C04B35/20

Method and compositions for embedding electronics in fiber-composite parts fabricated via compression molding

A fiber-composite part having one or more electronic components that are located in arbitrary regions of the internal volume of the part are fabricated using a preform charge. The preform charge has a structure that corresponds to that of the mold cavity in which the part is being formed. By incorporating the electronic components in the preform charge, such components are then precisely located, spatially oriented, and constrained, and such location and orientation is maintained during molding to produce a part with the electronic components in the desired locations and orientations within its internal volume.

Turbine Engine Abradable Systems

A turbine engine has: a first member (22) having a surface bearing an abradable coating, the abradable coating (36) being at least 90% by weight ceramic; and a second member (24) having a surface bearing an abrasive coating. The abrasive coating (56) has a metallic matrix (64) and a ceramic oxide abrasive (66) held by the metallic matrix, the first member and second member mounted for relative rotation with the abrasive coating facing or contacting the abradable coating. At least 50% by weight of the ceramic abrasive has a melting point at least 400K higher than a melting point of at least 20% by weight of the ceramic of the abradable coating.

INORGANIC STRUCTURE AND METHOD FOR PRODUCING SAME

Provided is an inorganic structure including a plurality of inorganic particles; and a binding part that covers a surface of each of the inorganic particles and binds the inorganic particles together, wherein the binding part contains: an amorphous compound containing silicon, oxygen, and one or more metallic elements; and fine particles having an average particle size of 100 nm or less. Also provided is a method for producing an inorganic structure including: a step for obtaining a mixture by mixing a plurality of inorganic particles, a plurality of amorphous silicon dioxide particles, and an aqueous solution containing a metallic element; and a step for pressurizing and heating the mixture under conditions of a pressure of 10 to 600 MPa and a temperature of 50 to 300° C.

REFRACTORIES AND USE THEREOF

A refractory has the form of a dry, mineral batch of fire-resistant mineral materials combined in such a way that refractories which are long-term resistant to fayalite-containing slags, sulfidic melts (mattes), sulfates and non-ferrous metal melts and are used for refractory linings in industrial non-ferrous metal melting furnaces can be manufactured. The refractory at least contains: —at least one coarse-grained olivine raw material as the main component; —magnesia (MgO) meal; —at least one fire-resistant reagent which, during the melting process, acts (in situ) in a reducing manner on non-ferrous metal oxide melts and/or non-ferrous metal iron oxide melts and converts same into non-ferrous metal melts.

REFRACTORIES AND USE THEREOF

A refractory has the form of a dry, mineral batch of fire-resistant mineral materials combined in such a way that refractories which are long-term resistant to fayalite-containing slags, sulfidic melts (mattes), sulfates and non-ferrous metal melts and are used for refractory linings in industrial non-ferrous metal melting furnaces can be manufactured. The refractory at least contains: —at least one coarse-grained olivine raw material as the main component; —magnesia (MgO) meal; —at least one fire-resistant reagent which, during the melting process, acts (in situ) in a reducing manner on non-ferrous metal oxide melts and/or non-ferrous metal iron oxide melts and converts same into non-ferrous metal melts.

Compositions and methods for converting hazardous waste glass into non-hazardous products

The present invention provides compositions and methods for converting hazardous waste glass into safe and usable material. In particular, the present invention provides compositions and methods for producing ceramic products from toxic-metal-containing waste glass, thereby safely encapsulating the metals and other hazardous components within the ceramic products.

Compositions and methods for converting hazardous waste glass into non-hazardous products

The present invention provides compositions and methods for converting hazardous waste glass into safe and usable material. In particular, the present invention provides compositions and methods for producing ceramic products from toxic-metal-containing waste glass, thereby safely encapsulating the metals and other hazardous components within the ceramic products.

