C30B29/68

EPITAXIAL FILM WITH MULTIPLE STRESS STATES AND METHOD THEREOF
20230122332 · 2023-04-20 · ·

A method for manufacturing epitaxial films with multiple stress states, comprising steps of: providing a first single crystal substrate, and forming a sacrificial layer and a first epitaxial film on the first single crystal substrate, wherein the first epitaxial film is made of a first material;

removing the sacrificial layer to separate the first epitaxial film from the first single crystal substrate; transferring the first epitaxial film to a second single crystal substrate, wherein the second single crystal substrate is made of a second material, a partial surface of the second single crystal substrate being overlapped by the first epitaxial film; applying epitaxies onto the first epitaxial film and the second single crystal substrate to form a second epitaxial film on the first epitaxial film and the second single crystal substrate.

HVPE apparatus and methods for growing indium nitride and indium nitride materials and structures grown thereby

Hydride phase vapor epitaxy (HVPE) growth apparatus, methods and materials and structures grown thereby. An HVPE reactor includes generation, accumulation, and growth zones. A source material for growth of indium nitride is generated and collected inside the reactor. A first reactive gas reacts with an indium source inside the generation zone to produce a first gas product having an indium-containing compound. The first gas product is cooled and condenses into a liquid or solid condensate or source material having an indium-containing compound. The source material is collected in the accumulation zone. Vapor or gas resulting from evaporation of the condensate forms a second gas product, which reacts with a second reactive gas in the growth zone for growth of indium nitride.

HVPE apparatus and methods for growing indium nitride and indium nitride materials and structures grown thereby

Hydride phase vapor epitaxy (HVPE) growth apparatus, methods and materials and structures grown thereby. An HVPE reactor includes generation, accumulation, and growth zones. A source material for growth of indium nitride is generated and collected inside the reactor. A first reactive gas reacts with an indium source inside the generation zone to produce a first gas product having an indium-containing compound. The first gas product is cooled and condenses into a liquid or solid condensate or source material having an indium-containing compound. The source material is collected in the accumulation zone. Vapor or gas resulting from evaporation of the condensate forms a second gas product, which reacts with a second reactive gas in the growth zone for growth of indium nitride.

SEMICONDUCTOR DEVICE
20230066135 · 2023-03-02 · ·

A semiconductor device and a method of manufacturing a semiconductor device according to one or more embodiments are disclosed. An interface layer is formed by implanting ionized impurities into a first layer comprising single-crystalline silicon carbide (SiC). Surfaces of the interface layer and a second layer comprising polycrystalline silicon carbide (SiC) are activated. The activated surfaces of the interface layer and the second layer are contacted and bonded. A covering layer is formed to cover a top surface and sides of the first layer, sides of the interface layer, and sides of the second layer.

SEMICONDUCTOR DEVICE
20230066135 · 2023-03-02 · ·

A semiconductor device and a method of manufacturing a semiconductor device according to one or more embodiments are disclosed. An interface layer is formed by implanting ionized impurities into a first layer comprising single-crystalline silicon carbide (SiC). Surfaces of the interface layer and a second layer comprising polycrystalline silicon carbide (SiC) are activated. The activated surfaces of the interface layer and the second layer are contacted and bonded. A covering layer is formed to cover a top surface and sides of the first layer, sides of the interface layer, and sides of the second layer.

METHODS FOR POLYMORPHIC SCREENING
20230075935 · 2023-03-09 ·

A method for screening a target compound for polymorphic forms is provided. The method comprises providing a library of mixed-crystal seeds, each mixed-crystal seed consisting essentially of the target compound and at least one structural analog that is structurally analogous to the target compound; and for each mixed-crystal seed: introducing the mixed-crystal seed into a crystallization medium comprising the target compound, under conditions suitable for crystallization of the target compound; monitoring the formation of crystals of the target compound; and when formed, characterizing the crystals of the target compound.

METHODS FOR POLYMORPHIC SCREENING
20230075935 · 2023-03-09 ·

A method for screening a target compound for polymorphic forms is provided. The method comprises providing a library of mixed-crystal seeds, each mixed-crystal seed consisting essentially of the target compound and at least one structural analog that is structurally analogous to the target compound; and for each mixed-crystal seed: introducing the mixed-crystal seed into a crystallization medium comprising the target compound, under conditions suitable for crystallization of the target compound; monitoring the formation of crystals of the target compound; and when formed, characterizing the crystals of the target compound.

Deposition of single phase beta-(AlxGa1-x)2O3 thin films with 0.28< =x<=0.7 on beta Ga2O3(100) or (−201) substrates by chemical vapor deposition

Disclosed herein methods of forming an Al—Ga containing film comprising: a) exposing a substrate comprising a β-Ga.sub.2O.sub.3, wherein the substrate has a (100) or (−201) orientation, to a vapor phase comprising an aluminum precursor and a gallium precursor; and b) forming a β-(Al.sub.xGa.sub.1-x).sub.2O.sub.3 thin film by a chemical vapor deposition at predetermined conditions and wherein x is 0.01≤x≤0.7. Also disclosed herein are devices comprising the inventive films.

Deposition of single phase beta-(AlxGa1-x)2O3 thin films with 0.28< =x<=0.7 on beta Ga2O3(100) or (−201) substrates by chemical vapor deposition

Disclosed herein methods of forming an Al—Ga containing film comprising: a) exposing a substrate comprising a β-Ga.sub.2O.sub.3, wherein the substrate has a (100) or (−201) orientation, to a vapor phase comprising an aluminum precursor and a gallium precursor; and b) forming a β-(Al.sub.xGa.sub.1-x).sub.2O.sub.3 thin film by a chemical vapor deposition at predetermined conditions and wherein x is 0.01≤x≤0.7. Also disclosed herein are devices comprising the inventive films.

Layered group III-V compound and nanosheet containing antimony, and electrical device using the same

Proposed are a layered Group III-V antimony compound, a Group III-V nanosheet that may be prepared using the same, and an electrical device including the materials. There is proposed a layered compound having a composition represented by [Formula 1] M.sub.x−mA.sub.ySb.sub.z (Where M is at least one of Group I elements, A is at least one of Group III elements, x, y, and z are positive numbers which are determined according to stoichiometric ratios to ensure charge balance when m is 0, and 0<m<x).