Relates to a method of producing a semiconductor crystal having generation of a defect suppressed in the semiconductor single crystal. The production method includes the steps of: forming a boron oxide film (31) on the inner wall of a growth container (10) having a bottom section and a body section continuous to the bottom section; bringing the boron oxide film (31) into contact with boron oxide melt containing silicon oxide to form a boron oxide film (32) containing silicon oxide on the inner wall of the growth container (10); forming raw material melt (34) above seed crystal (20) placed in and on the bottom section of the growth container (10); and solidifying the raw material melt (34) from the seed crystal (20) side to grow a semiconductor single crystal.

Relates to a method of producing a semiconductor crystal having generation of a defect suppressed in the semiconductor single crystal. The production method includes the steps of: forming a boron oxide film (31) on the inner wall of a growth container (10) having a bottom section and a body section continuous to the bottom section; bringing the boron oxide film (31) into contact with boron oxide melt containing silicon oxide to form a boron oxide film (32) containing silicon oxide on the inner wall of the growth container (10); forming raw material melt (34) above seed crystal (20) placed in and on the bottom section of the growth container (10); and solidifying the raw material melt (34) from the seed crystal (20) side to grow a semiconductor single crystal.

A silicon single crystal substrate for vapor phase growth, having the silicon single crystal substrate being made of an FZ crystal having a resistivity of 1000 Ωcm or more, wherein the surface of the silicon single crystal substrate is provided with a high nitrogen concentration layer having a nitrogen concentration higher than that of other regions and a nitrogen concentration of 5×10.sup.15 atoms/cm.sup.3 or more and a thickness of 10 to 100 μm.

A method for manufacturing an epitaxial substrate includes the steps of: epitaxially growing a group III nitride semiconductor layer on a substrate; removing the substrate from a growth furnace; irradiating a surface of the group III nitride semiconductor layer with ultraviolet light while exposing the surface to an atmosphere containing oxygen; and measuring a sheet resistance value of the group III nitride semiconductor layer.

A recess and a recess are formed at places where a threading dislocation and a threading dislocation reach a surface of a third semiconductor layer. A through-hole and a through-hole are formed in a second semiconductor layer under places of the recess and the recess, the through-hole and the through-hole extending through the second semiconductor layer. A first semiconductor layer is oxidized through the recess, the recess, the through-hole, and the through-hole to form an insulation film that covers a lower surface of the second semiconductor layer. The third semiconductor layer is subjected to crystal regrowth.

The present disclosure provides systems and methods for forming block crystals of a metal compound. In some embodiments, a method for forming block crystals of a metal compound may comprise (a) introducing a source metal into a furnace; (b) forming a complete or partial vacuum in the furnace and increasing a temperature of the furnace above a melting point of the source metal to form a liquid flow of the source metal; (c) breaking the liquid flow to generate particles of the source metal; (d) ionizing the particles in an ionization chamber to form ionized particles, wherein the ionization chamber has a temperature above a decomposition temperature of the metal compound; and (e) introducing the ionized particles into a growth chamber comprising a reactive gas that is reactive with the ionized particles, to thereby form the block crystals of the metal compound.

A method comprising: forming a first mask over a substrate; forming one or more shadow walls in the openings of the first mask by selective area growth; forming a second mask over the substrate and shadow walls; forming a second material in the openings of the second mask by selective area growth; and depositing a layer of deposition material by angled deposition over parts of the substrate, shadow walls and second material, whereby regions shadowed by the shadow walls are left uncoated. In embodiments the second material may be a semiconductor and the deposition material may be a superconductor, and the method may be used to form one or more semiconductor-superconductor nanowires for inducing majorana zero modes as part of a quantum computing device.

A method for washing an aluminum nitride single crystal substrate, the aluminum nitride single crystal substrate including: an aluminum-polar face; and a nitrogen-polar face opposite to the aluminum-polar face, the method including: (a) scrubbing a surface of the nitrogen-polar face.

A system for simultaneously manufacturing more than one single crystal of a semiconductor material by physical vapor transport (PVT) includes a plurality of reactors and a common vacuum channel connecting at least a pair of reactors of the plurality of reactors. Each reactor has an inner chamber adapted to accommodate a PVT growth structure for growth of a single semiconductor crystal. The common vacuum channel is connectable to a vacuum pump system for creating and/or controlling a common gas phase condition in the inner chambers of the pair of reactors.

A gas phase nanowire growth apparatus including a reaction chamber, a first input and a second input. The first input is located concentrically within the second input and the first and second input are configured such that a second fluid delivered from the second input provides a sheath between a first fluid delivered from the first input and a wall of the reaction chamber.