Patent classifications
C04B2237/123
CERAMIC SUBSTRATE MANUFACTURING METHOD AND CERAMIC SUBSTRATE MANUFACTURED THEREBY
A ceramic substrate manufacturing method and a ceramic substrate manufactured thereby, may include a seed layer, a brazing filler layer, and a metal foil that are laminated on a ceramic substrate and that are brazed such that the metal foil is firmly bonded to the ceramic substrate by a brazing joint layer. Such methods and devices may substantially improve the adhesion of the metal foil and the ceramic substrate.
Mixed Oxide Materials for Helium Leak Tight, Oxidation Resistant and High Strength Joints Between High Temperature Engineering Materials
A high strength joint material. A material for a joint between a ceramic body and a metal body. A material for a joint between a ceramic body and a ceramic body.
Honeycomb structural body and method for manufacturing the same
A honeycomb structural body 40 includes: a partition wall 48 formed of a porous ceramic which forms and defines a plurality of cells 47 each functioning as a flow path of a fluid and extending from one end surface to the other end surface; and an outer circumference wall 49 formed along the outermost circumference, where an oxide ceramic containing a Fe.sub.3O.sub.4 phase in which a solute component capable of forming a spinel-type oxide with Fe is solid-dissolved is formed.
Method of producing bonded body and method of producing power module substrate
A method of producing a bonded body is disclosed in which a ceramic member made of ceramics and a Cu member made of Cu or a Cu alloy are bonded to each other, the method including: a laminating step of laminating the ceramic member and the Cu member in a state where a CuP-based brazing filler material containing 3 mass % to 10 mass % of P and an active metal material are interposed therebetween; and a heating step of heating the ceramic member and the Cu member which are laminated.
Joined body
A joined body 20 includes a first member 21 which is a ceramic containing Si, a second member 22, and a joining portion 30 which is formed of an electrically conductive oxide containing a Fe.sub.3O.sub.4 phase and which joins the first member 21 and the second member 22. In the joined body 20, no reaction layer is preferably formed at a joining interface between the electrically conductive oxide and the first member 21. The joining portion 30 is preferably formed to have a multilayer structure in which from the first matter 21 to the second member 22, a first layer containing a first oxide of a transition metal, a second layer containing an electrically conductive oxide of a transition metal having a low valence as compared to that of the first oxide, and a mixed layer containing a transition metal and an oxide thereof are formed.
Sintered body comprising a plurality of materials and pressure measuring instrument comprising such a sintered body
A sintered body comprises a first region which comprises a first material having a first effective coefficient of thermal expansion .sub.1, a second region which comprises a second material having a second effective coefficient of thermal expansion .sub.2, a transition region between the first region and the second region in which the effective coefficient of thermal expansion changes from the first effective coefficient of thermal expansion to the second effective coefficient of thermal expansion. The transition region has a sequence of layers with a mixture of at least the first material and the second material, with the mixing ratio of the layers varying in order to achieve a stepwise, in particular monotonic, change in the coefficient of thermal expansion.
Ceramic material, powder, and layer system comprising the ceramic material
An improved ceramic material for heat insulation with selection of specific stabilizers and adapted proportions, includes zirconium oxide with 0.2 wt. % to 8.0 wt. % of the base stabilizers: yttrium oxide (Y.sub.2O.sub.3), hafnium oxide (HfO.sub.2), cerium oxide (CeO.sub.2), calcium oxide (CaO), and/or magnesium oxide (MgO), wherein at least yttrium oxide (Y.sub.2O.sub.3) is used, and optionally at least one of the additional stabilizers: 0.2 wt. % to 20 wt. % of erbium oxide (Er.sub.2O.sub.3) and/or ytterbium oxide (Yb.sub.2O.sub.3).
Compositions for joining and assembling parts made of SiC-based materials
A method for joining, assembling, at least two parts made of silicon carbide-based materials by non-reactive brazing is provided. According to the method, the parts are contacted with a non-reactive brazing composition, the assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient to melt the brazing composition totally or at least partly, and the parts and brazing composition are cooled to that, after solidification of the brazing composition, a moderately refractory joint is formed; wherein the non-reactive brazing composition is an alloy comprising, in atomic percentages, 45% to 65% silicon, 28% to 45% nickel and 5% to 15% aluminum. A brazing composition as defined above is provided. A brazing paste, suspension comprising a powder of said brazing composition and an organic binder as well as a joint and assembly obtained the foregoing method are also provided.
METHOD FOR JOINING DISSIMILAR ENGINE COMPONENTS
A method for joining engine components includes positioning a first plurality of thermal protection structures across a thermal protection space between a first thermal protection surface and a second thermal protection surface. The first and second engine components are locally joined by forming a first plurality of transient liquid phase (TLP) or partial transient liquid phase (PTLP) bonds along corresponding ones of the first plurality of thermal protection structures between the first thermal protection surface and the second thermal protection surface. The second thermal protection surface is formed from a second surface material different from a first surface material of the first thermal protection surface.
METAL-ON-CERAMIC SUBSTRATES
A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that contains thermally conductive particles. This permits the substrate to withstand most common die attach operations, reduces residual stress in the substrate, and simplifies manufacturing processes.