Patent classifications
C04B2237/592
METHOD FOR JOINING SILICON CARBIDE COMPONENTS TO ONE ANOTHER
A method for fabricating assemblies that includes providing a first component that further includes silicon carbide and that has an upper portion and a tapered lower portion; providing a second component that further includes silicon carbide and that has an upper portion that is adapted to receive the tapered lower portion of the first component; providing a predetermined amount of multiphase AlSi braze foil; grinding the AlSi braze foil into a powder; mixing a predetermined amount of braze paste binder with the AlSi powder to form a slurry; uniformly applying the slurry to the tapered lower portion of the first component; uniformly applying the slurry to the upper portion of the second component and inserting the tapered lower portion of the first component into the upper portion of the second component; and heating the applied slurry to a temperature of 725 C. to 1450 C. for a predetermined period of time.
Ceramic matrix composite component and method of forming thereof
A method of forming a ceramic matrix composite component is provided. The method includes applying a first amount of adhesive across a surface of a release film, providing a first ceramic foam panel including a plurality of channels formed on a first side of the first ceramic foam panel, contacting the first ceramic foam panel and the release film such that adhesive transfers to the first side of the first ceramic foam panel, and coupling the first ceramic foam panel to a second ceramic foam panel.
METHOD FOR MANUFACTURING AN ACOUSTIC ATTENUATION PANEL MADE OF AN OXIDE CERAMIC-MATRIX COMPOSITE MATERIAL
A method for producing an acoustic attenuation panel from a composite material with a ceramic oxide matrix is provided that includes draping a plurality of plies having fibrous reinforcements including fibers of ceramic material in a mold to define a first skin, depositing blocks made of fugitive material on the first skin such that a space between two blocks is defined, and draping a second plurality of plies on a surface formed by the blocks such that a second skin is defined. Rounded corners of the blocks define radii for connecting the first and second skins with walls of a honeycomb core of the acoustic panel. The method further includes using a liquid medium to infiltrate the skins and spaces with a precursor of a ceramic phase, removing the liquid medium by evaporation or polymerization, and sintering to consolidate the ceramic oxide material and removal the fugitive material.
REFRACTORY ARTICLE AND METHOD OF FORMING
A refractory article can include a socket including a cavity that is configured to receive a post, a particulate material, and a binder. The binder is configured to bond the post to the socket. The refractory article can include a sleeve coupled to the socket and configured to bond the post to the socket. In an embodiment, the sleeve can bond to the binder. In another embodiment, a collar can be placed between the sleeve and the binder. The collar can be configured to bond the post to the socket. A method of forming a refractory article can include disposing a particulate material within a cavity of a socket and placing a binder material overlying the particulate material.
METHOD FOR INTEGRALLY BONDING A GLASS ELEMENT TO A SUPPORT ELEMENT, AND OPTICAL DEVICE
A method of integrally bonding a glass element to a support element, the method comprising a step of inserting at least one contact element into a contact recess in a surface of the support element. In addition, the method comprises a step of placing the glass element on a portion of the contact element which portion protrudes beyond the surface, and a step of locally heating the contact element in order to connect the glass element to the support element via the contact element. The method also comprises a step of coating at least a part of the contact recess with a separating layer prior to the step of insertion.
Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier
Top and bottom metal plates of a DMB panel stack are simultaneously direct-bonded to the central ceramic sheet in a single high-temperature step. During this step, the DMB panel rests on an array of very small upwardly projecting ceramic contacts of a ceramic carrier. An amount of unoxidized carbon (e.g., a layer of graphite) is disposed on each contact projection such that an amount of carbon is disposed between the top of the contact projection and the metal oxide skin of the bottom metal plate. The carbon bonds with oxygen from the metal oxide skin, thereby preventing connection or direct-bonding of the ceramic contact projection to the second metal plate. This reduces imperfections in the metal of the bottom plate and reduces the amount of ceramic particles bonded to metal at contact sites. As a result, less post-bonding processing is required to make a high quality DMB substrate.
Interconnected corrugated carbon-based network
An interconnected corrugated carbon-based network comprising a plurality of expanded and interconnected carbon layers is disclosed. In one embodiment, each of the expanded and interconnected carbon layers is made up of at least one corrugated carbon sheet that is one atom thick. In another embodiment, each of the expanded and interconnected carbon layers is made up of a plurality of corrugated carbon sheets that are each one atom thick. The interconnected corrugated carbon-based network is characterized by a high surface area with highly tunable electrical conductivity and electrochemical properties.
Assembly having at least two ceramic bodies joined with one another, especially a pressure measuring cell, and method for joining ceramic bodies by means of an active hard solder, or braze
An assembly comprising: two ceramic bodies, which are joined by means of a joint of an active hard solder, or braze, wherein the active hard solder, or braze, has a continuous core volume, which is spaced, in each case, from the ceramic bodies by at least 1 m, and an average composition C.sub.K with a liquidus temperature T.sub.l(C.sub.K), wherein the composition C.sub.K has a coefficient of thermal expansion (C.sub.K), wherein (C.sub.K)=m.Math.(K), wherein m1.5, especially m1.3 and preferably m1.2, wherein (K) is the average coefficient of thermal expansion of the ceramic material of the ceramic bodies, wherein the joint has boundary layers, which border on the ceramic body, wherein at least one of the boundary layers, which lies outside of the core volume, has an average composition C.sub.B with a liquidus temperature T.sub.l(C.sub.B), which lies not less than 50 K, preferably not less than 100 K, and especially preferably not less than 200 K, under the liquidus temperature T.sub.l(C.sub.K) of the average composition C.sub.K of the core volume.
Method of producing bonded body and method of producing power module substrate
A method of producing a bonded body is disclosed in which a ceramic member made of ceramics and a Cu member made of Cu or a Cu alloy are bonded to each other, the method including: a laminating step of laminating the ceramic member and the Cu member in a state where a CuP-based brazing filler material containing 3 mass % to 10 mass % of P and an active metal material are interposed therebetween; and a heating step of heating the ceramic member and the Cu member which are laminated.
Dual-walled ceramic matrix composite (CMC) component with integral cooling and method of making a CMC component with integral cooling
A dual-walled ceramic matrix composite (CMC) component comprises: a CMC core having a hollow shape enclosing at least one interior channel; and a CMC outer layer overlying and spaced apart from the CMC core by a ceramic slurry-cast architecture positioned therebetween. Each of the CMC core and the CMC outer layer comprises ceramic fibers in a ceramic matrix. The CMC core further includes a plurality of through-thickness inner cooling holes in fluid communication with the at least one interior channel. The ceramic slurry-cast architecture defines a cooling fluid path over an outer surface of the CMC core that connects the interior channel(s) to an external environment of the dual-walled CMC component. The CMC outer layer may also include a plurality of through-thickness outer cooling holes in fluid communication with the cooling fluid path, thereby extending the cooling fluid path through the CMC outer layer.