One embodiment is directed to a method of testing a polycrystalline laminate formed on a substrate surface of a substrate which is mounted to a sample holder. The substrate surface includes a substrate length edge having a substrate length and a substrate width edge having a substrate width. The polycrystalline laminate has a notch extending beyond the substrate width edge of the substrate surface. The method comprises at least one of: for tensile cleavage testing, applying a tensile load on the notch of the polycrystalline laminate in a direction generally perpendicular to the substrate surface and away from the substrate surface; and for shear sliding testing, applying a shear load on the end of the polycrystalline laminate in a length direction generally parallel to the substrate length edge of the substrate surface. A notch edge formation piece and a notch end formation piece may be used to form the laminate.

One embodiment is directed to a method of testing a polycrystalline laminate formed on a substrate surface of a substrate which is mounted to a sample holder. The substrate surface includes a substrate length edge having a substrate length and a substrate width edge having a substrate width. The polycrystalline laminate has a notch extending beyond the substrate width edge of the substrate surface. The method comprises at least one of: for tensile cleavage testing, applying a tensile load on the notch of the polycrystalline laminate in a direction generally perpendicular to the substrate surface and away from the substrate surface; and for shear sliding testing, applying a shear load on the end of the polycrystalline laminate in a length direction generally parallel to the substrate length edge of the substrate surface. A notch edge formation piece and a notch end formation piece may be used to form the laminate.

A method for growing a non-polar a-plane gallium nitride includes cleaning of r-sapphire substrate, and nitridating for initiating growth sequences. The growth sequences include growing a gallium nitride nucleation layer, growing a thick first layer of gallium nitride, growing a film stack of gallium nitride and aluminum nitride as a superlattices layer, and overgrowing of gallium nitride on superlattices layer to form a second layer. The non-polar a-plane gallium nitride is grown by inserting multiple layers of a gallium nitride and an aluminum nitride for improving lateral surface morphology of gallium nitride on r-sapphire substrate.

Provided are an atomic layer sheet that contains boron and oxygen as framework elements, is networked by nonequilibrium couplings having boron-boron bonds, and has a molar ratio of oxygen to boron (oxygen/boron) of less than 1.5, a laminated sheet containing a plurality of such atomic layer sheets and metal ions between ones of the sheets, and a thermotropic liquid crystal and a lyotropic liquid crystal containing these. In addition, there is provided a method for manufacturing an atomic layer sheet and/or a laminated sheet containing boron and oxygen, the method including: adding MBH.sub.4, where M represents an alkali metal ion, into a solvent containing an organic solvent in an inert gas atmosphere to prepare a solution; and exposing the solution to an atmosphere containing oxygen.

Provided are an atomic layer sheet that contains boron and oxygen as framework elements, is networked by nonequilibrium couplings having boron-boron bonds, and has a molar ratio of oxygen to boron (oxygen/boron) of less than 1.5, a laminated sheet containing a plurality of such atomic layer sheets and metal ions between ones of the sheets, and a thermotropic liquid crystal and a lyotropic liquid crystal containing these. In addition, there is provided a method for manufacturing an atomic layer sheet and/or a laminated sheet containing boron and oxygen, the method including: adding MBH.sub.4, where M represents an alkali metal ion, into a solvent containing an organic solvent in an inert gas atmosphere to prepare a solution; and exposing the solution to an atmosphere containing oxygen.

This disclosure relates to a superlattice structure, an LED epitaxial structure, a display device, and a method for manufacturing the LED epitaxial structure. The superlattice structure includes at least two superlattice units which are grown in stacking layers. Each of the at least two superlattice units includes a first n-type GaN layer, a second n-type GaN layer, a first n-type GaInN layer, and a second n-type GaInN layer which are grown in stacking layers. The first n-type GaN layer has a doping concentration which is constant along a growth direction, the second n-type GaN layer has a doping concentration which gradually increases along the growth direction, the first n-type GaInN layer has a doping concentration which gradually decreases along the growth direction, and the second n-type GaInN layer has a doping concentration which is constant along the growth direction.

This disclosure relates to a superlattice structure, an LED epitaxial structure, a display device, and a method for manufacturing the LED epitaxial structure. The superlattice structure includes at least two superlattice units which are grown in stacking layers. Each of the at least two superlattice units includes a first n-type GaN layer, a second n-type GaN layer, a first n-type GaInN layer, and a second n-type GaInN layer which are grown in stacking layers. The first n-type GaN layer has a doping concentration which is constant along a growth direction, the second n-type GaN layer has a doping concentration which gradually increases along the growth direction, the first n-type GaInN layer has a doping concentration which gradually decreases along the growth direction, and the second n-type GaInN layer has a doping concentration which is constant along the growth direction.

A method for manufacturing a sputtering target with which an oxide semiconductor film with a small amount of defects can be formed is provided. Alternatively, an oxide semiconductor film with a small amount of defects is formed. A method for manufacturing a sputtering target is provided, which includes the steps of: forming a polycrystalline In-M-Zn oxide (M represents a metal chosen among aluminum, titanium, gallium, yttrium, zirconium, lanthanum, cesium, neodymium, and hafnium) powder by mixing, sintering, and grinding indium oxide, an oxide of the metal, and zinc oxide; forming a mixture by mixing the polycrystalline In-M-Zn oxide powder and a zinc oxide powder; forming a compact by compacting the mixture; and sintering the compact.

A method for manufacturing a sputtering target with which an oxide semiconductor film with a small amount of defects can be formed is provided. Alternatively, an oxide semiconductor film with a small amount of defects is formed. A method for manufacturing a sputtering target is provided, which includes the steps of: forming a polycrystalline In-M-Zn oxide (M represents a metal chosen among aluminum, titanium, gallium, yttrium, zirconium, lanthanum, cesium, neodymium, and hafnium) powder by mixing, sintering, and grinding indium oxide, an oxide of the metal, and zinc oxide; forming a mixture by mixing the polycrystalline In-M-Zn oxide powder and a zinc oxide powder; forming a compact by compacting the mixture; and sintering the compact.

A method for producing a nickel cobalt complex hydroxide includes first crystallization of supplying a solution containing Ni, Co and Mn, a complex ion forming agent and a basic solution separately and simultaneously to one reaction vessel to obtain nickel cobalt complex hydroxide particles, and a second crystallization of, after the first crystallization, further supplying a solution containing nickel, cobalt, and manganese, a solution of a complex ion forming agent, a basic solution, and a solution containing said element M separately and simultaneously to the reaction vessel to crystallize a complex hydroxide particles containing nickel, cobalt, manganese and said element M on the nickel cobalt complex hydroxide particles crystallizing a complex hydroxide particles comprising Ni, Co, Mn and the element M on the nickel cobalt complex hydroxide particles.