In some examples, a method includes forming a photoresist layer on a surface of a metallic substrate and developing the photoresist layer to define a pattern exposing a portion of the surface of the metallic substrate. The method also may include forming an electrically conductive layer on a surface of the photoresist layer and the exposed portions of the surface of the metallic substrate. The electrically conductive layer contacts the exposed portions of the surface of the metallic substrate. The method may further include submerging the substrate, the photoresist layer, and the electrically conductive layer in an electrolyte solution; and applying a voltage to between a cathode and an anode submerged in the electrolyte solution to anisotropically etch the metallic substrate where the electrically conductive layer contacts the exposed portions of the surface of the metallic substrate to form at least one feature in the metallic substrate.

A method is provided for precisely enlarging a nanopore formed in a membrane. The method includes: applying an electric potential across the nanopore, where the electric potential has a pulsed waveform oscillating between a high value and a low value; measuring current flowing though the nanopore while the electric potential is being applied to the nanopore at a low value; determining size of the nanopore based in part on the measured current; and removing the electric potential applied to the membrane when the size of the nanopore corresponds to a desired size.

A method is provided for precisely enlarging a nanopore formed in a membrane. The method includes: applying an electric potential across the nanopore, where the electric potential has a pulsed waveform oscillating between a high value and a low value; measuring current flowing though the nanopore while the electric potential is being applied to the nanopore at a low value; determining size of the nanopore based in part on the measured current; and removing the electric potential applied to the membrane when the size of the nanopore corresponds to a desired size.

Provided are a heat-absorbing material having high heat resistance and high wavelength selectivity, and a process for producing the same. The heat-absorbing material includes: a heat-resistant metal having the substantially same periodic structure in the light incidence plane as the wavelength of sunlight having a specific wavelength in the wavelength regions of visible light and near-infrared rays; and a cermet formed on the light incidence plane of the heat-resistant metal. Thus, there can be achieved desirable absorption and radiation characteristics being such that absorption is performed in the visible light region meanwhile reflection is performed in the infrared region. Furthermore, the cermet does not need complicated film-formation control, and therefore, the high heat resistance can be maintained.

Provided are a heat-absorbing material having high heat resistance and high wavelength selectivity, and a process for producing the same. The heat-absorbing material includes: a heat-resistant metal having the substantially same periodic structure in the light incidence plane as the wavelength of sunlight having a specific wavelength in the wavelength regions of visible light and near-infrared rays; and a cermet formed on the light incidence plane of the heat-resistant metal. Thus, there can be achieved desirable absorption and radiation characteristics being such that absorption is performed in the visible light region meanwhile reflection is performed in the infrared region. Furthermore, the cermet does not need complicated film-formation control, and therefore, the high heat resistance can be maintained.

An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having an interior space suitable to contain the fluid, a metal plate and the metal conveyor belt; and an electrical current supply. In an electropolishing application, the current passes from the metal conveyor belt, through the fluid and into the metal plate. In an electroplating application, the current passes from the metal plate, through the fluid and into the metal conveyor belt.

An electropolishing or electroplating system and method for metal conveyor belts is described. In some embodiments, the system has a metal conveyor belt held in constant tension; a tank for holding an electrolytic fluid, the tank having an interior space suitable to contain the fluid, a metal plate and the metal conveyor belt; and an electrical current supply. In an electropolishing application, the current passes from the metal conveyor belt, through the fluid and into the metal plate. In an electroplating application, the current passes from the metal plate, through the fluid and into the metal conveyor belt.

The invention discloses a continuous electrochemical machining apparatus, which comprises an electrode wheel and an auxiliary module. The auxiliary module pushes the material tape to the insulating part of the electrode wheel. The electrode wheel drives the material tape to move. Electrochemical machining is performed on the material tape using at least a conductive pattern of the electrode wheel for forming a plurality of patterns on the material tape. Thereby, continuous electrochemical machining can be performed on the material tape.

The invention discloses a continuous electrochemical machining apparatus, which comprises an electrode wheel and an auxiliary module. The auxiliary module pushes the material tape to the insulating part of the electrode wheel. The electrode wheel drives the material tape to move. Electrochemical machining is performed on the material tape using at least a conductive pattern of the electrode wheel for forming a plurality of patterns on the material tape. Thereby, continuous electrochemical machining can be performed on the material tape.

A method of manufacturing a grain oriented electrical steel sheet includes subjecting a steel slab to a rolling process including cold rolling to obtain a steel sheet with a final sheet thickness, the steel slab containing by mass % C: 0.01% to 0.20%, Si: 2.0% to 5.0%, Mn: 0.03% to 0.20%, sol. Al: 0.010% to 0.05%, N: 0.0010% to 0.020%, at least one element selected from S and Se in a total of 0.005% to 0.040%, and the balance including Fe and incidental impurities; forming, by a chemical process, a linear groove extending in a direction forming an angle of 45° or less with a direction orthogonal to a rolling direction of the steel sheet; subjecting the steel sheet to decarburization annealing; applying an annealing separator thereon mainly composed of MgO; and subjecting the steel sheet to final annealing to manufacture a grain oriented electrical steel sheet.