A method of making a stoichiometric monazite (LaPO.sub.4) composition or a mixture of LaPO.sub.4 and LaP.sub.3O.sub.9 composition, as defined herein. Also disclosed is a method of joining or sealing materials with the compositions, as defined herein.

A method of fabricating a curved surface bonding technique using low melting temperature nanoparticles or nanofilms/nanoparticles of reactive metals as eutectic compounds. The ability of nanomaterials to melt at low temperature lowers the bonding temperature and reduces/eliminates the residual stresses generated in bulk material during the bonding process of two materials with different coefficients of thermal expansion. The nanoscale materials will then be integrated and the new bond will assume properties of the bulk material, including its higher melting temperature.

A ceramic component is provided that is suitable to be placed in high temperature environment. The component includes a first member that is formed of a first material, and a ceramic layer that is bonded to a surface of the first member, which is a side exposed to the high temperature environment and that is formed of a ceramic material having a higher heat resistance than that of the first member. A bonding portion between the first member and the ceramic layer is formed of a composite material having the first material and the ceramic material, and a gradient composition in which an abundance ratio of the first material gradually decreases and an abundance ratio of the ceramic material gradually increases in a direction from the first member to the ceramic layer.

A process for producing a non-dense sintered ceramic molded body having at least two layers, wherein a first powdery ceramic material forming a layer is contacted with at least a second powdery material forming at least a second layer; said first powdery material has a presintering temperature T.sub.1 that is higher than the presintering temperature T.sub.S of said at least second powdery ceramic material; the course of a curve of shrinkage S.sub.1 of said at least first powdery ceramic material differs from the course of a curve of shrinkage S.sub.2 of said at least second powdery material, wherein curve of shrinkage S.sub.1 is shifted towards higher temperatures as compared to curve of shrinkage S.sub.2; and the layers are subjected to a common temperature treatment at a presintering temperature T.sub.S that is lower than the presintering temperature T.sub.1 and at least equal to T.sub.3 to cause sintering that remains in a stage of sintering that has not proceeded to the theoretical density; wherein the curve of shrinkage S.sub.1 is modified by admixing at least one component having a curve of shrinkage S.sub.3 which material is compatible with said powdery ceramic material into said first powdery ceramic material, i.e. has a grain size smaller than the first powdery ceramic material, to equalize the curves of shrinkage S.sub.1 and S.sub.2 in the region of the presintering temperature T.sub.S.

An improved method for embedding one or more sensors in SiC is provided. The method includes depositing a binder onto successive layers of a SiC powder feedstock to produce a dimensionally stable green body have a true-sized cavity. A sensor component is then press-fit into the true-sized cavity. Alternatively, the green body is printed around the sensor component. The assembly (the green body and the sensor component) is heated within a chemical vapor infiltration (CVI) chamber for debinding, and a precursor gas is introduced for densifying the SiC matrix material. During infiltration, the sensor component becomes bonded to the densified SiC matrix, the sensor component being selected to be thermodynamically compatible with CVI byproducts at elevated temperatures, including temperatures in excess of 1000? C.

A method for producing a composite material comprising a planar base material to which an additional layer is applied on one side or both sides via a solder layer, characterized by: providing the base material, wherein the base material has a first surface on at least one side; providing the additional layer and arranging the solder layer between a second surface of the additional layer and the first surface such that when the additional layer is deposited on the first surface, the first surface of the base material is covered by the solder layer in a planar manner; wherein a thickness of the solder layer between the base material and the additional layer is smaller than 12 m; heating the base material and the additional layer on the first surface to at least partially melt the solder layer; and connecting the base material to the at least one additional layer.

A ceramic structure includes a ceramic base member having a main face; a hole extending from the main face into the ceramic base member; a metal electrode layer embedded in the ceramic base member; and a conductive member embedded in the ceramic base member so as to be electrically connected to the metal electrode layer and form a bottom of the hole. Further, the ceramic structure includes: a first metal member joined to the conductive member by a brazing material and having an average linear expansion coefficient not less than the average linear expansion coefficient of the conductive member; one or a plurality of second metal members having a greater average linear expansion coefficient than the first metal member; and a metal terminal joined to the one or the plurality of second metal members and having a greater average linear expansion coefficient than each second metal member.

A heating module of an electronic cigarette atomizer includes a ceramic rod, a connecting element and a heating wire. The heating wire is wound around the ceramic rod, the connecting element is connected to two ends of the heating wire respectively, and the ceramic rod is of a hollow micro-porous structure.

A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of forming a ceramic body in a green state, or, stacking discrete layers of ceramic in a green state upon one another and laminating together. The ceramic body has a first side opposite a second side. At least one via hole is formed straight through the ceramic body extending between the first and second sides. At least one via hole is filled with a conductive paste. The ceramic body and the conductive paste are then dried. The ceramic body and the conductive paste are isostatically pressed at above 1000 psi to remove voids and to form a closer interface for sintering. The ceramic body and the conductive paste are sintered together to form the feedthrough dielectric body. The feedthrough dielectric body is hermetically sealed to a ferrule.

A process for producing a non-dense sintered ceramic molded body having at least two layers, wherein a first powdery ceramic material forming a layer is contacted with at least a second powdery material forming at least a second layer; said first powdery material has a presintering temperature T.sub.1 that is higher than the presintering temperature T.sub.s of said at least second powdery ceramic material; the course of a curve of shrinkage S.sub.1 of said at least first powdery ceramic material differs from the course of a curve of shrinkage S.sub.2 of said at least second powdery material, wherein curve of shrinkage S.sub.1 is shifted towards higher temperatures as compared to curve of shrinkage S.sub.2; and the layers are subjected to a common temperature treatment at a presintering temperature T.sub.s that is lower than the presintering temperature T.sub.1 and at least equal to T.sub.3 to cause sintering that remains in a stage of sintering that has not proceeded to the theoretical density; wherein the curve of shrinkage S.sub.1 is modified by admixing at least one component having a curve of shrinkage S.sub.3 which material is compatible with said powdery ceramic material into said first powdery ceramic material, i. e. has a grain size smaller than the first powdery ceramic material, to equalize the curves of shrinkage S.sub.1 and S.sub.2 in the region of the presintering temperature T.sub.s.