, which does not use a plate spring, and a plating apparatus using this substrate holder. A substrate holder is provided. This substrate holder has a first holding member having a first surface configured to contact with a substrate, and a second holding member for sandwiching and holding the substrate together with the first holding member. The first holding member has a positioning member for positioning the substrate in contact with the first surface at a prescribed position of the first surface. The positioning member is configured to move between a first position where the substrate is to be positioned at the prescribed position of the first surface, in contact with a peripheral edge part of the substrate, and a second position not in contact with the substrate. The second holding member has a driving member configured to cause the positioning member to be positioned at the first position, at the time when holding the substrate by the first holding member and the second holding member.

A substrate holder prevents a substrate to be bent or damaged owing to inward declining of a seal lip. The substrate holder with an opening includes a seal, and a seal support which has a seal support surface, and is formed on an outer circumference of the opening. The seal includes a seal body and a seal lip. At least a part of the seal support surface has an inclination angle that allows an inner end of the seal support surface to approach the plane on which the substrate is to be positioned. The inner end of the seal support surface is positioned on an inner side than the seal lip.

A substrate holder prevents a substrate to be bent or damaged owing to inward declining of a seal lip. The substrate holder with an opening includes a seal, and a seal support which has a seal support surface, and is formed on an outer circumference of the opening. The seal includes a seal body and a seal lip. At least a part of the seal support surface has an inclination angle that allows an inner end of the seal support surface to approach the plane on which the substrate is to be positioned. The inner end of the seal support surface is positioned on an inner side than the seal lip.

To stably convey a substrate (workpiece) while suppressing the workpiece from bending. A treatment device is provided. This treatment device includes: a conveying part that conveys a workpiece in a state where a flat surface of the workpiece is inclined around a conveying directional axis relative to a horizontal plane; and a treatment part in which at least one of polishing and cleaning is performed on the flat surface of the workpiece, wherein the conveying part has a drive part configured to be brought into physical contact with an end part of the workpiece and apply force in a conveying direction to the workpiece, a first Bernoulli chuck arranged to face the flat surface of the workpiece, and a second Bernoulli chuck arranged to face an end face of an opposite end part to the end part of the workpiece.

The invention discloses a cosmetic zinc alloy massage head formula and a preparation technology thereof. The formula comprises the following raw materials: 4.19% of aluminum, 0.0027% of lead, 0.0005% of cadmium, 0.0011% of copper, 0.0073% of iron, 0.044% of magnesium, smaller than 0.0005% of tin, smaller than 0.001% of nitrogen, and zinc for the residual. A zinc alloy massage head has high impact strength and good tear resistance, and the technology can effectively improve conductivity stability and fullness, the surface strength and abrasive resistance of products; the conductivity of the alloy head is good after water electroplating; the conductivity of the alloy head is greatly improved, which is conducive to releasing charged ions on the surface of the human body, and especially in winter, the alloy head can release static electricity generated by dry air, and play a similar role as a ground wire in a current circuit.

The present disclosure provides for improvements in fixturing parts in preparation for an electroplating process, thus reducing part handling. The system provides a reusable masking tool comprising a main body having an opening with a removeable coverplate positioned within the opening and one or more locking tabs engaging a corresponding relief slot in at least one of the sidewalls of the main body. The system also comprises a fastener moveably secured within the main body and extending through a top surface of the main body. The main body, fastener, and coverplate may be fabricated from a polymer material by way of an additive manufacturing process. A shank, fabricated from a conductive material, extends through the fastener and is engaged with the fastener such that upon rotation of the fastener, the shank is drawn into contact with the gas turbine engine component, thus providing a conduit for the electroplating process.