A method of processing a double sided wafer of a microelectromechanical device includes spinning a resist onto a first side of a first wafer. The method further includes forming pathways within the resist to expose portions of the first side of the first wafer. The method also includes etching one or more depressions in the first side of the first wafer through the pathways, where each of the depressions have a planar surface and edges. Furthermore, the method includes depositing one or more adhesion metals over the resist such that the one or more adhesion metals are deposited within the depressions, and then removing the resist from the first wafer. The method finally includes depositing indium onto the adhesion metals deposited within the depressions and bonding a second wafer to the first wafer by compressing the indium between the second wafer and the first wafer.

A metal composition suitable for originating a joint by means of welding with a borosilicate glass for a solar collector. The composition, expressed in weight percentage, comprises the following alloy elements: TABLE-US-00001 Ni Co Mn Si C Ti Zr Ta Ti + Zr + Ta 28-31 15-18 0.5 0.3 0.05 0.30 0.30 0.30 0.40
and it is such that 45.5(Ni+Co)46.5, and that (Ti+Ta+Zr)4C, the remaining part being made up of iron, apart from the inevitable impurities. Additionally, a metal ring made of the metal composition described above and suitable for originating a metal-glass joint by means of welding; the metal-glass joint thus obtained; and the tubular solar collector thus obtained.

What is disclosed is a lead-free glass, which is a V.sub.2O.sub.5TeO.sub.2RO (at least one selected from the group consisting of MgO, CaO, SrO, and BaO)ZnO glass and has a low softening point, comprising: 5-55 wt % of V.sub.2O.sub.5, 5-75 wt % of TeO.sub.2, 1-25 wt % of RO (at least one selected from the group consisting of MgO, CaO, SrO, and BaO) in total, 0.1-6 wt % of ZnO, and 0.1-3 wt % of R.sub.2O (at least one selected from the group consisting of Li.sub.2O, Na.sub.2O, and K.sub.2O) in total. This glass can be used as a sealing material providing fluidity which is capable of being sealed at a temperature of 400? C. or less.

A method of forming a solder composition comprises mixing indium, nickel, copper, silver, antimony, zinc, and tin together to form an alloy that consists of about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper. about 0.03% to about 4% by weight nickel, about 0.03% to about 1.5% by weight zinc, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The solder composition formed by this method can be used to solder an electrical connector to an electrical contact surface on a glass component.

A vehicle window glass comprises a glass substrate layer, an electrically conductive layer forming a conductive pattern over the glass substrate, a lead-free solder layer on the conductive layer and a metal plate element of an electrical connector on the solder layer. Optionally a coloured ceramic band layer is sintered between the glass substrate layer and the conductive layer. The thickness of the metal plate element is between 0.5 mm and 0.7 mm.

A method is provided for producing a patterned glass wafer for packaging electronic devices in a wafer assembly. The method includes placing a glass sheet between two mold halves and heating until the glass sheet softens, while the mold halves are pressed against one another so that the glass sheet is reshaped and forms a patterned glass wafer. The first mold half has an array of projections and the second mold half has an array of recesses. The mold halves are arranged and shaped so that the recesses and projections oppose each other. The projections introduce cavities into the glass sheet during the reshaping and with the glass flowing into the recesses of the second mold half during the reshaping. The recesses are deep enough for the glass to at least partially not come in contact therewith and to form a convexly shaped glass surface in each recess.

A synthetic quartz glass lid for use in optical device packages is prepared by furnishing a synthetic quartz glass lid precursor comprising a synthetic quartz glass substrate (1) and a metal or metal compound film (2), and forming a metal base adhesive layer (3) on the metal or metal compound film (2). The metal or metal compound film contains Ag, Bi, and at least one element selected from P, Sb, Sn and In.

A method of forming a solder composition comprises mixing indium, nickel, copper, silver, antimony, zinc, and tin together to form an alloy that consists of about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper. about 0.03% to about 4% by weight nickel, about 0.03% to about 1.5% by weight zinc, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The solder composition formed by this method can be used to solder an electrical connector to an electrical contact surface on a glass component.

A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.

A method of manufacturing a nozzle for a droplet generator for a laser-produced plasma radiation source is disclosed. The method comprises disposing a glass capillary in a throughbore of a metal fitting, heating the metal fitting; and applying a pressure to the glass capillary such that the glass capillary conforms to the shape of, and forms a direct glass-to-metal seal with, the throughbore. Also disclosed is a nozzle for a droplet generator for a laser-produced plasma radiation source, and the radiation source itself, wherein the nozzle comprises the glass capillary for emitting fuel as droplets and the metal fitting for coupling the glass capillary to a body of the droplet generator, the glass capillary being conformed to a shape of a throughbore of the metal fitting, and wherein the glass capillary forms a direct glass-to-metal seal with the throughbore.