A novel method of preparing and using an improved electrolyte bath for the purpose of electrodeposition of metallic film onto a substrate is disclosed. The electrolyte bath makes use of unexpected findings in the process of electrodeposition with the claimed compounds and elements to perform the process with less expensive and more environmentally-friendly materials to produce a consistent, high-quality deposition.

A method of electroplating a target electrode comprises establishing a first electric current through an electrolytic solution, comprising a quantity of an electrically charged material, an initial electrode, and a transitional electrode, so that a quantity of the electrically charged material is converted to a quantity of an electrically neutral material, which is electroplated, as a deposit, onto the transitional electrode; and establishing a second electric current through the electrolytic solution, the transitional electrode, and the target electrode so that a quantity of the electrically neutral material from the deposit is converted to a quantity of the electrically charged material, which is dissolved into the electrolytic solution, and a quantity of the electrically charged material in the electrolytic solution is converted to a quantity of the electrically neutral material, which is electroplated onto the surface of the target electrode.

A method of controlling chemical concentration in electrolyte includes measuring a chemical concentration in an electrolyte, wherein the electrolyte is contained in a tank; and increasing a vapor flux through an exhaust pipe connected to the tank when the measured chemical concentration is lower than a control lower limit value.

A method of controlling chemical concentration in electrolyte includes measuring a chemical concentration in an electrolyte, wherein the electrolyte is contained in a tank; and increasing a vapor flux through an exhaust pipe connected to the tank when the measured chemical concentration is lower than a control lower limit value.

An electrolyte solution for chrome plating from trivalent chromium is prepared by dissolving in an aqueous medium a trivalent chromium salt (e.g., chromium (III) chloride or chromium (III) sulfate), dissolving an oxalate compound (e.g., sodium oxalate, potassium oxalate, or oxalic acid), dissolving a metal salt (e.g., aluminum sulfate or aluminum chloride), dissolving an alkali metal sulfate (e.g., sodium sulfate or potassium sulfate), and dissolving an alkali metal halide (e.g., sodium fluoride or potassium fluoride). A substrate is chrome plated from trivalent chromium using the electrolyte solution by passing a current between a cathode and an anode through the electrolyte solution to deposit chromium on the substrate.

An electrolyte solution for chrome plating from trivalent chromium is prepared by dissolving in an aqueous medium a trivalent chromium salt (e.g., chromium (III) chloride or chromium (III) sulfate), dissolving an oxalate compound (e.g., sodium oxalate, potassium oxalate, or oxalic acid), dissolving a metal salt (e.g., aluminum sulfate or aluminum chloride), dissolving an alkali metal sulfate (e.g., sodium sulfate or potassium sulfate), and dissolving an alkali metal halide (e.g., sodium fluoride or potassium fluoride). A substrate is chrome plated from trivalent chromium using the electrolyte solution by passing a current between a cathode and an anode through the electrolyte solution to deposit chromium on the substrate.

Electroplating techniques including an electroplating system and a method for using the electroplating system are provided. The electroplating system has: an electroplating apparatus for electroplating a workpiece, the electroplating apparatus has an electroplating tank configured to contain a solution including target organics; a first reservoir configured to receive the solution including the target organics from the electroplating tank, and to hold the solution including the target organics; a foaming mechanism configured to, in the first reservoir, separate the target organics from the solution through foaming action such that the solution with a reduced concentration of the target organics is separated from a foam including the separated target organics; and a diverting mechanism configured to selectively feed the solution with the reduced concentration of the target organics to one of the first reservoir and the electroplating tank of the electroplating apparatus.

Electroplating techniques including an electroplating system and a method for using the electroplating system are provided. The electroplating system has: an electroplating apparatus for electroplating a workpiece, the electroplating apparatus has an electroplating tank configured to contain a solution including target organics; a first reservoir configured to receive the solution including the target organics from the electroplating tank, and to hold the solution including the target organics; a foaming mechanism configured to, in the first reservoir, separate the target organics from the solution through foaming action such that the solution with a reduced concentration of the target organics is separated from a foam including the separated target organics; and a diverting mechanism configured to selectively feed the solution with the reduced concentration of the target organics to one of the first reservoir and the electroplating tank of the electroplating apparatus.

Systems and methods for electroplating are provided. An electroplating system may include an electroplating cell configured to contain an anode and an electroplating solution, a wafer holder configured to support a wafer within the electroplating cell, a reservoir configured to contain at least a portion of the electroplating solution, a recirculation flowpath that fluidically connects the reservoir and the electroplating cell, in which the recirculation flowpath includes a pump and is configured to circulate the electroplating solution between the reservoir and the electroplating cell, and a frother fluidically connected to one or more of the electroplating cell, the reservoir, and the recirculation flowpath. The frother may be configured to generate bubbles in the electroplating solution when the electroplating solution is present in the electroplating system, interfaced with the frother, and the frother is activated.

The present invention provides a composite processing method and device for a texture on an inner surface of a bearing shell of a radial sliding bearing. A surface of a workpiece to be processed is processed by laser to obtain a micron-level texture, an obtained workpiece with the micron-level texture on a surface is placed on a compression device, and the workpiece with the micron-level texture on the surface is subjected to an electro-deposition reaction to obtain a workpiece with a nano-level texture on a surface. The processing device includes an inner spin-printing electrode electrochemical deposition system, a laser irradiation system and a motion control system. The inner spin-printing electrode electrochemical deposition system includes the inner spin-printing electrode, a direct current power supply, the bearing shell and a compression roller.