The present invention relates to a foam material comprising:—a structural matrix (1),—at least one guest phase (2), and—a fluid, the material being characterised in that the structural matrix (1) comprises a plurality of interconnected pores (3), the one or more guest phases (2) are accommodated inside at least one pore (3) of the structural matrix (1) and the fluid is accommodated inside the pores (3). The present invention further relates to the process for preparing the foam material according to the present invention and to the various uses of the foam material according to the present invention.

A method for coating a substrate includes spraying a combination of powders. The combination of powders includes: Hf.sub.0.5Si.sub.0.5O.sub.2; Zr.sub.0.5Si.sub.0.5O.sub.2; and, optionally, at least one of HfO.sub.2 and ZrO.sub.2. A molar ratio of said Hf.sub.0.5Si.sub.0.5O.sub.2 and HfO.sub.2 combined to said Zr.sub.0.5Si.sub.0.5O.sub.2 and ZrO.sub.2 combined is from 2:1 to 4:1. A molar ratio of said Hf.sub.0.5Si.sub.0.5O.sub.2 to said HfO.sub.2 is at least 1:3.

A porous discriminating layer is formed on a ceramic support having at least one porous wall by (a) establishing a flow of a gas stream containing agglomerates of particles and (b) calcining said deposited layer to form the discriminating layer. At least a portion of the particles are of a sinter-resistant material or a sinter-resistant material precursor. The particles have a size from 0.01 to 5 microns and the agglomerates have a size of from 10 to 200 microns. This method is an inexpensive and effective route to forming a discriminating layer onto the porous wall.

A porous discriminating layer is formed on a ceramic support having at least one porous wall by (a) establishing a flow of a gas stream containing agglomerates of particles and (b) calcining said deposited layer to form the discriminating layer. At least a portion of the particles are of a sinter-resistant material or a sinter-resistant material precursor. The particles have a size from 0.01 to 5 microns and the agglomerates have a size of from 10 to 200 microns. This method is an inexpensive and effective route to forming a discriminating layer onto the porous wall.

A method of manufacturing a round proppant material includes forming round granules comprising fly ash and clay, wherein the fly ash is the primary component by weight, adding a separating agent to the round granules, calcining the round granules at a temperature in a range between 900° C. and 1150° C., and sintering the round granules at a temperature in a range between 1050° C. and 1350° C.

The invention relates to a wall-flow filter, to a method for the production and the use of the filter for reducing harmful exhaust gases of an internal combustion engine. The wall-flow filter was produced by exposing the filter at least twice successively to a powder-gas aerosol.

A ceramic matrix composite (CMC) component includes at least one seal surface, the at least one seal surface disposed adjacent an interfacing surface for providing a seal therebetween; and a coating disposed on the seal surface. The coating includes an aluminum oxide and/or a silicon dioxide.

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).