A resist composition including a base component and a fluorine additive component (F), the component (F) including a copolymer having a structural unit (f1) represented by general formula (f1-1) or (f1-2), and a structural unit (f2) represented by general formula (f2-1) (in formula (f1-1) and (f2-1), R represents a hydrogen atom or the like; at least one of Raf.sup.11 and Raf.sup.12, and at least one of Raf.sup.13 and Raf.sup.14 represents a hydrocarbon group substituted with a fluorine atom, and the total number of carbon atoms is 3 or more, provided that a hydrocarbon group forming a bridge structure is excluded; and the structural unit (f2) has a specific acid dissociable group containing an aliphatic cyclic group having no bridge structure

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A resist blend for additive manufacturing includes a radiopaque pre-polymer compound, a photoinitiator, a polymerization inhibitor, and a base pre-polymer. The radiopaque pre-polymer compound includes at least one of the following elements: iodine, bromine, tin, lead, or bismuth. The resist blend is configured to have a first portion of the resist blend to be polymerized and to have a second portion of the resist blend to be unpolymerized, wherein the second portion is removable.

Radiopaque polymer compositions and methods for making the compositions are provided. These radiopaque polymer compositions include polymer compositions comprising a crosslinked polymer network, the network comprising a first repeating unit derived from a monofunctional monomer and a second repeating unit derived from a multifunctional non-iodinated monomer wherein neither of the two monomers is fluorinated. Devices formed from radiopaque polymer compositions are also provided.

According to one embodiment, a method includes contacting a triiodobenzoic acid with an oxalyl chloride in a solvent whereby triiodobenzoyl chloride is formed, contacting diethanolamine with triiodobenzoyl chloride where triiodobenzoic diol amine is formed, and forming an acrylate of triiodobenzoic diol amine with acryloyl chloride where an organoiodine compound is formed. According to another embodiment, an optically clear photopolymer resist blend for additive manufacturing includes a radiopaque pre-polymer compound where the compound includes at least one of the following: iodine, bromine, tin, lead, or bismuth. The resist blend also includes a photoinitiator, a polymerization inhibitor, and a base pre-polymer.

The present invention relates to a photocurable resin composition usable in a nanoimprint process which is capable of overcoming low productivity of conventional semiconductor processes for optical devices and electronic devices, and a method of forming patterns using the same. Specifically, the present invention relates to a photocurable resin composition including a specific perfluorinated acrylic compound for improving release property between a nanoimprint mold and the photocurable resin composition, and a method of forming patterns using the same.

To provide a curable composition whereby it is possible to obtain a cured product having a high Abbe number and being excellent in transparency, crack resistance and releasability; and such a cured product. A curable composition comprises, in specific ratios, surface-modified metal oxide particles (A) having (meth)acryloyl-group-containing surface-modifying groups on the surface of the metal oxide particles, a compound (B) having a fluorine atom and at least one (meth)acryloyl group, a compound (C) having a urethane bond or OCH.sub.2CH(OH)CH.sub.2, having at least two (meth)acryloyl groups and having a mass-average molecular weight of at least 1,000, a compound (D) having no unsaturated bond-containing ring structure and having at least one (meth)acryloyl group, and a polymerization initiator (E).

To provide a curable composition whereby it is possible to obtain a cured product having a high Abbe number and being excellent in transparency, crack resistance and releasability; and such a cured product. A curable composition comprises, in specific ratios, surface-modified metal oxide particles (A) having (meth)acryloyl-group-containing surface-modifying groups on the surface of the metal oxide particles, a compound (B) having a fluorine atom and at least one (meth)acryloyl group, a compound (C) having a urethane bond or OCH.sub.2CH(OH)CH.sub.2, having at least two (meth)acryloyl groups and having a mass-average molecular weight of at least 1,000, a compound (D) having no unsaturated bond-containing ring structure and having at least one (meth)acryloyl group, and a polymerization initiator (E).

A resist composition comprising a base polymer and a sulfonium or iodonium salt capable of generating fluorobenzenesulfonic acid bonded to iodized benzoic acid offers a high sensitivity and minimal LWR independent of whether it is of positive or negative tone.

A resist composition comprising a base polymer and a sulfonium or iodonium salt capable of generating sulfonic acid bonded to iodized benzene ring offers a high sensitivity and minimal LWR independent of whether it is of positive or negative tone.

A resist composition comprising a base polymer and a quencher in the form of an iodonium salt capable of generating fluorobenzoic acid bonded to iodized benzene offers a high sensitivity and minimal LWR independent of whether it is of positive or negative tone.