C03B33/03

CUTTING METHOD AND CUTTING MACHINE TABLE FOR CUTTING SUBSTRATE
20220033293 · 2022-02-03 ·

The present application discloses a cutting method and a cutting machine table for cutting a substrate, where the cutting method includes following steps: cutting a large substrate to be cut to obtain a finished substrate falling on a second cutting machine table; after the cutting, driving the second cutting machine table according to a preset parameter to enable a driving-away height difference to be formed between the second cutting machine table and the first cutting machine table; driving the second cutting machine table away from the first cutting machine table; and resetting the second cutting machine table to an initial state.

PROCESS FOR MANUFACTURING GLASS SHEETS OF COMPLEX SHAPE
20170217819 · 2017-08-03 ·

The process relates to the manufacture of a plurality of glazings of complex shape from a rectangular sheet of float glass of large dimensions. The process includes at a first station for cutting the glass sheet, scoring at least one cutting line corresponding to at least one ready-to-shape edge of the glazings; a first breaking operation; at a second cutting station, scoring at least one cutting line corresponding to at least one other ready-to-shape edge of the glazings, and a second breaking operation.

PROCESS FOR MANUFACTURING GLASS SHEETS OF COMPLEX SHAPE
20170217819 · 2017-08-03 ·

The process relates to the manufacture of a plurality of glazings of complex shape from a rectangular sheet of float glass of large dimensions. The process includes at a first station for cutting the glass sheet, scoring at least one cutting line corresponding to at least one ready-to-shape edge of the glazings; a first breaking operation; at a second cutting station, scoring at least one cutting line corresponding to at least one other ready-to-shape edge of the glazings, and a second breaking operation.

MACHINE AND A METHOD FOR PROCESSING LATERAL EDGES OF GLASS PLATES, PLATES OF STONE MATERIAL OR PLATES OF SYNTHETIC MATERIAL
20220266408 · 2022-08-25 · ·

In a machine and in a method for processing lateral edges of glass plates, plates of stone material, and plates of synthetic material, there is a group of gripping members of the plate configured to hold a plate in a horizontal position. The plate is caused to advance in a conveying longitudinal direction, in such a way as to bring a lateral edge of the plate to engage in succession an aligned series of grinding tools forming part of a stationary machining unit. In one example, the group of gripping members of the plate is rotatably carried around a vertical axis by a carriage, which is movable in the conveying longitudinal direction and in a transverse direction orthogonal to the longitudinal direction. The gripping members are carried by the carriage in such a way as to be adjustable in position, by means of electronically-controlled actuator devices, with respect to the carriage and relative to each other.

MACHINE AND A METHOD FOR PROCESSING LATERAL EDGES OF GLASS PLATES, PLATES OF STONE MATERIAL OR PLATES OF SYNTHETIC MATERIAL
20220266408 · 2022-08-25 · ·

In a machine and in a method for processing lateral edges of glass plates, plates of stone material, and plates of synthetic material, there is a group of gripping members of the plate configured to hold a plate in a horizontal position. The plate is caused to advance in a conveying longitudinal direction, in such a way as to bring a lateral edge of the plate to engage in succession an aligned series of grinding tools forming part of a stationary machining unit. In one example, the group of gripping members of the plate is rotatably carried around a vertical axis by a carriage, which is movable in the conveying longitudinal direction and in a transverse direction orthogonal to the longitudinal direction. The gripping members are carried by the carriage in such a way as to be adjustable in position, by means of electronically-controlled actuator devices, with respect to the carriage and relative to each other.

LASER PROCESSING SYSTEM AND METHOD FOR GLASS WORKPIECE

A laser processing system for a glass workpiece comprises a frame with a first laser module thereon, a modifying device, and a blanking device. The blanking device comprises a second laser module, a hollow support element, a clamping module disposed on the frame, a heater disposed on the hollow support element, and a cooler connected to the clamping module. A method adapted to the system comprises a modifying process, a determining process, and a blanking process. In the modifying process, a first laser beam is irradiated to the glass workpiece along a processing contour line to intermittently modify the glass workpiece. According to the determining process, the blanking process is processed to have a crack being generated in a modified portion of the glass workpiece, wherein the crack divides the glass workpiece into an outer area and an inner area, and changes a temperature of the glass workpiece to have the glass workpiece being deformed, so that the outer area and the inner area are separated.

Singulation of optical waveguide materials

Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.

Cutting method and cutting machine table for cutting substrate
11731895 · 2023-08-22 · ·

The present application discloses a cutting method and a cutting machine table for cutting a substrate, where the cutting method includes following steps: cutting a large substrate to be cut to obtain a finished substrate falling on a second cutting machine table; after the cutting, driving the second cutting machine table according to a preset parameter to enable a driving-away height difference to be formed between the second cutting machine table and the first cutting machine table; driving the second cutting machine table away from the first cutting machine table; and resetting the second cutting machine table to an initial state.

Cutting method and cutting machine table for cutting substrate
11731895 · 2023-08-22 · ·

The present application discloses a cutting method and a cutting machine table for cutting a substrate, where the cutting method includes following steps: cutting a large substrate to be cut to obtain a finished substrate falling on a second cutting machine table; after the cutting, driving the second cutting machine table according to a preset parameter to enable a driving-away height difference to be formed between the second cutting machine table and the first cutting machine table; driving the second cutting machine table away from the first cutting machine table; and resetting the second cutting machine table to an initial state.

APPARATUS FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

An apparatus for manufacturing a display device includes: a stage unit; and a suction unit located above the stage unit, wherein the suction unit includes: a main body including an outer box with top and bottom openings and an inner cup disposed in the outer box; a first air blower disposed above the main body and including a first main pipe extending in a first direction and a second air blower including a second main pipe extending in a second direction intersecting the first direction; a lower plate coupled to a lower end of the outer box and including a through hole; and a suction inlet defined by an inner end of the lower plate defining the through hole and a lower end of the inner cup, wherein the suction inlet is opened downward.