In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

A method for producing a decorative panel, appearing and/or feeling like a machined metal, including taking a glass substrate, including at least one first surface; and one or more solid metal films, made of one or more metal(s) or metal alloy(s); generating a pulsed LASER beam; directing a metal deposition on at least the first surface, disposing the one or more metal film(s) facing the at least first surface, between the substrate and the LASER source, and applying the LASER beam on the one or more metal film(s) transferring the one or more metal(s) or metal alloy(s) onto the at least first surface, forming a coating including a metal layer covering all or part of the at least first surface, the metal layer including a top surface; and surfacing the metal coating top surface to alter the surface condition giving it the appearance and/or feel of a machined metal.

A method for producing a decorative panel, appearing and/or feeling like a machined metal, including taking a glass substrate, including at least one first surface; and one or more solid metal films, made of one or more metal(s) or metal alloy(s); generating a pulsed LASER beam; directing a metal deposition on at least the first surface, disposing the one or more metal film(s) facing the at least first surface, between the substrate and the LASER source, and applying the LASER beam on the one or more metal film(s) transferring the one or more metal(s) or metal alloy(s) onto the at least first surface, forming a coating including a metal layer covering all or part of the at least first surface, the metal layer including a top surface; and surfacing the metal coating top surface to alter the surface condition giving it the appearance and/or feel of a machined metal.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

The present disclosure provides a composite conductive substrate exhibiting enhanced properties both in the folding endurance and the electric conductivity and a method of manufacturing the composite conductive substrate. A composite conductive substrate according to an exemplary embodiment of the present disclosure includes: an insulating layer; a metal nanowire structure embedded beneath one surface of the insulating layer; and a metal thin film coupled to the metal nanowire structure. The composite conductive substrate may be fabricated in an order of the insulating film, the metal nanowire structure, and the metal thin film, or vice versa.

The present disclosure provides a composite conductive substrate exhibiting enhanced properties both in the folding endurance and the electric conductivity and a method of manufacturing the composite conductive substrate. A composite conductive substrate according to an exemplary embodiment of the present disclosure includes: an insulating layer; a metal nanowire structure embedded beneath one surface of the insulating layer; and a metal thin film coupled to the metal nanowire structure. The composite conductive substrate may be fabricated in an order of the insulating film, the metal nanowire structure, and the metal thin film, or vice versa.

Embodiments are related generally to conductive interconnects formed on substrates, and more particularly to a glass ceramic, or glass-ceramic substrate having copper interconnects disposed thereon.

Embodiments are related generally to conductive interconnects formed on substrates, and more particularly to a glass ceramic, or glass-ceramic substrate having copper interconnects disposed thereon.