C04B2237/123

Copper/ceramic joined body and insulating circuit substrate

A copper/ceramic bonded body is provided, including: a copper member made of copper or a copper alloy; and a ceramic member, the copper member and the ceramic member being bonded to each other, in which a total concentration of Al, Si, Zn, and Mn is 3 atom % or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper member and the ceramic member to a copper member side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom %.

Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making same

A method for the joining of ceramic pieces includes applying a layer of titanium on a first ceramic piece and applying a layer of titanium on a second ceramic piece; applying a layer of nickel on each of the layers of titanium on the first ceramic piece and the second ceramic piece; applying a layer of nickel phosphorous to each of the layers of nickel on the first ceramic piece and the second ceramic piece; assembling the first ceramic piece and the second ceramic piece with the layers of titanium, nickel, and nickel phosphorous therebetween; pressing the layer of nickel phosphorous of the first ceramic piece against the layer of nickel phosphorous of the second ceramic piece; heating the first ceramic piece and the second ceramic piece to a joining temperature in a vacuum; and cooling the first ceramic piece and the second ceramic piece. A hermetic seal is formed between the first ceramic piece and the second ceramic piece.

Joined body and method for manufacturing the same
10008303 · 2018-06-26 · ·

A joined body includes a first member, a second member having a high coefficient of thermal expansion as compared to that of the first member, and a joint portion which at least partially includes a mixed layer containing metal of a transition metal and an oxide of the transition metal and which joins the first member and the second member. In this joint portion, a first layer containing a first oxide of a transition metal, a second layer containing a second oxide of a transition metal having a low valence as compared to that of the first oxide, and the mixed layer containing metal of a transition metal and an oxide thereof preferably are formed so as to form a multilayer structure.

CUTTING TOOL INSERT

A polycrystalline diamond (PCD) compact and method for making the compact are provided. The method includes bringing a first PCD wafer and a second PCD wafer together at an interface in the presence of a bonding agent to form an unbonded assembly and bonding the wafers together at the interface at a pressure and temperature at which diamond is thermodynamically stable. The first PCD wafer is more thermally stable than the second PCD wafer.

Joined body and method for manufacturing the same
09987825 · 2018-06-05 · ·

A joined body 20 includes a first member 21, a second member 22, and a joint portion 30 which is formed from an oxide ceramic containing a Fe.sub.3O.sub.4 phase in which a solute component capable of forming a spinel-type oxide with Fe is solid-dissolved and which joins the first member 21 and the second member 22.

Converter-cooling element assembly with metallic solder connection

An assembly is provided that includes a ceramic converter for converting light having a first wavelength into light having a second wavelength, a metal-containing reflective coating, and a cooling element. The surface of the ceramic converter is at least partly coated with the metal-containing reflective coating. The coating dissipates the heat from the converter into the cooling element. The cooling element and the metal-containing reflective coating are connected to one another by a metallic solder connection.

Method for Joining Ceramics to Ceramics or Ceramics to Metals, and Apparatus

An assembly including a ceramic body. The assembly comprises a tungsten coupling attached to the ceramic body with a first joint that forms a first helium tight seal between the ceramic body and the tungsten coupling and where the first helium tight seal maintains its integrity at a temperature over 400 C. The assembly includes a metal body attached to the tungsten coupling with a second joint that forms a second helium tight seal between the metal body and the tungsten coupling and where the second helium tight seal maintains its integrity at a temperature over 400 C. A method. A mixture. A coupling.

Interconnector material, intercellular separation structure, and solid electrolyte fuel cell

Provided is an interconnector material which is chemically stable in both oxidation atmospheres and reduction atmospheres, has a high electron conductivity (electric conductivity), a low ionic conductivity, does not contain Cr, and enables a reduction in sintering temperature. The interconnector material is arranged between a plurality of cells each composed of an anode layer, a solid electrolyte layer, and a cathode layer stacked sequentially, and electrically connects the plurality of cells to each other in series in a solid electrolyte fuel cell. The interconnector is formed of a ceramic composition represented by the composition formula La(Fe.sub.1-xAl.sub.x)O.sub.3 in which 0<x<0.5.

Ceramic structural body
12145891 · 2024-11-19 · ·

A ceramic structural body includes a substrate that is composed of a ceramic(s), a hole that is opened on a surface of the substrate, and a seal material that is positioned at an opening portion of the hole.

CERAMIC MATERIALS AND SEALS FOR HIGH TEMPERATURE REACTIVE MATERIAL DEVICES

The disclosure provides seals for devices that operate at elevated temperatures and have reactive metal vapors, such as lithium, sodium or magnesium. In some examples, such devices include energy storage devices that may be used within an electrical power grid or as part of a standalone system. The energy storage devices may be charged from an electricity production source for later discharge, such as when there is a demand for electrical energy consumption.