LOW-TEMPERATURE CO-FIRED MICROWAVE DIELECTRIC CERAMIC MATERIAL AND PREPARATION METHOD THEREOF

A low-temperature, high stability co-fired microwave dielectric composite of ceramic and glass, including 85-99 wt % microwave dielectric ceramic of formula [1-y-z[(1−x)Mg.sub.2SiO.sub.4−xCa.sub.2SiO.sub.4]−yCaTiO.sub.3−zCaZrO.sub.3, wherein 0.2≦x≦0.7,0.05≦y≦0.3 and 0.02≦z≦0.15], and 1 to 15 wt % with Li.sub.2O—BaO—SrO—CaO—B.sub.2O.sub.3—SiO.sub.2 glass respectively made at a low sintering temperature of ceramic for co-firing with Ag or Cu electrode, employing eutectic phase of ceramic oxides to reduce its melting temperature, a low melting-point glass material with high chemical stability as a sintering aid added to oxides and raw material powders of Li.sub.2O, BaO, SrO, CaO, B.sub.2O.sub.3 and SiO.sub.2, obtained by combining and melting the ingredients in the temperature range between 1000 to 1300° C., quenching and crashing, and then adding it to the main ceramic oxides to form the final composition. This ceramic/glass composite material may be co-fired with an Ag and Cu electrode at 900° C.-970° C. for 0.5-4 hours in a protective atmosphere. After sintering, this dielectric material possesses efficacious microwave dielectric properties, dielectric constant between middle-K to low-K at 8.sup.−15, high quality factors, low dielectric loss, low temperature-capacitance coefficient and superior chemical stability suitable for manufacture of multilayer ceramic devices.

LOW-TEMPERATURE CO-FIRED MICROWAVE DIELECTRIC CERAMIC MATERIAL AND PREPARATION METHOD THEREOF

A low-temperature, high stability co-fired microwave dielectric composite of ceramic and glass, including 85-99 wt % microwave dielectric ceramic of formula [1-y-z[(1−x)Mg.sub.2SiO.sub.4−xCa.sub.2SiO.sub.4]−yCaTiO.sub.3−zCaZrO.sub.3, wherein 0.2≦x≦0.7,0.05≦y≦0.3 and 0.02≦z≦0.15], and 1 to 15 wt % with Li.sub.2O—BaO—SrO—CaO—B.sub.2O.sub.3—SiO.sub.2 glass respectively made at a low sintering temperature of ceramic for co-firing with Ag or Cu electrode, employing eutectic phase of ceramic oxides to reduce its melting temperature, a low melting-point glass material with high chemical stability as a sintering aid added to oxides and raw material powders of Li.sub.2O, BaO, SrO, CaO, B.sub.2O.sub.3 and SiO.sub.2, obtained by combining and melting the ingredients in the temperature range between 1000 to 1300° C., quenching and crashing, and then adding it to the main ceramic oxides to form the final composition. This ceramic/glass composite material may be co-fired with an Ag and Cu electrode at 900° C.-970° C. for 0.5-4 hours in a protective atmosphere. After sintering, this dielectric material possesses efficacious microwave dielectric properties, dielectric constant between middle-K to low-K at 8.sup.−15, high quality factors, low dielectric loss, low temperature-capacitance coefficient and superior chemical stability suitable for manufacture of multilayer ceramic devices.

METHOD FOR FABRICATING CHAMBER PARTS

One embodiment of the disclosure provides a method of fabricating a chamber component with a coating layer disposed on an interface layer with desired film properties. In one embodiment, a method of fabricating a coating material includes providing a base structure comprising an aluminum or silicon containing material, forming an interface layer on the base structure, wherein the interface layer comprises one or more elements from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and forming a coating layer on the interface layer, wherein the coating layer has a molecular structure of Si.sub.vY.sub.wMg.sub.xAl.sub.yO.sub.z. In another embodiment, a chamber component includes an interface layer disposed on a base structure, wherein the interface layer is selected from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and a coating layer disposed on the interface layer, wherein the coating layer has a molecular structure of Si.sub.vY.sub.wMg.sub.xAl.sub.yO.sub.z.