Patent classifications
C08F220/06
Modified resin for molded article and golf ball
The present invention is a modified resin for a molded article obtained by modifying an ethylene/unsaturated carboxylic acid copolymer with guanidine carbonate, wherein a melt flow rate of the ethylene/unsaturated carboxylic acid copolymer is 20 (g/10 minutes) or more and 600 (g/10 minutes) or less.
Modified resin for molded article and golf ball
The present invention is a modified resin for a molded article obtained by modifying an ethylene/unsaturated carboxylic acid copolymer with guanidine carbonate, wherein a melt flow rate of the ethylene/unsaturated carboxylic acid copolymer is 20 (g/10 minutes) or more and 600 (g/10 minutes) or less.
ANTI-BACTERIAL METALLO IONOMER POLYMER NANOCOMPOSITE POWDERS AND METHODS OF MAKING THE SAME
A composite powder includes a core particle comprising a styrene/acrylate polymer resin, and a shell comprising a styrene/acrylate ionomer resin, wherein the styrene/acrylate ionomer resin comprises a metal ion acrylate monomer, and methods of making thereof. Various articles can be manufactured from such composite powders.
ANTI-BACTERIAL METALLO IONOMER POLYMER NANOCOMPOSITE POWDERS AND METHODS OF MAKING THE SAME
A composite powder includes a core particle comprising a styrene/acrylate polymer resin, and a shell comprising a styrene/acrylate ionomer resin, wherein the styrene/acrylate ionomer resin comprises a metal ion acrylate monomer, and methods of making thereof. Various articles can be manufactured from such composite powders.
Inorganic nanoparticle-coated hollow particles, method for producing the same, and aqueous dispersion containing the hollow particles
Provided are hollow particles which are more excellent in heat resistance and dispersibility than ever before and which are lightweight. The hollow particles containing hollow resin particles having a surface covered with inorganic fine particles, wherein a volume average particle diameter of the hollow particles is from 0.1 μm to 9.0 μm, and a void ratio thereof is from 55% to 95%; wherein a repeating unit constituting the resin of the hollow resin particles contains a crosslinkable monomer unit, and a content of the crosslinkable monomer unit is from 25 to 100 parts by mass, with respect to 100 parts by mass of the resin; wherein a primary particle diameter of the inorganic fine particles is from 10 nm to 120 nm; and wherein the inorganic fine particles are contained at from 5 to 180 parts by mass, with respect to 100 parts by mass of the hollow resin particles.
Inorganic nanoparticle-coated hollow particles, method for producing the same, and aqueous dispersion containing the hollow particles
Provided are hollow particles which are more excellent in heat resistance and dispersibility than ever before and which are lightweight. The hollow particles containing hollow resin particles having a surface covered with inorganic fine particles, wherein a volume average particle diameter of the hollow particles is from 0.1 μm to 9.0 μm, and a void ratio thereof is from 55% to 95%; wherein a repeating unit constituting the resin of the hollow resin particles contains a crosslinkable monomer unit, and a content of the crosslinkable monomer unit is from 25 to 100 parts by mass, with respect to 100 parts by mass of the resin; wherein a primary particle diameter of the inorganic fine particles is from 10 nm to 120 nm; and wherein the inorganic fine particles are contained at from 5 to 180 parts by mass, with respect to 100 parts by mass of the hollow resin particles.
High molecular weight polymer with low insoluble gel content
Described herein are treated polymers comprising a polyacrylamide homopolymer or a copolymer thereof having at least 30 mol % acrylamide residue content and a weight average molecular weight in the range of 1×10.sup.5 g/mol to 1×10.sup.8 g/mol, and 0.1 wt % to 10 wt % of a C1-C6 alkyl ricinoleate based on the weight of the mixture of polymer and alkyl ricinoleate. The polymers are in powder form and include less than about 30 wt % water based on the powder weight. The treated polymer powders dissolve rapidly in water and develop very little or even no insoluble gel upon diluting with water, even when the water is produced water or connate. The treated polymer solutions are useful for in-the-field rapid dilution for applications such as papermaking, flocculation, beneficiation, wastewater treatment, and enhanced oil recovery.
High molecular weight polymer with low insoluble gel content
Described herein are treated polymers comprising a polyacrylamide homopolymer or a copolymer thereof having at least 30 mol % acrylamide residue content and a weight average molecular weight in the range of 1×10.sup.5 g/mol to 1×10.sup.8 g/mol, and 0.1 wt % to 10 wt % of a C1-C6 alkyl ricinoleate based on the weight of the mixture of polymer and alkyl ricinoleate. The polymers are in powder form and include less than about 30 wt % water based on the powder weight. The treated polymer powders dissolve rapidly in water and develop very little or even no insoluble gel upon diluting with water, even when the water is produced water or connate. The treated polymer solutions are useful for in-the-field rapid dilution for applications such as papermaking, flocculation, beneficiation, wastewater treatment, and enhanced oil recovery.
Mask-integrated surface protective tape
A mask-integrated surface protective tape, containing: a substrate film; a temporary-adhesive layer provided on the substrate film; and a mask material layer provided on the temporary-adhesive layer; wherein the mask material layer and the temporary-adhesive layer each contain a (meth)acrylic copolymer; and wherein the mask-integrated surface protective tape is used for a method of producing a semiconductor chip utilizing a plasma-dicing.
Mask-integrated surface protective tape
A mask-integrated surface protective tape, containing: a substrate film; a temporary-adhesive layer provided on the substrate film; and a mask material layer provided on the temporary-adhesive layer; wherein the mask material layer and the temporary-adhesive layer each contain a (meth)acrylic copolymer; and wherein the mask-integrated surface protective tape is used for a method of producing a semiconductor chip utilizing a plasma-dicing.