C30B29/52

Directional solidification casting assembly and method

A directional solidification casting assembly includes a directional solidification mold having an interior chamber with a shape of an object to be cast using directional solidification of molten metal in a growth direction of the mold and a feed line conduit. The conduit is fluidly coupled with a container source of the molten metal and is coupled with the mold at a gating. The feed line conduit conveys the molten metal into the mold through the gating for directional solidification of the object to be cast in the mold. At least a downstream portion of the feed line conduit that is between the intermediate location of the feed line conduit and the second open end of the feed line conduit is located below the gating along the growth direction of the mold.

Fe—Co—Al alloy magnetic thin film

An Fe—Co—Al alloy magnetic thin film contains, in terms of atomic ratio, 20% to 30% Co and 1.5% to 2.5% Al. The Fe—Co—Al alloy magnetic thin film has a crystallographic orientation such that the (100) plane is parallel to a substrate surface and the <100> direction is perpendicular to the substrate surface. The Fe—Co—Al alloy magnetic thin film has good magnetic properties, that is, a magnetization of 1440 emu/cc or more, a coercive force of less than 100 Oe, a damping factor of less than 0.01, and an FMR linewidth ΔH at 30 GHz of less than 70 Oe.

Fe—Co—Al alloy magnetic thin film

An Fe—Co—Al alloy magnetic thin film contains, in terms of atomic ratio, 20% to 30% Co and 1.5% to 2.5% Al. The Fe—Co—Al alloy magnetic thin film has a crystallographic orientation such that the (100) plane is parallel to a substrate surface and the <100> direction is perpendicular to the substrate surface. The Fe—Co—Al alloy magnetic thin film has good magnetic properties, that is, a magnetization of 1440 emu/cc or more, a coercive force of less than 100 Oe, a damping factor of less than 0.01, and an FMR linewidth ΔH at 30 GHz of less than 70 Oe.

Additive manufacturing based multi-layer fabrication/repair

A method of additively manufacturing includes generating a thermal model driven scan map that identifies an equiaxed cap region, a single crystal (SX) region, and a columnar to equiaxed transition (CET) region; and forming an active melt pool with respect to the thermal model driven scan map such that a depth of the active melt pool is greater than a thickness of the equiaxed transition (CET) region.

METHOD FOR DEPOSITING BORON CONTAINING SILICON GERMANIUM LAYERS
20220364262 · 2022-11-17 ·

Methods and devices for epitaxially growing boron doped silicon germanium layers. The layers may be used, for example, as a p-type source and/or drain regions in field effect transistors.

Permanent Magnet Alloys For GAP Magnets

Provided are Ce/Co/Cu permanent magnet alloys containing certain refractory metals, such as Ta and/or Hf, and optionally Fe which represent economically more favorable alternative to Sm-based magnets with respect to both material and processing costs and which retain and/or improve magnetic characteristics useful for GAP MAGNET applications.

Permanent Magnet Alloys For GAP Magnets

Provided are Ce/Co/Cu permanent magnet alloys containing certain refractory metals, such as Ta and/or Hf, and optionally Fe which represent economically more favorable alternative to Sm-based magnets with respect to both material and processing costs and which retain and/or improve magnetic characteristics useful for GAP MAGNET applications.

METHOD OF FORMING CONDUCTIVE MEMBER AND METHOD OF FORMING CHANNEL
20230086545 · 2023-03-23 ·

A method of forming conductive member includes: forming, on substrate, first portion containing first element constituting the conductive member to be obtained and second element causing eutectic reaction with the first element, and second portion containing third element constituting intermetallic compound with the second element; crystallizing primary crystals of the first element by adjusting temperature of the substrate after bringing the first portion into liquid phase state; growing crystal grains of the first element by diffusing the second element from the first portion into the second portion to increase ratio of the first element in crystal state to the first and second elements in the liquid phase state in the first portion while maintaining the temperature of the substrate at the same temperature; and turning the first portion, after completing diffusion of the second element into the second portion, into the conductive member having crystal grains of the first element.

METHOD OF FORMING CONDUCTIVE MEMBER AND METHOD OF FORMING CHANNEL
20230086545 · 2023-03-23 ·

A method of forming conductive member includes: forming, on substrate, first portion containing first element constituting the conductive member to be obtained and second element causing eutectic reaction with the first element, and second portion containing third element constituting intermetallic compound with the second element; crystallizing primary crystals of the first element by adjusting temperature of the substrate after bringing the first portion into liquid phase state; growing crystal grains of the first element by diffusing the second element from the first portion into the second portion to increase ratio of the first element in crystal state to the first and second elements in the liquid phase state in the first portion while maintaining the temperature of the substrate at the same temperature; and turning the first portion, after completing diffusion of the second element into the second portion, into the conductive member having crystal grains of the first element.

Mg2Si SINGLE CRYSTAL, Mg2Si SINGLE CRYSTAL SUBSTRATE, INFRARED LIGHT RECEIVING ELEMENT AND METHOD FOR PRODUCING Mg2Si SINGLE CRYSTAL

Provided is a Mg.sub.2Si single crystal in which generation of low-angle grain boundaries in the crystal is satisfactorily suppressed. A Mg.sub.2Si single crystal, wherein a variation in crystal orientation as measured by XRD is in a range of ±0.020°.